Patents by Inventor Ming Yang
Ming Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11960211Abstract: In an embodiment, an apparatus includes an energy source, a support platform for holding a wafer, an optical path extending from the energy source to the support platform, and a photomask aligned such that a patterned major surface of the photomask is parallel to the force of gravity, where the optical path passes through the photomask, where the patterned major surface of the photomask is perpendicular to a topmost surface of the support platform.Type: GrantFiled: July 9, 2021Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hung-Jui Kuo, Ting-Yang Yu, Ming-Tan Lee
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Patent number: 11963083Abstract: This application provides communication methods, apparatuses, and computer-readable storage media. In an example, a value of a specific element of a first access point (AP) (or a second AP) is reused in a management frame, to indicate specific elements of a plurality of APs in a multiple basic service set identifier (BSSID) set to which the first AP (or the second AP) belongs. The management frame does not need to carry a plurality of same specific elements in the multiple BSSID set. The described techniques can be applied to, for example, a wireless local area network system supporting IEEE 802.11ax next-generation Wi-Fi protocols, for example, 802.11 series protocols such as the 802.11be or the EHT.Type: GrantFiled: May 22, 2023Date of Patent: April 16, 2024Assignee: Huawei Technologies Co., Ltd.Inventors: Ming Gan, Yuchen Guo, Guogang Huang, Xun Yang
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Patent number: 11961768Abstract: A method includes forming a first transistor, which includes forming a first gate dielectric layer over a first channel region in a substrate and forming a first work-function layer over the first gate dielectric layer, wherein forming the first work-function layer includes depositing a work-function material using first process conditions to form the work-function material having a first proportion of different crystalline orientations and forming a second transistor, which includes forming a second gate dielectric layer over a second channel region in the substrate and forming a second work-function layer over the second gate dielectric layer, wherein forming the second work-function layer includes depositing the work-function material using second process conditions to form the work-function material having a second proportion of different crystalline orientations.Type: GrantFiled: May 5, 2023Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ya-Wen Chiu, Da-Yuan Lee, Hsien-Ming Lee, Kai-Cyuan Yang, Yu-Sheng Wang, Chih-Hsiang Fan, Kun-Wa Kuok
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Publication number: 20240121856Abstract: Apparatus, methods, and computer-readable media for connected mode discontinuous reception (C-DRX) on/off synchronization coordination between user equipment and network are disclosed herein. A user equipment (UE) may transmit a UE capability message that indicates that the UE has capability to support C-DRX on/off synchronization coordination with the network entity. The UE may receive a DRX synchronization coordination configuration based on the UE capability message, the DRX synchronization coordination configuration configuring the UE with the C-DRX on/off synchronization coordination with the network entity. The UE may determine that an inactivity timer associated with the DRX synchronization coordination configuration is within a threshold time to expire, and transmit special uplink signaling indicating that the UE intends to transition into an off duration in a DRX cycle based on the inactivity timer being within the threshold time to expire.Type: ApplicationFiled: October 10, 2022Publication date: April 11, 2024Inventors: Ming YANG, Kausik RAY CHAUDHURI
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Publication number: 20240115508Abstract: Nanocrystals, compositions, and methods that aid particle transport in mucus are provided. In some embodiments, the compositions and methods involve making mucus-penetrating particles (MPP) without any polymeric carriers, or with minimal use of polymeric carriers. The compositions and methods may include, in some embodiments, modifying the surface coatings of particles formed of pharmaceutical agents that have a low water solubility. Such methods and compositions can be used to achieve efficient transport of particles of pharmaceutical agents though mucus barriers in the body for a wide spectrum of applications, including drug delivery, imaging, and diagnostic applications. In certain embodiments, a pharmaceutical composition including such particles is well-suited for administration routes involving the particles passing through a mucosal barrier.Type: ApplicationFiled: December 5, 2023Publication date: April 11, 2024Inventors: Alexey Popov, Elizabeth M. Enlow, James Bourassa, Colin R. Gardner, Hongming Chen, Laura M. Ensign, Samuel K. Lai, Tao Yu, Justin Hanes, Ming Yang
