Patents by Inventor Ming Ying

Ming Ying has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090091958
    Abstract: The device for simulating a rectified constant impedance load provide by the present invention is to test a power product and comprises an analog-digital converter, a digital signal processor, a digital-analog converter, and an active electrical load module in order to replacing the passive components of a traditional rectified passive load.
    Type: Application
    Filed: October 2, 2008
    Publication date: April 9, 2009
    Inventors: Hung-Hsiang KAO, Wen-Chung CHEN, Kuo-Cheng LIU, Ming-Ying TSOU
  • Patent number: 7510850
    Abstract: The invention encompasses a purified preparation of the mitotic spindle matrix essential for mitotic spindle assembly, which allows for identifying an agent that modulates a cell division and/or differentiation signaling pathway comprising determining the effect of the agent on spindle formation, MT nucleation, or lamin matrix assembly wherein the change in spindle formation, MT nucleation or lamin matrix assembly.
    Type: Grant
    Filed: November 13, 2006
    Date of Patent: March 31, 2009
    Assignee: Carnegie Institution of Washington
    Inventors: Yixian Zheng, Ming-Ying Tsai
  • Publication number: 20080297963
    Abstract: Disclosed is an adjustable over current protection circuit which advances the timing of enabling an over current protection mechanism according to an input voltage, therefore the delay problem resulting from the non-instant response of the over current protection circuit is compensated with a low power loss. The over current protection circuit includes a voltage divider, a voltage-to-current converting circuit, an adjusting circuit and a comparing circuit. The voltage divider divides an input voltage to generate an adjusted input voltage, and the adjusted input voltage is converted into an adjusted input current by the voltage-to-current converting circuit. The adjusting circuit then adjusts a current sensing voltage according to the adjusted input current to generate an adjusted current sensing voltage.
    Type: Application
    Filed: May 31, 2007
    Publication date: December 4, 2008
    Inventors: Hung-Ta Lee, Ming-Ying Kuo, Chun-Liang Lin
  • Patent number: 7388280
    Abstract: The present invention provides a package stacking lead frame system comprising forming a lead frame interposer including a dual row of terminal leads positioned around a die attach pad, mounting a first die on the die attach pad, wherein the first die is connected to the dual row of terminal leads, molding a molding compound around the first die and the dual row of terminal leads and mounting a second integrated circuit package on the lead frame interposer, wherein the second integrated circuit package size is independent of the first die size.
    Type: Grant
    Filed: October 29, 2005
    Date of Patent: June 17, 2008
    Assignee: Stats Chippac Ltd.
    Inventors: IL Kwon Shim, Ming Ying, Seng Guan Chow
  • Patent number: 7383054
    Abstract: A method and an apparatus for selecting a public land mobile network (PLMN) for a mobile station are provided. The method and the apparatus according to this invention use the first and the second system information included in the broadcasting information broadcasted by a base station to find out all of the base stations belonging to the same PLMN as that base station in the base station table, and group those base stations belonging to the same PLMN as a base station group. The method and the apparatus according to this invention only need to synchronize with one base station in a base station group, and the other base stations belonging to the same base station group as that base station are known. Accordingly, the selection method according to this invention can substantially reduce the time for selecting a PLMN and improve the corresponding efficiency.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: June 3, 2008
    Assignee: Mediatek Inc.
    Inventors: Ming-Ying Chou, Sung-Yao Lin
  • Publication number: 20070210422
    Abstract: A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.
    Type: Application
    Filed: March 9, 2006
    Publication date: September 13, 2007
    Applicant: STATS CHIPPAC LTD.
    Inventors: Seng Guan Chow, Ming Ying, Il Kwon Shim, Lip Seng Tan
  • Publication number: 20070141652
    Abstract: The invention encompasses a purified preparation of the mitotic spindle matrix essential for mitotic spindle assembly, which allows for identifying an agent that modulates a cell division and/or differentiation signaling pathway comprising determining the effect of the agent on spindle formation, MT nucleation, or lamin matrix assembly wherein the change in spindle formation, MT nucleation or lamin matrix assembly.
