Abstract: A module includes a first wiring board, a first integrated circuit component mounted on the first wiring board, a second wiring board overlapping with the first wiring board, a second integrated circuit component mounted on the second wiring board, and a connection member disposed between the first wiring board and the second wiring board and configured to electrically connect the first wiring board and the second wiring board, wherein the second integrated circuit component overlaps with the first wiring board and supplies power to the first integrated circuit component via the connection member.

Abstract: An image pickup unit includes: a printed wiring board provided with an image pickup element and having a first electrode on a surface layer; a flexible wiring substrate having a base member having first and second faces, a conductive layer provided on the first face, and an insulating layer provided on the conductive layer, wherein the conductive layer has a second electrode in which the insulating layer is not provided to one longitudinal end part; a conductive connection member that connects the first electrode to the second electrode; and a reinforcement member provided on the base member on the second face side, wherein the reinforcement member continuously covers an end part of the insulating layer on a side closer to the second electrode and an end part of the conductive connection member on a side closer to the insulating layer of a portion connected to the second electrode.

Abstract: A flexible wiring board includes: an insulator; a wiring layer supported by the insulator; a first terminal unit including connection terminals provided at one end of the wiring layer; and a second terminal unit including connection terminals provided at the other end. A portion of the wiring layer from a part adjacent to the first terminal unit to a part adjacent to the second terminal unit is provided between first and second insulator layers included in the insulator. First and second holes formed in the first or second insulator layer are provided in an intermediate portion in a first direction from the first terminal unit to the second terminal unit and are spaced apart from each other in the first direction, and an insulator region adjacent to the first hole in a second direction is adjacent to at least a part of the second hole in the first direction.

Abstract: A semiconductor module includes a semiconductor device having a first land, a second land, and a third land, a wiring board having a substrate, and a fourth land, a fifth land, and a sixth land disposed on the main surface of the substrate, a chip component having a first electrode and a second electrode disposed across a distance in the longitudinal direction and being disposed between the wiring board and the semiconductor device, a first solder joint for bonding the first land, the fourth land, and the first electrode, a second solder joint for bonding the second land, the fifth land, and the second electrode, and a third solder joint for bonding the third land and the sixth land. The volume of the first solder joint and the volume of the second solder joint are each larger than the volume of the third solder joint.

Abstract: An electronic module includes a rigid printed circuit member having a first electrode, a flexible printed wiring member having a second electrode, and a solder member having first, second, and third portions. A first direction is perpendicular to, and a second direction is parallel to, a joined surface between the first electrode and the solder member. In the first direction, a second region of the first electrode partially overlaps a leading edge of the second electrode. In the second direction, the second portion is located between the first portion and the third portion and is continuous to each of the first portion and the third portion. A height of the third portion from a reference surface including the joined surface is larger than a height of the second portion from the reference surface and is smaller than a height of the first portion from the reference surface.

Abstract: A printed circuit board includes an electronic component including a first land, a printed wiring board including a resist portion and a second land, and a connecting portion interconnecting the first land and the second land. An opening larger than the first land in plan view from the electronic component side is defined in the resist portion. In plan view from the electronic component side, the first land is disposed inside the opening, the second land including a body portion disposed inside the opening and a protruding portion protruding from the body portion, the body portion being disposed further on an inside than an outer edge of the first land, and at least part of the protruding portion protruding further to an outside than the first land.

Abstract: An electronic module includes at least one electronic component including a first principal surface, first and second electrodes on the first principal surface, a wiring board including a second principal surface, third and fourth electrodes on the second principal surface, and a conductive resin portion. The conductive resin portion includes at least one first conductive resin portion joining the first and third electrodes, and at least one second conductive resin portion joining the second and fourth electrodes. The electronic module further includes at least one reinforcing resin portion that is disposed between at least one first and at least one second conductive resin portions and joins the first principal surface of the electronic component with the second principal surface of the wiring board.

Abstract: An electronic module includes a first wiring board, a second wiring board, and an intermediate connection member. The intermediate connection member includes an insulator, a plurality of first wirings supported by the insulator and arranged at intervals in a second direction intersecting a first direction, a plurality of second wirings supported by the insulator and arranged at intervals in the second direction, and a metal layer supported by the insulator and interposed between the plurality of first wirings and the plurality of second wirings so as to oppose the plurality of first wirings and the plurality of second wirings in a third direction intersecting the first direction and the second direction. A part of the metal layer sandwiched in the insulator is bonded to one of the first wiring board or the second wiring board by a conductive first bonding member.

Abstract: An electronic module has a flexible wiring member, a wiring circuit board, and a conductive connection member. The flexible wiring member has a flexible base, a first wiring layer formed on at least one face of the flexible base, and a first electrode formed of the first wiring layer at the end part that is not covered by a first insulating layer. The wiring circuit board has a base provided with a wiring, a second insulating layer having opening formed on at least one face of the base, and a second electrode formed in the opening. The conductive connection member connects the first electrode and the second electrode to each other. The end of the flexible wiring member is arranged above the opening in plan view.

