Patents by Inventor Ming Li

Ming Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119625
    Abstract: A method and system of automatically estimating a ball carrier in team sports.
    Type: Application
    Filed: June 16, 2021
    Publication date: April 11, 2024
    Applicant: Intel Corporation
    Inventors: Ming Lu, Liwei Liao, Haihua Lin, Xiaofeng Tong, Wenlong Li, Jiansheng Chen, Yiwei He
  • Publication number: 20240121030
    Abstract: A communication method and a communication apparatus. The method includes a first device sends a management frame, where the management frame includes a first bitmap, and a first puncturing pattern indicated by the first bitmap is a puncturing pattern not supported by non-orthogonal frequency division multiple access (non-OFDMA) transmission, and the first device sends a physical layer protocol data unit (PPDU) based on a second puncturing pattern corresponding to the first bitmap, where the second puncturing pattern is a puncturing pattern supported by the non-OFDMA transmission.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Inventors: Jian Yu, Yunbo Li, Ming Gan
  • Patent number: 11952390
    Abstract: Provided are a phosphorescent organometallic complex and a use thereof. The metal complex has a ligand with a structure represented by Formula 1 and may be used as a light-emitting material in an electroluminescent device. These novel metal complexes can not only maintain low voltage and improve device efficiency in electroluminescent devices but also greatly reduce the half-peak width of light emitted by these devices so as to greatly improve color saturation of the light emitted by these devices, thereby providing better device performance. Further provided are an electroluminescent device and a compound formulation.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: April 9, 2024
    Assignee: Beijing Summer Sprout Technology Co., Ltd.
    Inventors: Wei Cai, Ming Sang, Chi Yuen Raymond Kwong, Chuanjun Xia, Zhen Wang, Tao Wang, Hongbo Li
  • Patent number: 11956839
    Abstract: The present disclosure relates to an information transmitting method and apparatus, and a terminal and a storage medium. The method includes: a first terminal receives target information sent by a second terminal on a target channel through a direct-connect communication interface for transmitting a V2X service; the first terminal obtains measurement information corresponding to the target information, wherein the measurement information comprises the measurement position and a measurement value; the measurement position is used to indicate the time-frequency position occupied by the target information, and the measurement value is used to indicate the channel quality of the target channel; and the first terminal sends the measurement information to the second terminal.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: April 9, 2024
    Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Yuanyuan Li, Ming Zhang
  • Patent number: 11955317
    Abstract: A radio frequency (RF) match assembly for a chemical vapor deposition processing chamber. The assembly includes a top electrically insulating column and a bottom electrically insulating column. The assembly further includes a one-piece RF match strap that has a head, a main body and a body extension. The main body of the one-piece RF match strap is configured to extend through the top electrically insulating column and the bottom electrically insulating column. A flexible chamber lid strap connects the processing chamber to the top of the one piece RF match strap.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Sze Chen, Yu Li Wang, Yin-Tun Chou, Yuan-Hsin Chi, Sheng-Yuan Lin
  • Patent number: 11952582
    Abstract: Provided are a mutant HPPD polypeptide having high resistance to a herbicide and an encoding gene thereof, and an application thereof in an improved plant. The amino acid at position 282 of the mutant HPPD polypeptide is mutated from arginine to serine at a wild-type HPPD polypeptide. In addition, the mutant HPPD polypeptide further comprises an amino acid at position 349 that is mutated from glutamic acid to lysine, and/or an amino acid at position 156 that is mutated from alanine to valine. The mutated HPPD polypeptide can be used for cultivating plants having resistance to a herbicide having HPPD inhibition.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: April 9, 2024
    Assignee: CAS CENTER FOR EXCELLENCE IN MOLECULAR PLANT SCIENCES
    Inventors: Jiankang Zhu, Vipasha Verma, Feng Li, Meiling Zhang, Ming Li, Mei Chen
  • Patent number: 11956336
    Abstract: A method includes generating quality of service requirement information which includes packet loss rate indication information. The packet loss rate indication information includes an acceptable maximum packet loss rate and a reference number of service data packets. The reference number of service data packets indicates a reference measurement number for counting the packet loss rate. The method also includes sending the quality of service requirement information.
