Abstract: A method of manufacturing an electronic module includes supplying paste to an electronic component and/or a wiring board. The paste includes solder powder and first resin. The method includes supplying second resin to the electronic component and/or the wiring board. The method includes placing one of the electronic component and the wiring board on another. The method includes curing the second resin to form a second resin portion. The method includes heating the paste to a temperature equal to or higher than a solder melting point after the second resin portion is formed. The method includes solidifying molten solder at a temperature lower than the solder melting point to form a solder portion that bonds the electronic component and the wiring board. The method includes curing the first resin after the solder portion is formed, to form a first resin portion.

Abstract: An image pickup module includes a printed wiring board, an electronic component, solder, and a thermosetting resin. The printed wiring board has a first surface provided with first lands. The electronic component includes an image pickup element and has a second surface provided with second lands. The thermosetting resin is in contact with the solder and bonds the printed wiring board to the electronic component. The solder bonds the first lands to the second lands and has a hollow portion. The area of the hollow portion is 5% to 50% of the total area of the solder as observed from the electronic component side in a transmission mode using an X-ray.

Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.

Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.

Abstract: An imaging unit includes: an imaging sensor module having a printed wiring board on which an imaging element is provided; a flexible printed circuit board connected to a connecting portion of the printed wiring board; an elastic member provided on a face having the connecting portion of the printed wiring board; and an image stabilization unit having a fixing portion that fixes the flexible printed circuit board, the imaging sensor module is movable with respect to the image stabilization unit, and the elastic member holds the flexible printed circuit board.

Abstract: An electronic module has a flexible wiring member, a wiring circuit board, and a conductive connection member. The flexible wiring member has a flexible base, a first wiring layer formed on at least one face of the flexible base, and a first electrode formed of the first wiring layer at the end part that is not covered by a first insulating layer. The wiring circuit board has a base provided with a wiring, a second insulating layer having opening formed on at least one face of the base, and a second electrode formed in the opening. The conductive connection member connects the first electrode and the second electrode to each other. The end of the flexible wiring member is arranged above the opening in plan view.

Abstract: A printed circuit board includes an electronic component including a first land, a printed wiring board including a resist portion and a second land, and a connecting portion interconnecting the first land and the second land. An opening larger than the first land in plan view from the electronic component side is defined in the resist portion. In plan view from the electronic component side, the first land is disposed inside the opening, the second land including a body portion disposed inside the opening and a protruding portion protruding from the body portion, the body portion being disposed further on an inside than an outer edge of the first land, and at least part of the protruding portion protruding further to an outside than the first land.

Abstract: An image pickup module includes a printed wiring board, an electronic component, solder, and a thermosetting resin. The printed wiring board has a first surface provided with first lands. The electronic component includes an image pickup element and has a second surface provided with second lands. The thermosetting resin is in contact with the solder and bonds the printed wiring board to the electronic component. The solder bonds the first lands to the second lands and has a hollow portion. The area of the hollow portion is 5% to 50% of the total area of the solder as observed from the electronic component side in a transmission mode using an X-ray.

Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.

Abstract: A printed circuit board includes an electronic component including a first base and a plurality of first lands, the first base including a first main surface, the plurality of first lands being disposed around a first portion of the first main surface and spaced from each other, a printed wiring board including a second base and a plurality of second lands, the second base including a second main surface, the plurality of second lands being disposed around a second portion of the second main surface and spaced from each other, bonding portions configured to bond the first lands and the second lands, a resin portion configured to cover the bonding portions and including cured thermosetting resin, and a member having a property to repel uncured thermosetting resin and disposed on one of the first portion and the second portion.

Abstract: An electronic component is mounted on the mounting face of a printed wiring board and a plurality of terminals arranged on the mounting face of the printed wiring board are respectively bonded to a plurality of terminals arranged on the bottom surface of the electronic component by means of solder. Solder paste containing powdery solder and thermosetting resin is provided to the plurality of terminals on the mounting face, then the electronic component is mounted on the mounting face of the printed wiring board, and subsequently the solder paste is heated to bond the corresponding terminals by means of molten solder. Thereafter, the molten solder is allowed to solidify and the thermosetting resin separated from the solder paste is allowed to cure in a state where it is held in contact with metal members arranged separately relative to the terminals.

Abstract: An electronic component is mounted on the mounting face of a printed wiring board and a plurality of terminals arranged on the mounting face of the printed wiring board are respectively bonded to a plurality of terminals arranged on the bottom surface of the electronic component by means of solder. Solder paste containing powdery solder and thermosetting resin is provided to the plurality of terminals on the mounting face, then the electronic component is mounted on the mounting face of the printed wiring board, and subsequently the solder paste is heated to bond the corresponding terminals by means of molten solder. Thereafter, the molten solder is allowed to solidify and the thermosetting resin separated from the solder paste is allowed to cure in a state where it is held in contact with metal members arranged separately relative to the terminals.

