Patents by Inventor Ming Wang

Ming Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240085090
    Abstract: The automatic door opening and closing device includes: a housing having a mounting space formed therein; and a pushing and rotating assembly provided in the mounting space and having a push rod controlled to be telescopic and a guide rod which extends outwards from the mounting space and is controlled to be movable; wherein the push rod is configured to push open a door of the refrigerator when controlled to extend, and the guide rod is configured to drive the door of the refrigerator to rotate after the push rod pushes open the door of the refrigerator. By integrating the push rod and the guide rod in the mounting space inside the housing.
    Type: Application
    Filed: October 29, 2021
    Publication date: March 14, 2024
    Inventors: JIANLIN MIAO, YIHAO XU, XUELI CHENG, MING WANG
  • Publication number: 20240090223
    Abstract: A 3D-NAND memory device is provided. The memory device includes a substrate, a bottom select gate (BSG) disposed over the substrate, a plurality of word lines positioned over the BSG with a staircase configuration and a plurality of insulating layers disposed between the substrate, the BSG, and the plurality of word lines. In the disclosed memory device, one or more first dielectric trenches are formed in the BSG and extend in a length direction of the substrate to separate the BSG into a plurality of sub-BSGs. In addition, one or more common source regions are formed over the substrate and extend in the length direction of the substrate. The one or more common source regions further extend through the BSG, the plurality of word lines and the plurality of insulating layers.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 14, 2024
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Yali SONG, Li Hong XIAO, Ming WANG
  • Publication number: 20240090294
    Abstract: A display substrate and a display device are provided, the display substrate includes a first display region, and the display substrate includes a plurality of first pixel structures arranged on a base substrate in an array in a first direction and a second direction, where the plurality of first pixel structures are in the first display region, at least one first pixel structure includes at least two first sub-pixels and at least two second sub-pixels, the first sub-pixel includes a first opening, and the second sub-pixel includes a second opening.
    Type: Application
    Filed: August 10, 2022
    Publication date: March 14, 2024
    Inventors: Chi Yu, Benlian Wang, Hongli Wang, Weiyun Huang, Ming Hu, Youngyik Ko
  • Publication number: 20240087949
    Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes a substrate. A gate electrode is over the substrate and a spacer structure laterally surrounds the gate electrode. A conductive via is disposed on the gate electrode. A liner is arranged along one or more sidewalls of the spacer structure. The conductive via has a bottommost surface that has a larger width than a part of the conductive via that is laterally adjacent to one or more interior sidewalls of the liner.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Li-Zhen Yu, Cheng-Chi Chuang, Chih-Hao Wang, Yu-Ming Lin, Lin-Yu Huang
  • Publication number: 20240090267
    Abstract: The present disclosure provides a displaying backplane and a displaying device, and relates to the technical field of displaying. The displaying backplane includes: a substrate base plate; a first active layer and a second active layer that are provided on the substrate base plate, wherein the material of the first active layer and the second active layer is an oxide semiconductor, the first active layer has a first channel region and first no-channel regions, and the second active layer has a second channel region and second no-channel regions; a first grid insulating layer covering the first active layer and the second active layer; and a first grid and a second grid that are provided on the first grid insulating layer; wherein the oxygen-vacancy concentration of the first channel region is greater than the oxygen-vacancy concentrations of the first no-channel regions, the second no-channel regions and the second channel region.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Applicant: BOE Technology Group Co., Ltd.