Abstract: A method of manufacturing an electronic module includes supplying paste to an electronic component and/or a wiring board. The paste includes solder powder and first resin. The method includes supplying second resin to the electronic component and/or the wiring board. The method includes placing one of the electronic component and the wiring board on another. The method includes curing the second resin to form a second resin portion. The method includes heating the paste to a temperature equal to or higher than a solder melting point after the second resin portion is formed. The method includes solidifying molten solder at a temperature lower than the solder melting point to form a solder portion that bonds the electronic component and the wiring board. The method includes curing the first resin after the solder portion is formed, to form a first resin portion.

Abstract: An electronic module has a flexible wiring member, a wiring circuit board, and a conductive connection member. The flexible wiring member has a flexible base, a first wiring layer formed on at least one face of the flexible base, and a first electrode formed of the first wiring layer at the end part that is not covered by a first insulating layer. The wiring circuit board has a base provided with a wiring, a second insulating layer having opening formed on at least one face of the base, and a second electrode formed in the opening. The conductive connection member connects the first electrode and the second electrode to each other. The end of the flexible wiring member is arranged above the opening in plan view.

Abstract: A semiconductor module includes a semiconductor device having a first land, a second land, and a third land, a wiring board having a substrate, and a fourth land, a fifth land, and a sixth land disposed on the main surface of the substrate, a chip component having a first electrode and a second electrode disposed across a distance in the longitudinal direction and being disposed between the wiring board and the semiconductor device, a first solder joint for bonding the first land, the fourth land, and the first electrode, a second solder joint for bonding the second land, the fifth land, and the second electrode, and a third solder joint for bonding the third land and the sixth land. The volume of the first solder joint and the volume of the second solder joint are each larger than the volume of the third solder joint.

Abstract: A flexible wiring board includes: an insulator; a wiring layer supported by the insulator; a first terminal unit including connection terminals provided at one end of the wiring layer; and a second terminal unit including connection terminals provided at the other end. A portion of the wiring layer from a part adjacent to the first terminal unit to a part adjacent to the second terminal unit is provided between first and second insulator layers included in the insulator. First and second holes formed in the first or second insulator layer are provided in an intermediate portion in a first direction from the first terminal unit to the second terminal unit and are spaced apart from each other in the first direction, and an insulator region adjacent to the first hole in a second direction is adjacent to at least a part of the second hole in the first direction.

Abstract: A wiring component includes a first wiring portion including a plurality of wirings arranged side by side in a first direction, a second wiring portion including a plurality of wirings arranged side by side in a second direction, and a coupling portion configured to couple the first wiring portion and the second wiring portion to each other, wherein an angle formed by the first direction and the second direction is changeable by deformation of the coupling portion.

Abstract: A printed circuit board includes an electronic component including a first base and a plurality of first lands, the first base including a first main surface, the plurality of first lands being disposed around a first portion of the first main surface and spaced from each other, a printed wiring board including a second base and a plurality of second lands, the second base including a second main surface, the plurality of second lands being disposed around a second portion of the second main surface and spaced from each other, bonding portions configured to bond the first lands and the second lands, a resin portion configured to cover the bonding portions and including cured thermosetting resin, and a member having a property to repel uncured thermosetting resin and disposed on one of the first portion and the second portion.

Abstract: A module includes a first wiring board, a first integrated circuit component mounted on the first wiring board, a second wiring board overlapping with the first wiring board, a second integrated circuit component mounted on the second wiring board, and a connection member disposed between the first wiring board and the second wiring board and configured to electrically connect the first wiring board and the second wiring board, wherein the second integrated circuit component overlaps with the first wiring board and supplies power to the first integrated circuit component via the connection member.

Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.

Abstract: An imaging unit includes: an imaging sensor module having a printed wiring board on which an imaging element is provided; a flexible printed circuit board connected to a connecting portion of the printed wiring board; an elastic member provided on a face having the connecting portion of the printed wiring board; and an image stabilization unit having a fixing portion that fixes the flexible printed circuit board, the imaging sensor module is movable with respect to the image stabilization unit, and the elastic member holds the flexible printed circuit board.

Abstract: An intermediate connection member includes a first insulating substrate portion, a second insulating substrate portion, an insulating layer portion provided between the first insulating substrate portion and the second insulating substrate portion and formed from a different material from the first insulating substrate portion and the second insulating substrate portion, a plurality of first wiring portions provided between the first insulating substrate portion and the insulating layer portion so as to extend in a first direction such that both end portions of the plurality of first wiring portions in the first direction are exposed to an outside, and a plurality of second wiring portions provided between the second insulating substrate portion and the insulating layer portion so as to extend in the first direction such that both end portions of the plurality of second wiring portions in the first direction are exposed to the outside.

Abstract: An image pickup unit includes: a printed wiring board provided with an image pickup element and having a first electrode on a surface layer; a flexible wiring substrate having a base member having first and second faces, a conductive layer provided on the first face, and an insulating layer provided on the conductive layer, wherein the conductive layer has a second electrode in which the insulating layer is not provided to one longitudinal end part; a conductive connection member that connects the first electrode to the second electrode; and a reinforcement member provided on the base member on the second face side, wherein the reinforcement member continuously covers an end part of the insulating layer on a side closer to the second electrode and an end part of the conductive connection member on a side closer to the insulating layer of a portion connected to the second electrode.