Abstract: Embodiments of the present disclosure provide a flexible display substrate, a manufacturing method thereof and a flexible display device. The manufacturing method includes: forming a plurality of protrusions on a base substrate; forming a base film at one side of the plurality of protrusions facing away from the base substrate; forming a display structure at a surface of the base film facing away from the base substrate; peeling off the base film along with the display structure from the base substrate, and remaining the plurality of protrusions on the base substrate; and attaching the surface of the base film facing away from the display structure onto an elastic substrate and stretching the elastic substrate so that the base film is fractured at positions of the plurality of concaves.

Abstract: A display screen, a display device, a display circuit used for the display screen and a brightness compensation method therefor. The display screen (10) includes a normal display area (11) and a transparent display area (12). The display circuit (20) includes: a first pixel circuit (21), wherein the first pixel circuit is arranged at the normal display area; and a second pixel circuit (22), wherein the second pixel circuit is arranged at the transparent display area. The structure of the first pixel circuit is different from that of the second pixel circuit, so that the light transmittance of the transparent display area is higher than the light transmittance of the normal display area.

Abstract: Embodiments of the present disclosure relate to a transparent substrate, a method for preparing the same, and an OLED display device. A transparent substrate includes a first transparent film, and a second transparent film arranged on the first transparent film. An interface between the first transparent film and the second transparent film is provided with a light scattering structure.

Abstract: A display screen, a display device, a display circuit used for the display screen and a brightness compensation method therefor. The display screen (10) includes a normal display area (11) and a transparent display area (12). The display circuit (20) includes: a first pixel circuit (21), wherein the first pixel circuit is arranged at the normal display area; and a second pixel circuit (22), wherein the second pixel circuit is arranged at the transparent display area. The structure of the first pixel circuit is different from that of the second pixel circuit, so that the light transmittance of the transparent display area is higher than the light transmittance of the normal display area.

Abstract: This disclosure relates to a peeling method of a flexible substrate, and belongs to the technical field of flexible display. The method comprises the steps of: (a) forming a flexible substrate on a base substrate, wherein the flexible substrate has a plane area less than that of the base substrate; (b) adhering a protective film on the base substrate formed with the flexible substrate by an ultraviolet viscosity-reducing adhesive, wherein the plane area of the flexible substrate is less than that of the protective film, and the protective film is further adhered to the base substrate by the ultraviolet viscosity-reducing adhesive; (c) irradiating a region on the base substrate covered by the protective film through the base substrate with an ultraviolet light; and (d) peeling the protective film and the flexible substrate from the base substrate after the irradiation with an ultraviolet light is completed.

Abstract: Embodiments of the present disclosure provide a flexible display substrate, a manufacturing method thereof and a flexible display device. The manufacturing method includes: forming a plurality of protrusions on a base substrate; forming a base film at one side of the plurality of protrusions facing away from the base substrate; forming a display structure at a surface of the base film facing away from the base substrate; peeling off the base film along with the display structure from the base substrate, and remaining the plurality of protrusions on the base substrate; and attaching the surface of the base film facing away from the display structure onto an elastic substrate and stretching the elastic substrate so that the base film is fractured at positions of the plurality of concaves.

Abstract: A display substrate and a manufacturing method therefor, and a display device. The display substrate includes a flexible protective layer and sub-pixel structures. The flexible protective layer includes bosses, the sub-pixel structure is provided on a top surface of the boss, the boss further includes multiple side surfaces intersecting with the top surface, and the display substrate further includes secondary sub-pixel structures provided on at least one of the multiple side surfaces.

Abstract: A substrate and a display device. The substrate includes: a hole region including a plurality of holes penetrating the substrate; and a non-hole region including a plurality of connection portions and a plurality of pixel regions separated from each other. Each connection portion is between adjacent pixel regions to connect the adjacent pixel regions, wherein a straight line in any direction parallel to the substrate passes through the hole region.

Abstract: A display screen, a display device, a display circuit used for the display screen and a brightness compensation method therefor. The display screen (10) includes a normal display area (11) and a transparent display area (12). The display circuit (20) includes: a first pixel circuit (21), wherein the first pixel circuit is arranged at the normal display area; and a second pixel circuit (22), wherein the second pixel circuit is arranged at the transparent display area. The structure of the first pixel circuit is different from that of the second pixel circuit, so that the light transmittance of the transparent display area is higher than the light transmittance of the normal display area.

Abstract: A base carrier configured to carry a flexible base of a flexible display panel is provided. The flexible display panel includes a display region and a circuit bonding region. A surface of an area of the base carrier corresponding to the display region is smooth, and a surface of an area of the base carrier corresponding to the circuit bonding region is formed with a plurality of micro-grooves. The structure of the base carrier is such that when the flexible base is separated from the base carrier, the amount of laser required for peeling in each of the display region and the circuit bonding region are the same and such that the base carrier can be separated from the flexible display panel by performing the laser scanning once, which simplifies the processes.

Abstract: A method for manufacturing a flexible substrate, a flexible substrate manufactured using the method and a display device including the flexible substrate are disclosed. The method includes steps of: coating a glass carrier with a plurality of film layers, wherein each of at least one pair of adjacent film layers of the plurality of film layers is formed through steps of: S1: coating the glass carrier with a first film layer; and S2: coating the glass carrier with a second film layer over the first film layer so that the second film layer covers the first film layer, wherein the second film layer has an area greater than an area of the first film layer; and peeling off the plurality of formed film layers from the glass carrier to form a flexible substrate.

