Abstract: A color correction method is applied to an image correction apparatus having an image sensor, and includes searching a color deviation area within a detection image, analyzing the detection image to estimate a correction color value of the color deviation area, and calibrating the color deviation area by the correction color value to generate a calibrated detection image without color deviation.

Abstract: A method of defining a pattern includes forming a plurality of cut shapes and a first plurality of openings within a first layer of a multi-layer hard mask to expose first portions of the second layer. A plurality of etch stops is formed by implanting an etch rate modifying species in a portion of the plurality of cut shapes. The first layer is directionally etched at the plurality of cut shapes such that the plurality of etch stops remain. A spacer layer is formed on the first layer and the first portions. A second plurality of openings is formed within the spacer layer to expose second portions of the second layer. The spacer layer is directionally etched to remove the spacer layer from sidewalls of the plurality of etch stops. Portions of the second layer exposed through the first plurality of openings and the second plurality of openings are etched.

Abstract: A device includes a first cell, a second cell, and first isolation portions. The second cell is adjacent the first cell. The first and second cells are arranged in a first direction, and the first cell includes first and second conductive structures. The first conductive structures extend in the first direction. Each of the first conductive structures has a first end facing the second cell. The second conductive structures extend in the first direction. The first and second conductive structures are alternately arranged in a second direction different from the first direction. The first isolation portions are respectively abutting the first ends of the first conductive structures. Two of the first isolation portions are misaligned with each other in the second direction.

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

Abstract: The present disclosure provides high strength, self-ligating appliances with orthodontically desirable dimensions. The appliances of the present disclosure incorporate a door slidably engaged to a channel in the body; one that can be opened or closed depending on the equilibrium position of an integral protrusion on the door. Cooperating grooves and rails on the body and the door can guide the door between the open and closed positions, and mitigate against unintentional detachment.

Abstract: An air-cooling fuel cell stack includes fuel cells, wherein each of the fuel cells includes an anode bipolar plate, a cathode bipolar plate, a membrane electrode assembly (MEA) between the anode and cathode bipolar plates, and an anode sealing member. The MEA includes an anode side structure, a cathode side structure, and an ion conductive membrane (ICM), and the ICM is sandwiched between the anode side structure and the cathode side structure. The anode sealing member is disposed at a periphery of the anode side structure and sandwiched by the anode bipolar plate and the ICM. The anode sealing member includes a first sealing material and a second sealing material, a Shore hardness of the first sealing material is different from that of the second sealing material, and an arrangement direction of the first and second sealing materials is perpendicular to a compression direction of the plurality of fuel cells.

Abstract: A system that generates a layout diagram has a processor that implements a method, the method including: generating first and second conductor shapes; generating first, second and third cap shapes correspondingly over the first and second conductor shapes; arranging a corresponding one of the second conductor shapes to be interspersed between each pair of neighboring ones of the first conductor shapes; generating first cut patterns over selected portions of corresponding ones of the first cap shapes; and generating second cut patterns over selected portions of corresponding ones of the second cap shapes. In some circumstances, the first cut patterns are designated as selective for a first etch sensitivity corresponding to the first cap shapes; and the second cut patterns are designated as selective for a second etch sensitivity corresponding to the second cap shapes.

Abstract: A dual sensor imaging system and a privacy protection imaging method thereof are provided. The system is configured to control at least one color sensor and at least one IR sensor to respectively capture multiple color images and multiple IR images by adopting multiple exposure conditions adapted for an imaging scene, adaptively select a combination of the color image and the IR image that can reveal details of the imaging scene, detect a feature area with features of a target of interest in the color image, and fuse the color image and the IR image to generate a fusion image with the details of the imaging scene, and crop an image of the feature area of the fusion image to be replaced with an image not belonging to the IR image, so as to generate a scene image.

Abstract: The subject invention pertains to methods and compositions to stabilize antibodies for deep immunolabeling and tissue imaging. The antibodies can be stabilized with the addition of antigen-binding fragments of immunoglobulins and cross-linkers and incubated in appropriate buffered conditions.