    Type: Grant
    Filed: July 24, 2023
    Date of Patent: April 9, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guogang Huang, Zhaoxia Liu, Yuchen Guo, Yunbo Li, Ming Gan
  • Patent number: 11955423
    Abstract: Methods for forming dummy under-bump metallurgy structures and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution line and a second redistribution line over a semiconductor substrate; a first passivation layer over the first redistribution line and the second redistribution line; a second passivation layer over the first passivation layer; a first under-bump metallurgy (UBM) structure over the first redistribution line, the first UBM structure extending through the first passivation layer and the second passivation layer and being electrically coupled to the first redistribution line; and a second UBM structure over the second redistribution line, the second UBM structure extending through the second passivation layer, the second UBM structure being electrically isolated from the second redistribution line by the first passivation layer.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ting-Li Yang, Po-Hao Tsai, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang
  • Patent number: 11955199
    Abstract: A memory chip, a memory device and an operation method are disclosed. The memory chip includes a number of memory units and a control logic circuit. The memory units could be configured as TLC, MLC or SLC. The control logic circuit is configured to use TLC programming approach to program MLC and SLC.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: April 9, 2024
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Yung-Chun Li, Yu-Ming Huang
  • Patent number: 11956083
    Abstract: This application provides a communication method and apparatus that allow retransmitted MPDUs with different retransmission versions (RVs) to be transmitted in a same transmission process. The communication method and apparatus may be applied to a data retransmission process between any two nodes in a Wi-Fi system. In the method, when a PPDU sent by a first node includes one or more retransmitted MPDUs, the first node may include RV indication information in the PPDU to indicate an RV of each retransmitted MPDU, so that a second node can properly receive each retransmitted MPDU based on the RV indication information.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: April 9, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Mao Yang, Jian Yu, Bo Li, Ming Gan
  • Patent number: 11956842
    Abstract: Embodiments of this application relates to a multi-link communication setup method and a related apparatus. The method includes: a non-AP MLD sends an association request frame on a first link, to request multi-link setup. An AP MLD returns an association response frame on the first link, to notify whether multi-link setup succeeds. The AP MLD sets a second status code field of a multi-link element of the association response frame to a newly defined value, to indicate that a cause why a link is not accepted is that the first link is not accepted. This application is applied to a WLAN system that supports a next generation Wi-Fi protocol of 802.11ax, for example, 802.11be, Wi-Fi 7, or EHT, and other 802.11 series protocols; and for another example, a next generation protocol of 802.11be: Wi-Fi 8.
    Type: Grant
    Filed: June 15, 2023
    Date of Patent: April 9, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yuchen Guo, Guogang Huang, Yunbo Li, Ming Gan
  • Publication number: 20240113996
    Abstract: A routing information management method adapted for a layer-3 switch is proposed. For each ARP entry in an ARP table, a processor assigns to the ARP entry an aging reference parameter that is identical to a quantity of those routing entries in an IP routing table whose next hop IP addresses are identical to the IP address of the ARP entry, and removes those ARP entries whose aging reference parameters are zero. For each routing entry in the IP routing table, when the next hop IP address of the routing entry is absent from the ARP table, the processor makes the routing entry serve as an inactive routing entry, proactively sends an ARP request for the inactive routing entry, and updates the ARP table based on a piece of ARP information received externally.
    Type: Application
    Filed: April 20, 2023
    Publication date: April 4, 2024
    Applicant: Alpha Networks Inc.
    Inventors: Gang Wang, Xiao Ming Li, Liang Bing Cao
  • Publication number: 20240112914
    Abstract: A new variable selective etching technology for thick SOI devices. An SOI material is etched by the following steps: (1) providing an SOI wafer; (2) depositing a composite hard mask with a variable selection ratio to replace a traditional hard mask with an invariable selection ratio; (3) applying a photoresist; (4) mask making, namely defining a to-be-etched region by using a photoetching plate; (5) etching the photoresist in the defined region; (6) etching the composite hard mask; (7) removing the photoresist; (8) etching top silicon by using a second etching method at a first selection ratio; and (9) etching a buried oxide layer by using a third etching method at a second selection ratio. The new variable selective etching technology avoids the damage to a side wall of a deep trench when the buried oxide layer is etched, and does not need to use an excessive thick hard mask.
    Type: Application
    Filed: March 15, 2023
    Publication date: April 4, 2024
    Applicant: University of Electronic Science and Technology of China
    Inventors: Bo ZHANG, Teng LIU, Wentong ZHANG, Nailong HE, Sen ZHANG, Ming QIAO, Zhaoji LI
  • Publication number: 20240114619
    Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.