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Publication number: 20240120388Abstract: Provided are structures and methods for forming structures with sloping surfaces of a desired profile. An exemplary method includes performing a first etch process to differentially etch a gate material to a recessed surface, wherein the recessed surface includes a first horn at a first edge, a second horn at a second edge, and a valley located between the first horn and the second horn; depositing an etch-retarding layer over the recessed surface, wherein the etch-retarding layer has a central region over the valley and has edge regions over the horns, and wherein the central region of the etch-retarding layer is thicker than the edge regions of the etch-retarding layer; and performing a second etch process to recess the horns to establish the gate material with a desired profile.Type: ApplicationFiled: January 18, 2023Publication date: April 11, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Li-Wei Yin, Tzu-Wen Pan, Yu-Hsien Lin, Jih-Sheng Yang, Shih-Chieh Chao, Chia Ming Liang, Yih-Ann Lin, Ryan Chia-Jen Chen
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Publication number: 20240120614Abstract: The present application provides a separator for a secondary battery and a preparation method thereof, as well as a secondary battery and an electrical apparatus including the separator. The separator of the present application includes a porous substrate and a coating disposed on at least one surface of the porous substrate. The coating includes nanocellulose, the nanocellulose includes modifying groups, and the modifying groups include at least one of sulfonic acid groups, boric acid groups, and phosphoric acid groups.Type: ApplicationFiled: October 16, 2023Publication date: April 11, 2024Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITEDInventors: Ming XU, Jianrui YANG, Manxiang WEI
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Publication number: 20240114847Abstract: A plant container assembly includes a first plant container, a second plant container, and at least one buckle. The first plant container has at least one first buckle part protruding from an outer wall surface of a container wall of the first plant container and located at a bottom section of the container wall of the first plant container. The second plant container has at least one second buckle part protruding from an outer wall surface of a container wall of the second plant container and located at a top section of the container wall of the second plant container. When the first plant container is stacked on top of the second plant container, the buckle could be engaged with both the first buckle part of the first plant container and the second buckle part of the second plant container, thereby enhancing the stacking strength of the plant containers.Type: ApplicationFiled: October 4, 2023Publication date: April 11, 2024Applicant: CHANGYANG Technology Ltd.Inventors: YU-TSE WU, YAO-MING YANG
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Patent number: 11955061Abstract: Provided is a pixel driving circuit configured to provide a signal to a to-be-driven element. The pixel driving circuit includes: a current control sub-circuit, configured to transmit a current signal; a time length control sub-circuit, configured to transmit a time signal; and an output sub-circuit, electrically connected with the time length control sub-circuit and the current control sub-circuit, respectively; where the time length control sub-circuit is further configured to control the output sub-circuit to be turned on or off based on the time signal; the output sub-circuit is configured to, when turned on, control a current applied to the to-be-driven element based on the current signal, where duration of two adjacent turn-ons of the output sub-circuit is same and duration of two adjacent turn-offs of the output sub-circuit is same.Type: GrantFiled: March 3, 2021Date of Patent: April 9, 2024Assignees: Beijing BOE Display Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Ning Cong, Xiaochuan Chen, Minghua Xuan, Can Zhang, Ming Yang, Lijun Yuan, Angran Zhang
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Patent number: 11951465Abstract: Catalyst systems that are resistant to high-temperature sintering and methods for preparing such catalyst systems that are resistant to sintering at high temperatures are provided. Methods of forming such catalyst systems include contacting a support having a surface including a catalyst particle with a solution comprising a metal salt and having an acidic pH. The metal salt is precipitated onto the surface of the support. Next, the metal salt is calcined to selectively generate a porous coating of metal oxide on the surface of the support distributed around the catalyst particle.Type: GrantFiled: June 27, 2019Date of Patent: April 9, 2024Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Xingcheng Xiao, Gongshin Qi, Ryan J. Day, Ming Yang
