Abstract: A stacked-chip packaging structure includes chip sets, a heat sink, a substrate, a circuit board, and solder balls. The chip sets are stacked together, each of which has a heat-dissipation structure and a chip. The heat-dissipation structure has a chip recess, through holes arranged in the chip recess, and an extending portion extending from the chip recess. The chip disposed in the chip recess has bumps. Each bump on the chip is correspondingly disposed in one of the through holes of the heat-dissipation structure. The extending portion of the heat-dissipation structure of each chip set contacts that of the neighboring chip set. The heat sink and the substrate are disposed at two opposite sides of the chip sets, respectively. The circuit board is below the substrate. The solder balls are between the circuit board and the substrate.

Abstract: A thermoelectric conversion device includes a hot terminal substrate, a cold terminal substrate and a stacked structure. The stacked structure is disposed between the hot terminal substrate and the cold terminal substrate. The stacked structure includes thermoelectric conversion layers each including a thermoelectric couple layer, a first conductive layer and a second conductive layer, a first heat-conductive and electrically insulating structure and a second heat-conductive and electrically insulating structure. Each of the thermoelectric conversion layers is arranged in the stacked structure. The first conductive layer includes first conductive materials and is arranged on tops of P/N type thermoelectric conversion elements. The second conductive layer includes second conductive materials and is arranged on bottoms of the P/N type thermoelectric conversion elements. The first heat-conductive and electrically insulating structure is connected between two adjacent first conductive layers.

Abstract: A touch panel including a first substrate, a second substrate, a sealant, a liquid crystal layer, a main spacer, a first sensing spacer, a second sensing spacer, a first opposite electrode and a second opposite electrode is provided. The first substrate has a central area and a peripheral area. The second substrate is disposed opposite to the first substrate. The first sensing spacer is disposed on the central area and between the first and the second substrates. The second sensing spacer is disposed on the peripheral area and between the first and the second substrates. There's a first sensing gap between the first sensing spacer and the first opposite electrode disposed corresponding to the first sensing spacer. There's a second sensing gap between the second sensing spacer and the second opposite electrode disposed corresponding to the second sensing spacer. The first sensing gap is larger than the second sensing gap.

Abstract: An liquid crystal display panel includes a first substrate, a second substrate, a liquid crystal layer disposed between the first and second substrates, a patterned black matrix layer disposed on the surface of the first substrate, a patterned first color filter layer disposed on the first substrate having a protruding portion that covers a portion of the patterned black matrix layer, a plurality of first ball spacers disposed on the surface of the patterned black matrix layer, and a plurality second ball spacers disposed on the surface of the protruding portion of the patterned first color filter layer. The bottom surfaces of the second ball spacers and the bottom surfaces of the first ball spacers respectively are disposed on different planes in the liquid crystal display panel.

Abstract: A display panel includes a first substrate, a second substrate, a sealant, a plurality of spacers, and a display medium layer. The first substrate has a pixel array and a peripheral circuit. The sealant, the spacers, and the display medium layer are disposed between the first and the second substrate. The pixel array is surrounded by the sealant and located on a portion of the peripheral circuit. A multi-layer conductive wiring structure is disposed in the region of the peripheral circuit covered with the sealant. The multi-layer conductive wiring structure includes first and second conductive wirings. The second conductive wirings are connected to the pixel array via the first conductive wirings. An extending direction of the first conductive wirings is substantially different from that of the second conductive wirings. The spacers are distributed at two opposite sides of the sealant and respectively located between two adjacent first conductive wirings.

Abstract: A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias electrically connected to the connecting circuit, and the substrate has a chip disposing region. The chip is disposed on the chip disposing region of the substrate and electrically connected to the signal vias through the connecting circuit. The thermal conductive layer is disposed over the substrate, connected to the first thermal conductive vias, and located above the chip disposing region. Besides, the thermal conductive layer has first openings exposing the signal vias. The signal contacts are respectively disposed in the first openings and connected to the signal vias. The molding compound encapsulates the chip.

Abstract: A liquid crystal panel structure and a method for manufacturing the same are disclosed. The liquid crystal panel structure comprises a first substrate, a second substrate, a plurality of ball spacers, and a positioning structure. The second substrate is assembled parallel to the first substrate, and a gap is formed therebetween. The ball spacers are disposed in the gap to space the first substrate and the second substrate. The positioning structure is formed on one of the substrates and has a side collecting portion such that the ball spacers are moved to be located therein. The method for manufacturing the liquid crystal panel structure is to drop a solution which contains the ball spacers on the first substrate or the second substrate. Then, the ball spacers are positioned in the positioning structure after the solution is vaporized and a proper gap between the first and the second substrate is formed accordingly after assembly.

Abstract: A sun shield assembly includes a case having a mandrel received therein and a fabric is wrapped around the mandrel. The case is fixed on a top of a vehicle by first suction members and the fabric is connected to a pull rod which has second suction members. The fabric can be pulled out from the case and fixed to the body of the vehicle to cover the vehicle so that the vehicle is not directly exposed under the sun. A separation member has a slit through which the fabric extends so as to define a gap between the body of the fabric and the fabric.