Abstract: A semiconductor device has a semiconductor wafer and a first conductive layer formed over the semiconductor wafer as contact pads. A first insulating layer formed over the first conductive layer. A second conductive layer including an interconnect site is formed over the first conductive layer and first insulating layer. The second conductive layer is formed as a redistribution layer. A second insulating layer is formed over the second conductive layer. An opening is formed in the second insulating layer over the interconnect site. The opening extends to the first insulating layer in an area adjacent to the interconnect site. Alternatively, the opening extends partially through the second insulating layer in an area adjacent to the interconnect site. An interconnect structure is formed within the opening over the interconnect site and over a side surface of the second conductive layer. The semiconductor wafer is singulated into individual semiconductor die.

Abstract: Provided is a simplified input device, having a display module connected with a processing module. When the processing module receives a confirming command produced by an input module, the processing module loads a selected symbol. When the selected symbol is a typographical symbol, the processing module displays the selected symbol on a position of an input cursor. When the selected symbol is an input cursor moving symbol, the processing module moves the position of the input cursor corresponding to the selected symbol. Therefore, a user types letters, and moves the input cursor to a position of a wrong letter to input another letter for quickly correcting the wrong letter. Further, a connecting module receives typographical symbol setting data to update the language of the typographical symbols. The language is not limited by a manufacturer of the simplified input device and enhanced convenience in use is provided.

Abstract: A semiconductor device has a semiconductor wafer and a first conductive layer formed over the semiconductor wafer as contact pads. A first insulating layer formed over the first conductive layer. A second conductive layer including an interconnect site is formed over the first conductive layer and first insulating layer. The second conductive layer is formed as a redistribution layer. A second insulating layer is formed over the second conductive layer. An opening is formed in the second insulating layer over the interconnect site. The opening extends to the first insulating layer in an area adjacent to the interconnect site. Alternatively, the opening extends partially through the second insulating layer in an area adjacent to the interconnect site. An interconnect structure is formed within the opening over the interconnect site and over a side surface of the second conductive layer. The semiconductor wafer is singulated into individual semiconductor die.

Abstract: A method for fabricating a flexible device is provided. The method includes forming a sacrificial layer on a substrate; and forming a reflective layer to reflect a laser for subsequently de-bonding the sacrificial layer from the rigid substrate back to the sacrificial layer to reduce required de-bonding energy of the laser over at least a portion of the rigid substrate. Further, the method includes forming a flexible device over the reflective layer; and separating the substrate from the sacrificial layer by irradiating the sacrificial layer using the laser.

Abstract: A flexible display panel comprises a display element (100) and a drive unit (50) disposed on a first surface (A) of a flexible base (20) and a supporting substrate (200) disposed on a second surface (B), opposite to the first surface (A), of the flexible base (20). The position of the supporting substrate (200) corresponds to a bonding position (C) of the drive unit (50). The flexible display panel can avoid a bonding alignment deviation caused by a deformation of the flexible display panel during a bonding process.

Abstract: A method for manufacturing a flexible display panel and the flexible display device are disclosed. The method for manufacturing the flexible display panel includes: forming a substrate, a flexible display and an overcoat layer on a support substrate in sequence; flipping over so that one side provided with the support substrate is placed upward; stripping off the support substrate; coating a curable material on a surface obtained after the support substrate is stripped off; and performing a curing process so that the coated curable material is cured to form a protective film. The method for manufacturing the flexible display panel can form the protective film without adopting laminating/bonding devices, is simple and easy, and does not require the vacuum defoamation process subsequently.

Abstract: Disclosed is a flexible display substrate and a method for manufacturing the same which can avoid break and peeling of film layers disposed on a flexible base and further reduce degree of a warpage occurred in the flexible base when separating the support substrate from the flexible base located above the support substrate . The flexible display substrate comprises the flexible base, a first buffer layer and a second buffer layer disposed on an upper surface and a lower surface of the flexible base, respectively, a plurality of display modules disposed on the first buffer layer, each display module includes at least one thin film transistor and at least one electrode corresponding to the thin film transistor, and a plurality of auxiliary thin film transistors disposed on one side of the second buffer layer which is away from the flexible base, the auxiliary thin film transistors corresponding to the thin film transistors one by one, respectively.

Abstract: Disclosed are an OLED display apparatus and a method for preparing the same. The OLED display apparatus includes a flexible substrate, an array layer disposed on the flexible substrate, an organic light-emitting layer disposed on the array layer, a package layer disposed on the organic light-emitting layer, and a base film disposed on a side of the flexible substrate facing away from the array layer, a plurality of protruded microstructures being provided on the side of the flexible substrate facing away from the array layer.

Abstract: A flexible display substrate mother board and a method of manufacturing a flexible display substrate are provided. The method includes: forming a heating pattern layer on a support substrate, wherein the heating pattern layer includes a plurality of regional blocks spaced apart from each other; forming a flexible substrate on the substrate provided with the heating pattern layer, and forming display elements on the flexible substrate; and heating the flexible substrate by utilization of the heating pattern layer, cutting the flexible substrate, stripping the flexible substrate corresponding to the regional block from the support substrate, and forming flexible display substrates. The method can avoid the damage of the display elements on the flexible substrate when the flexible substrate and the support substrate are separated from each other, and avoid uneven separation.

Abstract: A motherboard of flexible display panel and the method for manufacturing the flexible display panel are provided, the motherboard of flexible display panel includes a carrier substrate and at least one flexible display panel unit formed on the carrier substrate; the flexible display panel unit includes a liner layer, a flexible substrate and a display element; the liner layer includes a first zone and a second zone, the liner layer of the first zone has a laser absorptivity lower than that of the liner layer of the second zone, and the liner layer of the second zone has a critical energy no larger than that of the liner layer of the first zone; the first zone is located at the edge region of the flexible display panel unit.