Abstract: The invention provides a liquid ejection head including a substrate provided with an energy-generating element for generating energy utilized for ejecting a liquid; and a nozzle plate provided with an ejection orifice from which the liquid is ejected as a droplet and an opening from which a static-removable gas for electrically neutralizing the droplet is jetted, the nozzle plate being joined to the substrate.

Abstract: The invention provides a liquid ejection head including a substrate provided with an energy-generating element for generating energy utilized for ejecting a liquid; and a nozzle plate provided with an ejection orifice from which the liquid is ejected as a droplet and an opening from which a static-removable gas for electrically neutralizing the droplet is jetted, the nozzle plate being joined to the substrate.

Abstract: A liquid ejection head includes a plurality of pressure chambers, respectively communicating with a plurality of ejection orifices for ejecting a liquid, for storing the liquid to be ejected from the plurality of ejection orifices. At least a part of a wall portion forming each of the plurality of pressure chambers is formed of a piezoelectric member, and the plurality of pressure chambers causes the plurality of ejection orifices to eject the liquid by deformation of the piezoelectric member. A plurality of space portions is arranged in parallel to the plurality of pressure chambers at intervals, with some of the plurality of space portions being decompressable. A gas permeable member is provided between the pressure chambers and the decompressable space portions so that a gas inside the pressure chambers is exhausted via the decompressable space portions.

Abstract: A manufacturing method provides an airtight container having a first plate structure, a second plate structure having a wiring formed on a surface facing the first plate structure, a frame arranged between the first plate structure and the second plate structure, a first bonding material arranged between the first plate structure and the frame, and a second bonding material arranged between the second plate structure and the frame. The method includes the steps of bonding the first plate structure and the frame by irradiating a first energy beam to the first bonding material by transmitting the first energy beam through the first plate structure, and bonding the second plate structure and the frame by irradiating a second energy beam to the second bonding material by transmitting the second energy beam through the first plate structure and the frame. The first energy beam and the second energy beam are scanned in close proximity to each other and at the same speed.

Abstract: It arranges a bonding material between a pair of base materials having different heat capacities and in which a difference between thermal expansion coefficients thereof is within 10×10?7/° C.; and bonds the pair of the base materials by the bonding material, by irradiating electromagnetic wave to the bonding material to melt and then harden it, wherein a thermal expansion coefficient at part of the bonding material facing one of the pair of the base materials of which the heat capacity is smaller is smaller than a thermal expansion coefficient at part of the bonding material facing the other of the pair of the base materials of which the heat capacity is larger by a difference within 10×10?7/° C., thereby bonding the base materials of which a difference of thermal expansion coefficients is relatively small, as preventing breakage and crack from occurring and further suppressing a degree of warp.

Abstract: An airtight container manufacturing method includes the steps of (a) exhausting an inside of a container through the through-hole; (b) arranging a spacer along a periphery of the through-hole on an outer surface of the container the inside of which has been exhausted; (c) arranging a plate so that the spacer and the through-hole are covered by the plate and a gap is formed along a side surface of the spacer between the plate and the container outer surface; and (d) arranging the cover to cover the plate and bonding the cover and the container outer surface via sealant positioned between the cover and the container outer surface. The sealing includes hardening the sealant after deforming the sealant by pressing the plate with the cover so that the gap is infilled with the sealant.

Abstract: A method of manufacturing a hermetically sealed container provided with first and second substrates includes the steps of disposing, within a chamber, the first and second substrates opposite to each other to form a gap therebetween, and separating an edge portion of at least the first substrate from the second substrate, for processing to warp the first substrate, within the chamber. Additional steps include exhausting a space between the first and second substrates, by exhausting an inside of the chamber in a state of warping the first substrate, and hermetically connecting the first and second substrates through a bonding material, within the chamber, in a state of exhausting the space between the first and second substrates.

Abstract: An airtight container manufacturing method includes the steps of exhausting an inside of a container through a through-hole provided in the container, arranging a plate member having, at its periphery, grooves penetrating the plate member in its plate thickness direction, on an outer surface of the exhausted container, so as to close up the through-hole, and providing a sealant on the plate member. In addition, a cover member covers the plate member via the sealant, and the container is sealed by closing the cover member on the plate member. In the sealing step the sealant is deformed and flows from the adjacent grooves to form a continuous shape and fill a space between the cover member and the outer surface of the container and along the periphery of the plate member.