Abstract: The preset invention relates to a process for discovering potential treatment strategy for a given disease, providing a niche for PPI network construction, target prioritization, and potential drug identification for a given disease, particular a cancer, based on the interaction between prioritized NPC targets (e.g. cliques and bottleneck genes) and drugs.

Abstract: The device for simulating a rectified constant impedance load provide by the present invention is to test a power product and comprises an analog-digital converter, a digital signal processor, a digital-analog converter, and an active electrical load module in order to replacing the passive components of a traditional rectified passive load.

Abstract: A method for manufacturing an integrated circuit package system includes: providing a leadframe; forming a protruding pad on the leadframe; attaching a die to the leadframe; electrically connecting the die to the leadframe; and encapsulating at least portions of the leadframe, the protruding pad, and the die in an encapsulant.

Abstract: A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.

Abstract: An integrated circuit package system is provided. A protruding pad is formed on a leadframe. A die is attached to the leadframe. The die is electrically connected to the leadframe. At least portions of the leadframe, the protruding pad, and the die are encapsulated in an encapsulant.

Abstract: A system is provided for an integrated circuit package including a leadframe with a lead finger. A groove is in a lead finger for a conductive bonding agent and a passive device is in the groove to be held by the conductive bonding agent.

Abstract: The invention relates to a tank truck end plate having a wave-shaped brink reinforced ring. An arced convex portion and an arced concave portion are continuously formed on the periphery of the end plate of the tank of the tank truck, and the region of the frame periphery of the arced concave portion is formed with an arced convex surface, which has the curvature greater than the curvature of the arced convex surface of the end plate of the tank of the conventional tank truck. According to this design, the end plate has the enhanced strength, surface smoothness, smoothness and straightness of the distal end of the periphery and the overall smoothness.

Abstract: An electronic load device provided for testing an OT (power supply to be tested) and the working bandwidth is regulated and set according to the output impedance of the OT. The electronic load device comprises a CPU, an impedance-bandwidth table, a voltage-current measurement unit, a power stage and a control module. Firstly, a current pulled out from the OT to the power stage is called by the CPU. Thereafter, an output impedance of the OT is measured by the voltage-current measurement unit and analysis by the CPU. Next, a working bandwidth of the electronic load device is regulated and set by the control module according to the output impedance and the impedance-bandwidth table.

Abstract: A test device for testing a system, which has first interface circuit, second interface circuit, and a power switch, comprises a power supply, status detector, and a controller. The power supply includes a supplying unit and a switch controller. The supplying unit provides a test power signal according to a wall wart signal. The switch controller enables the power switch to power the system with the test power signal in response to a control signal. The system boots according to operation system data provided via first interface circuit in response to the test power signal. The status detector generates a status detection signal indicating whether the system boots up successfully in response to an operation signal on the second interface circuit. The controller provides the control signal and processes the status detection signal.

Abstract: An electronic load simulates an LED is to output a simulation signal after receiving an input signal. The simulation signal has a voltage value and a current value approximating to a characteristic curve of a real LED. The electronic load comprises a processor, an amplifier, and a control unit. The processor receives a control command to set up the LED. The control command includes a forward voltage parameter and an equivalent impedance parameter. The control unit generates an adjustment command according to the foregoing parameters and the voltage of the power source. The amplifier receives and further adjusts the adjustment command so as to output the simulation signal.

Abstract: The power management integrated circuit has a startup circuit, a switch controller and a standby controller. Powered by a power source, the startup circuit provides electric power to an operational power source during a startup period. The switch controller controls a power switch to store or release energy in an energy conversion unit. Powered by the power source, the standby controller receives a standby signal. When the standby signal is asserted, the standby controller disables the startup circuit and the switch controller, thereby startup circuit not providing electric power to the operational power source and the switch controller continuously turning off the power switch.

Abstract: An exterior lever lock device with a clutch assembly is mounted on a door, is connected to a bolt and an indoor lever lock device and has a lever assembly, a driving assembly, a clutch assembly and a driven assembly. The driven assembly has an inner sleeve and a locking panel fastened to the clutch assembly and selectively engaging the inner sleeve. Therefore, whenever the lever lock is locked or unlocked, as long as there is a turning force applied to the lever assembly, the lever assembly turns and is not broken easily. An endurance of the exterior lever lock device is prolonged for improved lock performance.

Abstract: The present invention relates to the use of specific types of compounds acting as pharmacological chaperones having a stabilizing activity on the phenylalanine hydroxylase (PAH) enzyme for the prophylaxis and/or treatment of hyperphenylalaninemia (HPA) and phenylketonuria PKU) and diseases, disorders and conditions related thereto. Further, the present invention relates to pharmaceutical compositions containing the compounds according to the present invention as well as to methods of treatment of HPA, in particular, PKU and diseases, disorders and conditions related thereto.

Abstract: A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.

Abstract: An integrated package system with die and package combination includes forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and encapsulating a second integrated circuit over the first integrated circuit.

Abstract: The invention encompasses a purified preparation of the mitotic spindle matrix essential for mitotic spindle assembly, which allows for identifying an agent that modulates a cell division and/or differentiation signaling pathway comprising determining the effect of the agent on spindle formation, MT nucleation, or lamin matrix assembly wherein the change in spindle formation, MT nucleation or lamin matrix assembly.

Abstract: An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and encapsulating a second integrated circuit over the first integrated circuit.

Abstract: A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.

Abstract: An electronic load device provided for testing an OT (power supply to be tested) and the working bandwidth is regulated and set according to the output impedance of the OT. The electronic load device comprises a CPU, an impedance-bandwidth table, a voltage-current measurement unit, a power stage and a control module. Firstly, a current pulled out from the OT to the power stage is called by the CPU. Thereafter, an output impedance of the OT is measured by the voltage-current measurement unit and analysis by the CPU. Next, a working bandwidth of the electronic load device is regulated and set by the control module according to the output impedance and the impedance-bandwidth table.