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Patent number: 11953350Abstract: A capacitance detection apparatus and an electronic device are disclosed. The capacitance detection apparatus includes: a sensing module, a connecting circuit, and a differential detection circuit for detecting changes in capacitance of the sensing module; the sensing module comprises: a substrate, and a first sensing layer and a second sensing layer respectively located on two sides of the substrate; a first sensing unit of the first sensing layer is opposite to a second sensing unit of the second sensing layer, and the first sensing unit covers the second sensing unit; the first sensing unit and the second sensing unit are electrically connected to the differential detection circuit. When a detection object approaches the capacitance detection apparatus, the capacitance of the first sensing unit is influenced by the temperature and the detection object, and the capacitance of the second sensing unit is only influenced by the temperature.Type: GrantFiled: September 25, 2020Date of Patent: April 9, 2024Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.Inventors: Ming Yang, Shuqing Cheng, Dansheng Chen, Zicheng Guo
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Patent number: 11956083Abstract: This application provides a communication method and apparatus that allow retransmitted MPDUs with different retransmission versions (RVs) to be transmitted in a same transmission process. The communication method and apparatus may be applied to a data retransmission process between any two nodes in a Wi-Fi system. In the method, when a PPDU sent by a first node includes one or more retransmitted MPDUs, the first node may include RV indication information in the PPDU to indicate an RV of each retransmitted MPDU, so that a second node can properly receive each retransmitted MPDU based on the RV indication information.Type: GrantFiled: November 5, 2021Date of Patent: April 9, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Mao Yang, Jian Yu, Bo Li, Ming Gan
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Patent number: 11955519Abstract: A semiconductor device includes an epitaxial substrate. The epitaxial substrate includes a substrate. A strain relaxed layer covers and contacts the substrate. A III-V compound stacked layer covers and contacts the strain relaxed layer. The III-V compound stacked layer is a multilayer epitaxial structure formed by aluminum nitride, aluminum gallium nitride or a combination of aluminum nitride and aluminum gallium nitride.Type: GrantFiled: April 17, 2023Date of Patent: April 9, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Yu-Ming Hsu, Yu-Chi Wang, Yen-Hsing Chen, Tsung-Mu Yang, Yu-Ren Wang
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Publication number: 20240112144Abstract: A method of implementing administrative services for managing status updates is disclosed. A status update configuration window is provided on a graphical user interface. The status update configuration window comprises a plurality of update settings for configuring recurring status updates. A selection of update settings is received in the status update configuration window comprising an update frequency, a set of update questions, and a schedule for update reminders. The selected update settings are stored as an update template. An update summary window is displayed concurrently with the status update configuration window. The update summary window comprises a limited list of one or more selectable update management functions. A selection of an update management function is received from the update summary window.Type: ApplicationFiled: October 2, 2023Publication date: April 4, 2024Inventors: Eric Koslow, Amy Ming Luo, Victor Kmita, Johannes Ma, Ricky Rizal Zein, Joan Roig, Byron Sha Yang, Jack Hanford, Jared Erondu, Elise Fung, Elliot Piersa Dahl, Megan McGowan, Jay Ashish Mahabal, Rahul Rangnekar, William Michael Dybas, Ian William Richard, Nicole Jensen McMullin
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Publication number: 20240114619Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.Type: ApplicationFiled: December 2, 2022Publication date: April 4, 2024Applicant: InnoLux CorporationInventors: Cheng-Chi WANG, Chin-Ming HUANG, Chien-Feng LI, Chia-Lin YANG
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Publication number: 20240113032Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.Type: ApplicationFiled: April 25, 2023Publication date: April 4, 2024Inventors: Kai-Fung CHANG, Chin-Wei LIANG, Sheng-Feng WENG, Ming-Yu YEN, Cheyu LIU, Hung-Chih CHEN, Yi-Yang LEI, Ching-Hua HSIEH
