Abstract: The present disclosure relates to a semiconductor device, a solid-state image pickup element, an image pickup device, and an electronic apparatus that are enabled to reduce restrictions on materials and restrictions on device configuration. A CSP imager and a mounting substrate are connected together with a connection portion other than a solder ball. With such a configuration, restrictions on materials and restrictions on device configuration are reduced, which has conventionally occurred because it is limited to a configuration in which solder balls are used for connection. The present disclosure can be applied to image pickup devices.

Abstract: A solid-state image pickup device according to the present disclosure includes: a pixel array unit, unit pixels being arranged in the pixel array unit, the unit pixels each including a plurality of photoelectric conversion sections; and a driving unit that changes a sensitivity ratio of the plurality of photoelectric conversion sections by performing intermittent driving with respect to storing of signal charges of the plurality of photoelectric conversion sections. That is, the solid-state image pickup device according to the present disclosure changes a sensitivity ratio of the plurality of photoelectric conversion sections by performing intermittent driving with respect to storing of signal charges of the plurality of photoelectric conversion sections.

Abstract: A positional shift of a lens of a stacked lens structure is reduced. A plurality of through-holes is formed at a position shifted from a first target position on a substrate according to a first shift. A lens is formed on an inner side of each of the through-holes using a first mold in which a plurality of first transfer surfaces is disposed at a position shifted from a predetermined second target position according to a second shift and a second mold in which a plurality of second transfer surfaces is disposed at a position shifted from a predetermined third target position according to a third shift. The plurality of substrates having the lenses formed therein is formed according to direct bonding, and the plurality of stacked substrates is divided. The present technique can be applied to a stacked lens structure or the like, for example.

Abstract: An imaging apparatus includes: an image generation section that generates at least one of a first captured image having a predetermined size and a second captured image having an aspect ratio different from that of the first captured image; a recording control section that, when an instruction operation to record the generated captured image is received, records the generated captured image based on the instruction operation; and a display control section that, when a captured image to be displayed at the time of displaying the recorded captured image on a display section is the second captured image, displays the second captured image and an enlarged image of a specific region in the second captured image are displayed on the display section in a correlated manner.

Abstract: The present technique relates to a camera module and an electronic apparatus that allow a camera module to be used for various purposes. The camera module includes a first pixel array in which pixels that receive light having an R, G, or B wavelength are two-dimensionally arranged in a matrix form and a second pixel array in which pixels that receive light having a wavelength region of visible light are two-dimensionally arranged in a matrix form and a first optical unit that converges incident light onto the first pixel array and a second optical unit that converges the incident light onto the second pixel array. The present technique can be for example applied to a camera module and the like.

Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.

Abstract: Influence of chipping in case of dicing a plurality of stacked substrates is reduced. Provided is a semiconductor device where a substrate, in which a groove surrounding a pattern configured with a predetermined circuit or part is formed, is stacked. The present technology can be applied to, for example, a stacked lens structure where through-holes are formed in each substrate and lenses are disposed in inner sides of the through-holes, a camera module where a stacked lens structure and a light-receiving device are incorporated, a solid-state imaging device where a pixel substrate and a control substrate are stacked, and the like.

Abstract: Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked. In particular, one or more air grooves formed in surfaces of the substrates reduces an influence of air inside a void portion between adjacent lenses of a layered lens structure.

Abstract: Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked based on an alignment mark. The alignment mark is formed simultaneously with the through-hole. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

Abstract: To suppress occurrence of contamination or damage to a lens. In the present technology, for example, a manufacturing apparatus allows a spacer which is thicker than a height of a lens resin portion protruded from a substrate to be adhered to the substrate. In addition, for example, in the present technology, the manufacturing apparatus molds the lens resin portion inside a through-hole formed in the substrate by using a mold frame configured with two layers of molds and, after molding the lens resin portion, in the state that one mold is adhered to the substrate, the manufacturing apparatus demolds the substrate from the other mold. The present technology can be applied to, for example, a lens-attached substrate, a stacked lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic apparatus, a computer, a program, a storage medium, a system, or the like.

Abstract: A solid-state image pickup device according to the present disclosure includes: a pixel array unit, unit pixels being arranged in the pixel array unit, the unit pixels each including a plurality of photoelectric conversion sections; and a driving unit that changes a sensitivity ratio of the plurality of photoelectric conversion sections by performing intermittent driving with respect to storing of signal charges of the plurality of photoelectric conversion sections. That is, the solid-state image pickup device according to the present disclosure changes a sensitivity ratio of the plurality of photoelectric conversion sections by performing intermittent driving with respect to storing of signal charges of the plurality of photoelectric conversion sections.