Abstract: Methods for manufacturing a flexible display device are provided. A flexible substrate is provided and a first bonding pattern, which encloses a display area, is formed on the flexible substrate. A second bonding pattern is formed on a rigid substrate. The first and second bonding patterns are bonded together to provide a bonding pattern between the flexible substrate and the rigid substrate. At least one display device is formed on the display area of the flexible substrate. The bonding pattern is removed by a cutting process performed so as to separate the flexible substrate having the display device thereon from the rigid substrate.

Abstract: This disclosure relates to a peeling method of a flexible substrate, and belongs to the technical field of flexible display. The method comprises the steps of: (a) forming a flexible substrate on a base substrate, wherein the flexible substrate has a plane area less than that of the base substrate; (b) adhering a protective film on the base substrate formed with the flexible substrate by an ultraviolet viscosity-reducing adhesive, wherein the plane area of the flexible substrate is less than that of the protective film, and the protective film is further adhered to the base substrate by the ultraviolet viscosity-reducing adhesive; (c) irradiating a region on the base substrate covered by the protective film through the base substrate with an ultraviolet light; and (d) peeling the protective film and the flexible substrate from the base substrate after the irradiation with an ultraviolet light is completed.

Abstract: A method for fabricating a flexible device is provided. The method includes forming a sacrificial layer on a substrate; and forming a reflective layer to reflect a laser for subsequently de-bonding the sacrificial layer from the rigid substrate back to the sacrificial layer to reduce required de-bonding energy of the laser over at least a portion of the rigid substrate. Further, the method includes forming a flexible device over the reflective layer; and separating the substrate from the sacrificial layer by irradiating the sacrificial layer using the laser.

Abstract: A method for manufacturing a flexible substrate, a flexible substrate manufactured using the method and a display device including the flexible substrate are disclosed. The method includes steps of: coating a glass carrier with a plurality of film layers, wherein each of at least one pair of adjacent film layers of the plurality of film layers is formed through steps of: S1: coating the glass carrier with a first film layer; and S2: coating the glass carrier with a second film layer over the first film layer so that the second film layer covers the first film layer, wherein the second film layer has an area greater than an area of the first film layer; and peeling off the plurality of formed film layers from the glass carrier to form a flexible substrate.

Abstract: An optical fingerprint sensor package includes a carrier, at least one image sensor, at least one LED and at least one non light-transmitting compound. The carrier is provided with pads thereon. The image sensor is mounted on the carrier and electrically connected with the pads. The LED flip-chip is mounted on the carrier through first solder bumps and mounted at an outer side of the image sensor. The non light-transmitting compound surrounds a sidewall of the LED to expose a top surface of the LED.

Abstract: Disclosed is a flexible display substrate and a method for manufacturing the same which can avoid break and peeling of film layers disposed on a flexible base and further reduce degree of a warpage occurred in the flexible base when separating the support substrate from the flexible base located above the support substrate. The flexible display substrate comprises the flexible base, a first buffer layer and a second buffer layer disposed on an upper surface and a lower surface of the flexible base, respectively, a plurality of display modules disposed on the first buffer layer, each display module includes at least one thin film transistor and at least one electrode corresponding to the thin film transistor, and a plurality of auxiliary thin film transistors disposed on one side of the second buffer layer which is away from the flexible base, the auxiliary thin film transistors corresponding to the thin film transistors one by one, respectively.

Abstract: A base carrier configured to carry a flexible base of a flexible display panel is provided. The flexible display panel includes a display region and a circuit bonding region. A surface of an area of the base carrier corresponding to the display region is smooth, and a surface of an area of the base carrier corresponding to the circuit bonding region is formed with a plurality of micro-grooves. The structure of the base carrier is such that when the flexible base is separated from the base carrier, the amount of laser required for peeling in each of the display region and the circuit bonding region are the same and such that the base carrier can be separated from the flexible display panel by performing the laser scanning once, which simplifies the processes.

Abstract: The present disclosure provides a method for fabricating a display substrate for a display panel. The method includes providing a flexible organic light-emitting diode (flexible OLED) substrate with a thin-film transistor (TFT) layer on the flexible OLED substrate and a patterned adhesive layer on the TFT layer, wherein the TFT layer includes at least one testing area; providing a barrier film (BF) with a patterned laser barrier layer on a surface of the BF, the surface of the BF facing the TFT layer; and bonding the BF onto the flexible OLED substrate such that at least a portion of the patterned laser barrier corresponds to the at least one testing area. The method also includes irradiating a laser beam along a cutting line on the BF to remove a first portion of the BF.

Abstract: Methods for manufacturing a flexible display device are provided. A flexible substrate is provided and a first bonding pattern, which encloses a display area, is formed on the flexible substrate. A second bonding pattern is formed on a rigid substrate. The first and second bonding patterns are bonded together to provide a bonding pattern between the flexible substrate and the rigid substrate. At least one display device is formed on the display area of the flexible substrate. The bonding pattern is removed by a cutting process performed so as to separate the flexible substrate having the display device thereon from the rigid substrate.