Abstract: Disclosed is a flexible display substrate and a method for manufacturing the same which can avoid break and peeling of film layers disposed on a flexible base and further reduce degree of a warpage occurred in the flexible base when separating the support substrate from the flexible base located above the support substrate. The flexible display substrate comprises the flexible base, a first buffer layer and a second buffer layer disposed on an upper surface and a lower surface of the flexible base, respectively, and a plurality of display modules disposed on the first buffer layer, each display module includes at least one thin film transistor and at least one electrode corresponding to the thin film transistor.

Abstract: The present invention discloses a splicing type electret loudspeaker. The splicing type electret loudspeaker may comprise a plurality of electret loudspeaker units. Each electret loudspeaker unit may comprise a plurality of connection ports, and these connection ports may be disposed around the edge of each electret loudspeaker unit. In particular, the connection ports of each electret loudspeaker unit can respectively connect to one of the connection ports of another electret loudspeaker unit; in this way, these electret loudspeaker units can connect to each other in parallel, such that the power input signal and the audio input signal can be transmitted to all electret loudspeaker units to drive them.

Abstract: A motherboard of flexible display panel and the method for manufacturing the flexible display panel are provided, the motherboard of flexible display panel includes a carrier substrate and at least one flexible display panel unit formed on the carrier substrate; the flexible display panel unit includes a liner layer, a flexible substrate and a display element; the liner layer includes a first zone and a second zone, the liner layer of the first zone has a laser absorptivity lower than that of the liner layer of the second zone, and the liner layer of the second zone has a critical energy no larger than that of the liner layer of the first zone; the first zone is located at the edge region of the flexible display panel unit.

Abstract: A flexible display panel comprises a display element (100) and a drive unit (50) disposed on a first surface (A) of a flexible base (20) and a supporting substrate (200) disposed on a second surface (B), opposite to the first surface (A), of the flexible base (20). The position of the supporting substrate (200) corresponds to a bonding position (C) of the drive unit (50). The flexible display panel can avoid a bonding alignment deviation caused by a deformation of the flexible display panel during a bonding process.

Abstract: A method for manufacturing a flexible display device and the flexible display device are disclosed. The method includes: forming a sacrifice layer on a base substrate; forming a flexible substrate on the sacrifice layer; forming components of the flexible display device on the flexible substrate; irradiating the sacrifice layer with laser to separate the base substrate from the flexible substrate; and coating a material used to make a protection layer on the flexible display device by a melted extrusion method for multiple times and cooling the material to form the protection layer. As a melted-extruding and coating method is applied to form the protection layer, pressure on components inside the flexible display device is reduced. Therefore, potential damage on the components inside the flexible display device is reduced and creation of air bubbles between film layers is avoided.

Abstract: A flexible display panel includes a first flexible substrate, a second flexible substrate, a display medium, and a sealant. The first flexible substrate has a plurality of non-folding areas and at least one folding area located between the non-folding areas. The non-folding areas are separated. The second flexible substrate is configured above the first flexible substrate. The display medium is configured between the first flexible substrate and the second flexible substrate. The sealant is configured on the first flexible substrate to surround the display medium. The elasticity of the sealant in the folding area is greater than the elasticity of the sealant in the non-folding areas.

Abstract: The present invention discloses a splicing type electret loudspeaker. The splicing type electret loudspeaker may comprise a plurality of electret loudspeaker units. Each electret loudspeaker unit may comprise a plurality of connection ports, and these connection ports may be disposed around the edge of each electret loudspeaker unit. In particular, the connection ports of each electret loudspeaker unit can respectively connect to one of the connection ports of another electret loudspeaker unit; in this way, these electret loudspeaker units can connect to each other in parallel, such that the power input signal and the audio input signal can be transmitted to all electret loudspeaker units to drive them.

Abstract: A method for manufacturing a flexible display panel and the flexible display device are disclosed. The method for manufacturing the flexible display panel includes: forming a substrate, a flexible display and an overcoat layer on a support substrate in sequence; flipping over so that one side provided with the support substrate is placed upward; stripping off the support substrate; coating a curable material on a surface obtained after the support substrate is stripped off; and performing a curing process so that the coated curable material is cured to form a protective film. The method for manufacturing the flexible display panel can form the protective film without adopting laminating/bonding devices, is simple and easy, and does not require the vacuum defoamation process subsequently.

Abstract: A semiconductor device has a substrate. A first conductive layer is formed over the substrate. A first insulating layer is formed over the substrate. A second insulating layer is formed over the first insulating layer. A second conductive layer is formed over the second insulating layer. The second insulating layer is formed to include a cylindrical shape. The second conductive layer is formed as an under bump metallization layer. A first opening is formed in the second insulating layer. A second opening is formed in the second insulating layer around the first opening in the second insulating layer. An opening is formed in the first insulating layer over the first conductive layer. An opening is formed in the second insulating layer over the first conductive layer with the opening of the first insulating layer being greater than the opening of the second insulating layer.

Abstract: A flexible display substrate mother board and a method of manufacturing a flexible display substrate are provided. The method includes: forming a heating pattern layer on a support substrate, wherein the heating pattern layer includes a plurality of regional blocks spaced apart from each other; forming a flexible substrate on the substrate provided with the heating pattern layer, and forming display elements on the flexible substrate; and heating the flexible substrate by utilization of the heating pattern layer, cutting the flexible substrate, stripping the flexible substrate corresponding to the regional block from the support substrate, and forming flexible display substrates. The method can avoid the damage of the display elements on the flexible substrate when the flexible substrate and the support substrate are separated from each other, and avoid uneven separation.