Abstract: Provided is a catalyst for solid polymer fuel cell that exhibits excellent initial activity and favorable durability and a method for manufacturing the same. The invention is a catalyst for solid polymer fuel cell which is formed by supporting catalyst particles including platinum, cobalt and manganese on a carbon powder carrier, wherein a composition ratio (molar ratio) among platinum, cobalt and manganese in the catalyst particles is Pt:Co:Mn=1:0.06 to 0.39:0.04 to 0.33, a peak intensity ratio of a Co—Mn alloy appearing in the vicinity of 2?=27° is 0.15 or less with respect to a main peak appearing in the vicinity of 2?=40° in X-ray diffraction analysis of the catalyst particles, and a fluorine compound having a C—F bond is supported at least on the surface of the catalyst particles. The amount of the fluorine compound supported is preferably from 3 to 20% with respect to the entire mass of the catalyst.

Abstract: This technology relates to a solid-state imaging device and an electronic apparatus by which image quality can be enhanced. The solid-state imaging device includes a pixel region in which a plurality of pixels are arranged, a first wiring, a second wiring, and a shield layer. The second wiring is formed in a layer lower than that of the first wiring, and the shield layer is formed in a layer lower at least than that of the first wiring. This technology is applicable to a CMOS image sensor, for example.

Abstract: A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

Abstract: An imaging apparatus includes: an image generation section that generates at least one of a first captured image having a predetermined size and a second captured image having an aspect ratio different from that of the first captured image; a recording control section that, when an instruction operation to record the generated captured image is received, records the generated captured image based on the instruction operation; and a display control section that, when a captured image to be displayed at the time of displaying the recorded captured image on a display section is the second captured image, displays the second captured image and an enlarged image of a specific region in the second captured image are displayed on the display section in a correlated manner.

Abstract: The invention is a catalyst for solid polymer fuel cell having catalyst particles composed of platinum, cobalt and magnesium supported on a carbon powder carrier, in which a composition ratio (molar ratio) among platinum, cobalt and magnesium in the catalyst particles is Pt:Co:Mg=1:0.4 to 0.5:0.00070 to 0.00095. This catalyst is manufactured by supporting cobalt and magnesium on a platinum catalyst and then conducting a heat treatment and a treatment to be brought into contact with an oxidizing solution, the feature of the catalyst manufactured in this manner includes a peak position of a main peak appearing between 2?=40° and 42° in X-ray diffraction analysis, and the peak position is shifted to from 41.0° to 41.5°.

Abstract: The present technology relates to a semiconductor apparatus, a production method, and an electronic apparatus that enable semiconductor apparatuses to be laminated and the laminated semiconductor apparatuses to be identified. A semiconductor apparatus that is laminated and integrated with a plurality of semiconductor apparatuses, includes a first penetrating electrode for connecting with the other semiconductor apparatuses and a second penetrating electrode that connects the first penetrating electrode and an internal device, the second penetrating electrode being arranged at a position that differs for each of the laminated semiconductor apparatuses. The second penetrating electrode indicates a lamination position at a time of lamination. An address of each of the laminated semiconductor apparatuses in a lamination direction is identified by writing using external signals after lamination. The present technology is applicable to a memory chip and an FPGA chip.

Abstract: An information processing apparatus includes a first optical system, a second optical system, and a casing. The first optical system is configured to input light into a first imaging device. The second optical system is configured to input light into a second imaging device. The casing includes one surface long in a specific direction with the first optical system and the second optical system being arranged in the one surface in an orthogonal direction almost orthogonal to the specific direction. The first optical system and the second optical system are arranged such that an optical axis of the first optical system and an optical axis of the second optical system form an angle in the specific direction.

Abstract: An imaging apparatus includes: an image generation section that generates at least one of a first captured image having a predetermined size and a second captured image having an aspect ratio different from that of the first captured image; a recording control section that, when an instruction operation to record the generated captured image is received, records the generated captured image based on the instruction operation; and a display control section that, when a captured image to be displayed at the time of displaying the recorded captured image on a display section is the second captured image, displays the second captured image and an enlarged image of a specific region in the second captured image are displayed on the display section in a correlated manner.

Abstract: The present invention provides a catalyst for a solid polymer fuel cell, having excellent initial activity and good durability and a production method thereof. The present invention is a catalyst for a solid polymer fuel cell, including catalyst particles composed of platinum or a platinum alloy supported on a carbon powder carrier, the catalyst having sulfo groups (—SO3H) at least on the catalyst particles, and the catalyst further having a fluorine compound having a C—F bond supported at least on the catalyst particles. It is preferred in the catalyst of the present invention that sulfur content is 800 ppm or more and 5000 ppm or less based on the mass of the whole catalyst and the amount of the fluorine compound is 3 mass % or more and 24 mass % or less based on the mass of the whole catalyst.