    Inventors: Jing Wang, Hongwei Tian, Ming Liu, Jia Zhao, Qiuhua Meng, Ziang Han
  • Publication number: 20240090236
    Abstract: A magnetic tunnel junction memory device includes a vertical stack of magnetic tunnel junction NOR strings located over a substrate. Each magnetic tunnel junction NOR string includes a respective semiconductor material layer that contains a semiconductor source region, a plurality of semiconductor channels, and a plurality of semiconductor drain regions, a plurality of magnetic tunnel junction memory cells having a respective first electrode that is located on a respective one of the plurality of semiconductor drain regions, and a metallic bit line contacting each second electrode of the plurality of magnetic tunnel junction memory cells. The vertical stack of magnetic tunnel junction NOR strings may be repeated along a channel direction to provide a three-dimensional magnetic tunnel junction memory device.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Han-Jong CHIA, Bo-Feng YOUNG, Sai-Hooi YEONG, Chenchen Jacob WANG, Meng-Han LIN, Yu-Ming LIN
  • Patent number: 11928311
    Abstract: The present application discloses a communication method, a terminal, a server, a communication system, a computer device and a medium. The communication method includes that a server establishes a connection and feeds back a display control in response to requests of a first terminal and a second terminal; then, the server feeds back function feedback information in response to a function request of the first terminal, and feeds back function feedback information in response to a menu request of the second terminal; and the servers presents multiple interface components and maintains and updates each interface component in response to management operation of a third user.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: March 12, 2024
    Assignees: Beijing Zhongxiangying Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Ming Ding, Li Ma, Yang Wu, Wanwan Tang, Dachuan Wang, Hong Wang, Guangyu Shao, Chaozheng Liu
  • Patent number: 11929767
    Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: March 12, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
  • Patent number: 11926619
    Abstract: The present disclosure provides novel pladienolide compounds, pharmaceutical compositions containing such compounds, and methods for using the compounds as therapeutic agents. These compounds may be useful in the treatment of cancers, particularly cancers in which agents that target the spliceosome and mutations therein are known to be useful. Also provided herein are methods of treating cancers by administering at least one compound disclosed herein and at least one additional therapy.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: March 12, 2024
    Assignee: Eisai R & D Management Co., Ltd.
    Inventors: Gregg F. Keaney, John Wang, Baudouin Gerard, Kenzo Arai, Xiang Liu, Guo Zhu Zheng, Kazunobu Kira, Lisa A. Marcaurelle, Marta Nevalainen, Ming-Hong Hao, Morgan Welzel O'Shea, Parcharee Tivitmahaisoon, Sudeep Prajapati, Tuoping Luo, Nicholas C. Gearhart, Jason T. Lowe, Yoshihiko Kotake, Satoshi Nagao, Regina Mikie Kanada Sonobe, Masayuki Miyano, Norio Murai, Andrew Cook, Shelby Ellery, Atsushi Endo, James Palacino, Dominic Reynolds
  • Patent number: 11928842
    Abstract: A method of measuring chromaticity of a target object is implemented using a computer device that stores a plurality of light source spectrum datasets each associated with a specific object. The method includes: obtaining a captured color image of the target object; generating a spectral image based on the captured color image using a spectral transformation matrix; obtaining one of the plurality of light source spectrum datasets that is associated with the target object; and calculating a chromaticity dataset of the target object based on the spectral image and the one of the plurality of light source spectrum datasets.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: March 12, 2024
    Assignee: National Chung Cheng University
    Inventors: Hsiang-Chen Wang, Yu-Ming Tsao, Yu-Lin Liu
  • Patent number: 11929321
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first insulating layer over a substrate. A first metal feature is formed in the first insulating layer and a second insulating layer is formed over the first insulating layer. A first metal via is formed through the second insulating layer to connect the first metal feature. A second metal feature is formed over the second insulating layer. The second metal feature has a convex top surface and a plane bottom surface, and the plane bottom is electrically connected to the first metal feature through the first metal via.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Zhen Yu, Lin-Yu Huang, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang
  • Publication number: 20240079781
    Abstract: An electronic device may be provided with an antenna resonating element on a first substrate that is mounted to a second substrate. A signal conductor may be coupled to a feed terminal on the antenna resonating element. The signal conductor may include impedance matching structures for the antenna. The impedance matching structures may include an open transmission line stub, a grounded transmission line stub, and a phase shifting segment. The impedance matching structures may configure the antenna to exhibit a wide bandwidth in an ultra-wideband (UWB) frequency band. If desired, the signal conductor may have a phase-shifting segment configured to match a non-50 Ohm impedance of a radio-frequency front end coupled to the signal conductor.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Han Wang, Jingni Zhong, Alden T. Rush, Ming Chen, Yiren Wang, Yuan Tao, Hao Xu, Hongfei Hu, Mattia Pascolini