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Publication number: 20240112143Abstract: A method of implementing administrative services for managing group feedback is disclosed. A selection of a feedback visibility setting for a feedback message from a plurality of predefined feedback visibility settings is received via a give feedback tab of a user interface. The feedback message and a selection of one or more recipients are received via the give feedback tab. The feedback message is sent to the selected one or more recipients based on the selected feedback visibility setting. A request for feedback and a selection of one or more feedback providers are received via a request feedback tab of the user interface. The request for feedback is sent to the selected one or more feedback providers. Received feedback responses linked to a user profile of the feedback requestor are stored.Type: ApplicationFiled: October 2, 2023Publication date: April 4, 2024Inventors: Eric Koslow, Amy Ming Luo, Byron Sha Yang, Joan Roig, Victor Kmita, Johannes Ma, Elliot Dahl, Adnan Chowdhury, Ricky Rizal Zein, William Michael Dybas, Jack Hanford, Ryan Hinshaw, Jared Erondu, Aleksandr Mistratov, Rahul Rangnekar, Carrie Jo Noonan, Jerry Xie, Nathalie Corinne Bize, Hari Vignesh Ganesan, Audrey Chou, Elise Fung, Jay Ashish Mahabal
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Publication number: 20240101584Abstract: 1, 2, 4, 5-tetraoxane compounds and derivatives thereof that have anticancer properties are disclosed. Pharmaceutical compositions and pharmaceutical formulations in unit dosage form suitable for the delivery of the compounds to a subject in need thereof are disclosed. The pharmaceutical compositions or formulations may include one or more active agents in addition to the compounds, such as one or more additional anticancer agents. Methods for treating a cancer, reducing a cancer, or treating or ameliorating one or more symptoms associated with a cancer in a subject are also disclosed. The methods include (i) administering to a subject in need thereof an effective amount of the compound (s). The compound (s) can be administered by oral administration, parenteral administration, inhalation, mucosal administration, or a combination thereof. The compound can selectively kill cancer cells and/or cancer stem cells over non-cancerous cells by triggering ferroptosis in the cancer cells and/or cancer stem cells.Type: ApplicationFiled: January 29, 2022Publication date: March 28, 2024Applicant: Westlake UniversityInventors: Dan YANG, Ming Kwan WONG
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Publication number: 20240107702Abstract: An information handling system having a reconfigurable cooling fan holder including a plurality of cooling fans of a cooling system operatively coupled to the reconfigurable cooling fan holder, a reconfigurable frame having a plurality of slidingly adjustable walls including a pair of lengthwise slidingly adjustable walls and a widthwise slidingly adjustable wall where the pair of lengthwise slidingly adjustable walls may be expanded or reduced in length by sliding the at least two slide bars nested adjacent to one another forming each lengthwise slidingly adjustable wall to extend or contract each lengthwise slidingly adjustable wall, and the widthwise slidingly adjustable wall may be expanded or reduced in width by sliding the at least two slide bars nested adjacent to one another forming the widthwise slidingly adjustable wall to extend or contract the widthwise slidingly adjustable wall for adjusting the width and length of the reconfigurable cooling fan holder.Type: ApplicationFiled: September 22, 2022Publication date: March 28, 2024Applicant: Dell Products, LPInventors: Chung-An Lin, Yu-Ming Kuo, Chih-Yung Yang
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Publication number: 20240102741Abstract: A heat dissipation structure having a heat pipe is provided. The heat dissipation structure includes a heat dissipation base, a plurality of fins, at least one heat pipe, and at least a first heat dissipation contact material and a second heat dissipation contact material that are different from one another. The heat dissipation base has a first and a second heat dissipation surface opposite to each other. The second heat dissipation surface is connected to the fins. At least one recessed trough is concavely formed on the first heat dissipation surface. The at least one heat pipe is located in the at least one recessed trough. The first and the second heat dissipation contact material are filled in the at least one recessed trough. A melting point of the second heat dissipation contact material is smaller than a melting point of the first heat dissipation contact material.Type: ApplicationFiled: September 22, 2022Publication date: March 28, 2024Inventors: CHING-MING YANG, CHUN-TE WU, TZE-YANG YEH