Publication number: 20180196170
Abstract: To suppress occurrence of contamination or damage to a lens. In the present technology, for example, a manufacturing apparatus allows a spacer which is thicker than a height of a lens resin portion protruded from a substrate to be adhered to the substrate. In addition, for example, in the present technology, the manufacturing apparatus molds the lens resin portion inside a through-hole formed in the substrate by using a mold frame configured with two layers of molds and, after molding the lens resin portion, in the state that one mold is adhered to the substrate, the manufacturing apparatus demolds the substrate from the other mold. The present technology can be applied to, for example, a lens-attached substrate, a stacked lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic apparatus, a computer, a program, a storage medium, a system, or the like.
Type:
Application
Filed:
July 15, 2016
Publication date:
July 12, 2018
Applicant:
Sony Semiconductor Solutions Corporation
Inventors:
Hiroshi TAZAWA, Toshihiro KUROBE, Sotetsu SAITO, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Toshiaki SHIRAIWA, Minoru ISHIDA