  • Publication number: 20240081157
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: March 7, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Publication number: 20240079757
    Abstract: An electronic device may be provided with peripheral conductive housing structures having first and second segments. A flexible printed circuit may have a first tail that extends along the first and second segments and a second tail that extends along the first segment. A conductive trace on the first tail may be coupled to an antenna feed terminal on the second segment. A conductive trace on the second tail may couple the conductive trace on the first tail to the first segment. A tuner and filters may be disposed on the flexible printed circuit and may be coupled to the conductive traces. The conductive trace on the second tail may have a tapered width. An antenna in the device may have a resonating element that includes both the first and second segments, thereby allowing the antenna to exhibit a wide bandwidth from 1.1-5 GHz.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Seyed Mohammad Amjadi, Yuan Tao, Hao Xu, Yiren Wang, Xue Yang, Mattia Pascolini, Hongfei Hu, Enrique Ayala Vazquez, Ming-Ju Tsai, Ana Papio Toda, Yuancheng Xu, Jingni Zhong, Nikolaj P Kammersgaard, Sidharath Jain, Haozhan Tian, Ming Chen, Linqiang Zou
  • Publication number: 20240079782
    Abstract: An electronic device may be provided with a housing and an antenna. The antenna may be on a first substrate mounted to a second substrate. The housing may include a dielectric cover, a conductive plate on the dielectric cover, and a mid-chassis. The second substrate may be mounted to the mid-chassis. The antenna may include a conductive patch extending from a segment of a conductive ring on the first substrate. The conductive plate may have an opening aligned with the conductive patch. The first substrate may be separated from the dielectric cover by an air gap. A conductive gasket may couple the conductive ring to the conductive plate and may laterally surround the air gap and the opening. The antenna may convey ultra-wideband (UWB) signals through the air gap, the opening, and the dielectric cover layer.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Alden T. Rush, Han Wang, Jingni Zhong, Ming Chen, Yiren Wang, Yuan Tao, Hao Xu, Hongfei Hu, Mattia Pascolini
  • Publication number: 20240078887
    Abstract: There is provided a smoke detector including a first light source, a second light source surface, a light sensor and a processor. The light sensor receives reflected light when the first light source and the second light source emit light, and generates a first detection signal corresponding to light emission of the first light source and a second detection signal corresponding to light emission of the second light source. The processor distinguishes smoke and floating particles according to a similarity between the first detection signal and the second detection signal.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 7, 2024
    Inventors: CHENG-NAN TSAI, GUO-ZHEN WANG, CHING-KUN CHEN, YEN-CHANG CHU, CHIH-MING SUN
  • Publication number: 20240079761
    Abstract: An electronic device may be provided with a flexible printed circuit and a rigid printed circuit mounted to the flexible printed circuit using a board-to-board (B2B) connector. The flexible printed circuit may include signal conductors coupled to one or more antennas on the rigid printed circuit through the B2B connector. A given one of the signal conductors may include a phase shifter segment on the flexible printed circuit and/or a thick impedance matching segment on the rigid printed circuit that help to form a smooth impedance transition from the flexible printed circuit to the rigid printed circuit and the antenna(s). The B2B connector may include signal contacts interleaved with a ground contacts. The B2B connector may include ground bars laterally surrounding the signal and ground contacts to maximize the strength of mechanical coupling between the flexible printed circuit and the rigid printed circuit.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Jingni Zhong, Ming Chen, Han Wang, Alden T Rush, Behnam Ghassemiparvin, Bhaskara R Rupakula, Yiren Wang, Yuan Tao, Hao Xu, Jennifer M Edwards, Hongfei Hu, Mattia Pascolini
  • Publication number: 20240079777
    Abstract: An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Yiren Wang, Yuan Tao, Hao Xu, Hongfei Hu, Enrique Ayala Vazquez, Ming-Ju Tsai, Sidharath Jain, Haozhan Tian, Yuancheng Xu, Harlan S Dannenberg, Eric W Bates, Peter A Dvorak, Nicole E Cazares, Obinna O Onyemepu, Victor C Lee, Han Wang
  • Publication number: 20240079239
    Abstract: A method includes implanting impurities in a semiconductor substrate to form an etch stop region within the semiconductor substrate; forming a transistor structure on a front side of the semiconductor substrate; forming a front-side interconnect structure over the transistor structure; performing a thinning process on a back side of the semiconductor substrate to reduce a thickness of the semiconductor substrate, wherein the thinning process is slowed by the etch stop region; and forming a back-side interconnect structure over the back side of the semiconductor substrate.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 7, 2024
    Inventors: Bau-Ming Wang, Liang-Yin Chen, Wei Tse Hsu, Jung-Tsan Tsai, Ya-Ching Tseng, Chunyii Liu
  • Patent number: D1017469
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: March 12, 2024
    Assignee: GREAT WALL MOTOR COMPANY LIMITED
    Inventors: Weilong Wang, Kuan Kang, Ming Li, Chunquan Gao, Zihan Zhao, Yunlong Cao, Hongju Gao, Baowang Li, Qiang Guo, Fa Lu