    Type: Application
    Filed: November 13, 2006
    Publication date: June 21, 2007
    Inventors: Yixian Zheng, Ming-Ying Tsai
  • Publication number: 20070063322
    Abstract: An integrated circuit package system is provided. A protruding pad is formed on a leadframe. A die is attached to the leadframe. The die is electrically connected to the leadframe. At least portions of the leadframe, the protruding pad, and the die are encapsulated in an encapsulant.
    Type: Application
    Filed: September 22, 2005
    Publication date: March 22, 2007
    Applicant: STATS CHIPPAC LTD.
    Inventors: Seng Guan Chow, Ming Ying, Il Kwon Shim, Roger Emigh
  • Publication number: 20060197198
    Abstract: A system is provided for an integrated circuit package including a leadframe with a lead finger. A groove is in a lead finger for a conductive bonding agent and a passive device is in the groove to be held by the conductive bonding agent.
    Type: Application
    Filed: December 23, 2005
    Publication date: September 7, 2006
    Applicant: ST ASSEMBLY TEST SERVICES LTD.
    Inventors: Seng Guan Chow, Il Kwon Shim, Ming Ying, Byung Hoon Ahn
  • Publication number: 20060197207
    Abstract: An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and encapsulating a second integrated circuit over the first integrated circuit.
    Type: Application
    Filed: November 22, 2005
    Publication date: September 7, 2006
    Applicant: STATS CHIPPAC LTD.
    Inventors: Seng Guan Chow, Ming Ying, Il Kwon Shim
  • Publication number: 20060186514
    Abstract: The present invention provides a package stacking lead frame system comprising forming a lead frame interposer including a dual row of terminal leads positioned around a die attach pad, mounting a first die on the die attach pad, wherein the first die is connected to the dual row of terminal leads, molding a molding compound around the first die and the dual row of terminal leads and mounting a second integrated circuit package on the lead frame interposer, wherein the second integrated circuit package size is independent of the first die size.
    Type: Application
    Filed: October 29, 2005
    Publication date: August 24, 2006
    Applicant: STATS CHIPPAC LTD.
    Inventors: IL Kwon Shim, Ming Ying, Seng Guan Chow
  • Patent number: 7064430
    Abstract: A semiconductor package includes a substrate. A crenellated spacer is attached to the substrate. At least one top die is attached to the crenellated spacer. The at least one top die is wire bonded to the substrate, and an encapsulant is formed over the crenellated spacer and the at least one top die.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: June 20, 2006
    Assignee: Stats Chippac Ltd.
    Inventors: Seng Guan Chow, Ming Ying, Il Kwon Shim, Roger Emigh
  • Patent number: 7057380
    Abstract: An adaptive dead-time controller is provided to improve a conversion efficiency of a power converter at a low/no load condition. The adaptive dead-time controller has a reference voltage generator, an error amplifier, a comparator, an oscillator, an adaptive dead-time generator and a flip-flop. The adaptive dead-time controller outputs a gate pulse according to an output voltage and an oscillation. When power converter is at a low/no load condition, the adaptive dead-time generator delays a rising edge of an oscillation signal by a dead-time from a rising edge of a clock signal, so the frequency of the gate pulse and the power consumption of the power converter are reduced.
    Type: Grant
    Filed: September 28, 2004
    Date of Patent: June 6, 2006
    Assignee: Leadtrend Technology Corporation
    Inventors: Ming-Ying Kuo, Hung-Ta Lee
  • Patent number: 7049801
    Abstract: This specification discloses a adaptive dual-slope frequency controller for adjusting power conversion of a power supply. The converter can adjust its operating frequency according to the status of a load device. A feedback voltage, representing the load status, is used to control two pairs of charging/discharging currents of a storage capacitor in the present controller, thereby controlling the period of the voltage waveform at the capacitor. This controller can especially lower the frequency of the gate pulse of power supply to improve the overall efficiency at light load and no load.
    Type: Grant
    Filed: October 14, 2004
    Date of Patent: May 23, 2006
    Assignee: Leadtrend Technology Corp.