Abstract: An electric connector includes a housing, at least one terminal, and at least two elastic members, the housing has at least one through hole, the at least one terminal is located at the at least one through hole and includes two arm parts, the at least two elastic members are clamped by the two arm parts and an inner wall forming the at least one through hole.

Abstract: Provided are DNA-barcoding reagents, DNA-barcoded antibodies, and methods of using DNA-barcoding reagents, and DNA-barcoded antibodies. The DNA-barcoding reagents comprise an affinity moiety that is specific towards antibodies, and covalently linked to one or more DNA sequences, optionally, by a linker. Also provided are methods of using the DNA-barcoded antibodies, for example, multiplexed tissue antigen imaging and profiling, multiplexed biomolecule detection, and affinity purification and sorting of marker-positive cells.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.

Abstract: A method is provided, including the following operations: arranging a first gate structure extending continuously above a first active region and a second active region of a substrate; arranging a first separation spacer disposed on the first gate structure to isolate an electronic signal transmitted through a first gate via and a second gate via that are disposed on the first gate structure, wherein the first gate via and the second gate via are arranged above the first active region and the second active region respectively; and arranging a first local interconnect between the first active region and the second active region, wherein the first local interconnect is electrically coupled to a first contact disposed on the first active region and a second contact disposed on the second active region.

Abstract: A remote releasing module includes a bracket, a toggle button, and a moving member. The bracket includes a first end portion and a second end portion away from each other. The toggle button is pivotally connected to the first end portion of the bracket and includes a first driving portion. The moving member is movably disposed on the bracket and extends from a position close to the first end portion to the second end portion. The moving member includes a second driving portion disposed on the first driving portion so as to drive the toggle button to move. A circuit board device including a circuit board body, a connector slot, and the remote releasing module is also provided. The connector slot is disposed on the circuit board body.

Abstract: Examples of an exercise mat and methods for making same are disclosed. The exercise mat comprises a top layer, at least two textured gripping zones formed on an upper surface of the top layer and a bottom layer joined to the top layer. A second textured gripping zone of the at least two textured gripping zones may be formed closer to one or more mat edges of the exercise mat, and has a friction level that is greater than a friction level of a first textured gripping zone of the at least two textured gripping zones, when a body is in sliding contact with the at least two textured gripping zones of the upper surface of the top layer.

Abstract: A circuit board module including a circuit board body, a connector, and a release component is provided. The connector is disposed on the circuit board body and includes a base body and a rotating button rotatably disposed on the base body. The release component is disposed on the circuit board body and includes a linking member. The linking member is movably disposed beside the rotating button and does not contact the rotating button under normal conditions. When an external force triggers the release component, the linking member is driven to contact the rotating button, so that the rotating button rotates relative to the base body. In addition, a release component is also mentioned.

Abstract: A circuit board module includes a circuit board body, a connector, a press button, a bracket, and a linkage. The connector includes a base and a rotating button rotatably disposed on the base. The press button is located away from the connector. The bracket includes a first limiting portion. The linkage is located between the rotating button and the press button and includes a second limiting portion corresponding to the first limiting portion, a first segment, and a second segment linked to the first segment. The first segment extends along a first axis and is linked to the rotating button. The second segment extends along a second axis and is linked to the press button. One of the second limiting portion and the first limiting portion extends along the first axis. The first segment is movably disposed on the bracket along the first axis.

Abstract: An oxide semiconductor field effect transistor (OSFET) includes a first insulating layer, a source, a drain, a U-shaped channel layer and a metal gate. The first insulating layer is disposed on a substrate. The source and the drain are disposed in the first insulating layer. The U-shaped channel layer is sandwiched by the source and the drain. The metal gate is disposed on the U-shaped channel layer, wherein the U-shaped channel layer includes at least an oxide semiconductor layer. The present invention also provides a method for forming said oxide semiconductor field effect transistor.

Abstract: The present disclosure provides high strength, self-ligating appliances with orthodontically desirable dimensions. The appliances of the present disclosure incorporate a door slidably engaged to a channel in the body; one that can be opened or closed depending on the equilibrium position of an integral protrusion on the door. Cooperating grooves and rails on the body and the door can guide the door between the open and closed positions and mitigate against unintentional detachment.