    Type: Application
    Filed: December 2, 2022
    Publication date: April 4, 2024
    Applicant: InnoLux Corporation
    Inventors: Cheng-Chi WANG, Chin-Ming HUANG, Chien-Feng LI, Chia-Lin YANG
  • Publication number: 20240109448
    Abstract: Monitoring isolation resistance to validate vehicle charger functionality is provided. A system can include a first one or more resistors connected to a first terminal of a first direct current bus of a charger. The charger can be configured to deliver power to a first electric vehicle. The system can include a controller comprising circuitry. The controller can be configured to determine a resistance at the first one or more resistors. The controller can control delivery of power to the first electric vehicle responsive to a comparison of the resistance at the first one or more resistors with a threshold.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Aashiv Vij, Steven Schulz, Ming Li, Lixiang Wei
  • Publication number: 20240113205
    Abstract: A method includes forming a first semiconductor fin and a second semiconductor fin in an n-type Fin Field-Effect (FinFET) region and a p-type FinFET region, respectively, forming a first dielectric fin and a second dielectric fin in the n-type FinFET region and the p-type FinFET region, respectively, forming a first epitaxy mask to cover the second semiconductor fin and the second dielectric fin, performing a first epitaxy process to form an n-type epitaxy region based on the first semiconductor fin, removing the first epitaxy mask, forming a second epitaxy mask to cover the n-type epitaxy region and the first dielectric fin, performing a second epitaxy process to form a p-type epitaxy region based on the second semiconductor fin, and removing the second epitaxy mask. After the second epitaxy mask is removed, a portion of the second epitaxy mask is left on the first dielectric fin.
    Type: Application
    Filed: November 28, 2023
    Publication date: April 4, 2024
    Inventors: Chih-Chiang Chang, Ming-Hua Yu, Li-Li Su
  • Patent number: 11948393
    Abstract: A display substrate and a display apparatus are provided. The display substrate includes: a base substrate; a plurality of sub-pixels arranged on the base substrate, wherein the sub-pixels each include a sub-pixel driving circuit; a plurality of fingerprint recognition structures arranged on the base substrate, wherein the fingerprint recognition structures each include a control circuit and a fingerprint recognition electrode, the fingerprint recognition electrode is located on a side of the control circuit facing away from the base substrate, the control circuit is coupled to the fingerprint recognition electrode, and the control circuit is used for outputting a sensing signal from the fingerprint recognition electrode; wherein the control circuit and the sub-pixel driving circuit are arranged in a direction parallel to the base substrate.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: April 2, 2024
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Hao Liu, Mei Li, Jiuzhen Wang, Zunqing Song, Qiuhua Meng, Caiyu Qu, Ming Liu
  • Patent number: 11947993
    Abstract: A computer-implemented method includes creating a first file control block in a primary runtime environment with a first addressing mode and a second file control block in a secondary runtime environment with a second addressing mode, where both the first file control block and the second file control block describe a status of a first file of a caller program in the primary runtime environment. The parameters of the first file of the caller program in the primary runtime environment are passed to a target callee program in the secondary runtime environment. An anchor is added in the first file control block as a link to the second file control block. The first file control block are the second file control block synchronized with updates to the first file in the primary runtime environment and the passed parameters of the first file in the secondary runtime environment.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 2, 2024
    Assignee: International Business Machines Corporation
    Inventors: Ming Ran Liu, Jing Lu, Naijie Li, Xiao Yan Tang, Yuan Zhai, Kershaw S. Mehta
  • Patent number: 11949877
    Abstract: Innovations in adaptive encoding of screen content based on motion type are described. For example, a video encoder system receives a current picture of a video sequence. The video encoder system determines a current motion type for the video sequence and, based at least in part on the current motion type, sets one or more encoding parameters. Then, the video encoder system encodes the current picture according to the encoding parameter(s). The innovations can be used in real-time encoding scenarios when encoding screen content for a screen sharing application, desktop conferencing application, or other application. In some cases, the innovations allow a video encoder system to adapt compression to different characteristics of screen content at different times within the same video sequence.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: April 2, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Satya Sasikanth Bendapudi, Ming-Chieh Lee, Yan Lu, Bin Li, Jizhe Jin, Jiahao Li, Shao-Ting Wang
  • Patent number: 11946079
    Abstract: The present invention relates to a method for producing a protein hydrolysate using a polypeptide having endopeptidase activity and a polypeptide having carboxypeptidase activity and the use of these enzymes for hydrolysing a protein substrate. In addition, the present invention relates to polypeptides having carboxypeptidase activity and polynucleotides encoding the polypeptides. The invention also relates to nucleic acid constructs, vectors, and host cells comprising the polynucleotides as well as methods of producing and using the polypeptides.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: April 2, 2024
    Assignee: Novozymes A/S
    Inventors: Hanne Vang Hendriksen, Gitte Budolfsen Lynglev, Henrik Frisner, Ciu Liu, Ye Liu, Eduardo Antonio Della Pia, Hans Peter Heldt-Hansen, Kenneth Jensen, Wei Peng, Ming Li