    Inventor: Ming-Ying Kuo
  • Publication number: 20060043559
    Abstract: A semiconductor package includes a substrate. A crenellated spacer is attached to the substrate. At least one top die is attached to the crenellated spacer. The at least one top die is wire bonded to the substrate, and an encapsulant is formed over the crenellated spacer and the at least one top die.
    Type: Application
    Filed: August 31, 2004
    Publication date: March 2, 2006
    Applicant: STATS CHIPPAC LTD.
    Inventors: Seng Chow, Ming Ying, Il Shim, Roger Emigh
  • Patent number: 7005325
    Abstract: A system is provided for an integrated circuit package including a leadframe having a lead finger. A groove is formed in a lead finger for a conductive bonding agent and a passive device is placed in the groove to be held by the conductive bonding agent.
    Type: Grant
    Filed: February 5, 2004
    Date of Patent: February 28, 2006
    Assignee: St Assembly Test Services Ltd.
    Inventors: Seng Guan Chow, Il Kwon Shim, Ming Ying, Byung Hoon Ahn
  • Publication number: 20050272104
    Abstract: A method for detection of mycobacterium tuberculosis antigens in biological fluids provides immunoassay methods, diagnostic kits, and an immunochromatoraphic assay device for detection of Mycobacterium tuberculosis antigens in biological specimens, preferably body fluids and tissues. The preferred body fluids are blood, serum, plasma, urine, pulmonary fluid, sputum, cerebrospinal fluid, and the preferred tissue is the lung biopsy specimen. The immunoassays require two primary antibodies against RD1, RD2, or RD3 of Mycobacterium tuberculosis. At least one of the primary antibodies is attached to a solid carrier. Optional, a second antibody against an animal species producing one of the primary antibodies can be added. Either the other primary antibody or the secondary antibody is labeled with a detection agent, which can be an enzymatic marker, a fluorescent or luminescent agent, a radio active label or a color particle.
    Type: Application
    Filed: June 7, 2004
    Publication date: December 8, 2005
    Applicant: Chang Gung University
    Inventors: Err-Cheng Chan, Ming-Ying Yang
  • Publication number: 20050270008
    Abstract: This specification discloses a adaptive dual-slope frequency controller for adjusting power conversion of a power supply. The converter can adjust its operating frequency according to the status of a load device. A feedback voltage, representing the load status, is used to control two pairs of charging/discharging currents of a storage capacitor in the present controller, thereby controlling the period of the voltage waveform at the capacitor. This controller can especially lower the frequency of the gate pulse of power supply to improve the overall efficiency at light load and no load.
    Type: Application
    Filed: October 14, 2004
    Publication date: December 8, 2005
    Applicant: Leadtrend Technology Corp.
    Inventor: Ming-Ying Kuo
  • Publication number: 20050173783
    Abstract: A system is provided for an integrated circuit package including a leadframe having a lead finger. A groove is formed in a lead finger for a conductive bonding agent and a passive device is placed in the groove to be held by the conductive bonding agent.
    Type: Application
    Filed: February 5, 2004
    Publication date: August 11, 2005
    Applicant: ST ASSEMBLY TEST SERVICES LTD.
    Inventors: Seng Chow, Il Shim, Ming Ying, Byung Ahn
  • Publication number: 20050153722
    Abstract: A method and an apparatus for selecting a public land mobile network (PLMN) for a mobile station are provided. The method and the apparatus according to this invention use the first and the second system information included in the broadcasting information broadcasted by a base station to find out all of the base stations belonging to the same PLMN as that base station in the base station table, and group those base stations belonging to the same PLMN as a base station group. The method and the apparatus according to this invention only need to synchronize with one base station in a base station group, and the other base stations belonging to the same base station group as that base station are known. Accordingly, the selection method according to this invention can substantially reduce the time for selecting a PLMN and improve the corresponding efficiency.
    Type: Application
    Filed: December 3, 2004
    Publication date: July 14, 2005
    Applicant: MEDIATEK INC.
    Inventors: Ming-Ying Chou, Sung-Yao Lin