Abstract: A chipset to support multiple CPU's and a layout method thereof. Those independent signal lines for delivering high frequency clock signals of the chipset are isolated from using by other signals without being multiplexed. Trace length of the independent signal line is shorter than that of the others. The spaces between the independent signal line and others are also larger than that between other signal lines. Signal transmission quality is significantly upgraded because the high frequency clock signal is not multiplexed and isolated from others.

Abstract: A chip set comprising only one graphic interface reference voltage pin. The chip set is installed onto a mother board to control accelerated graphics port. An example of the chip set comprises a corecircuit, a multiplexer, and a comparator. Only one graphic interference voltage lead is required to obtain the required internal reference voltage under different modes. Another example of the chip set connects to a multiplexer by the only graphic interface reference voltage pin. By coupling two pins of the mother board and the accelerated graphics accelerated port, the internal reference voltage can be controlled.

Abstract: A voltage converter for supporting a suspension-to-RAM (STR) mode of power management. The voltage converter has a flip-flop, a resume & initialization logic circuit for producing a resume signal, a STR logic circuit for producing a STR signal, a first voltage-conversion unit and a second voltage-conversion unit. An output terminal of the resume & initialization logic circuit is connected to a first input terminal of the flip-flop. An output terminal of the STR logic circuit is connected to a second input terminal of the flip-flop. An output terminal of the flip-flop is connected to the first voltage-conversion unit, and a complementary output terminal of the flip-flop is connected to the second voltage-conversion unit. A suspension voltage or a power voltage is applied to the voltage pin of a system memory depending on the mode of power management.

Abstract: A memory accessing and controlling unit that controls the transfer of data between a CPU and a memory cluster. The memory accessing and controlling unit comprises a CPU interface circuit and a memory controlling circuit. When the CPU interface circuit picks up a data read request signal from the CPU, a corresponding internal data read request is forwarded to the memory controlling circuit. Next, the memory controlling circuit is sent out some controlling instructions to the memory cluster for reading out the requested data to the CPU. If the CPU also sends out an L1 write-back signal some time later, the memory controlling circuit immediately terminates the current reading operation so that data from the CPU can be written back to the memory cluster.

Abstract: A mother board and a computer system capable of flexibly using the SDRAM and the DDRAM. The mother board has several memory module slots, a voltage comparator, a clock generator and a chip set. Each of the memory module slots comprises a reference voltage pin, and the reference voltage pins of the memory module slots are connected to each other in parallel. The voltage comparator is coupled to the reference voltage pins of the memory module slots to detect whether the voltage at the reference voltage pin is equivalent to a reference voltage. The clock generator is coupled to an output of the voltage comparator. When the voltage at the reference voltage pin is equal to the reference voltage, a differential clock signal is generated, and when the votlage is different from the reference voltage, a normal clock signal is generated. The chip set is coupled to the output of the voltage comparator. When the voltage is equal to the reference voltage, the chip set is operated under a double data rate mode.

Abstract: A system can produce a suitable voltage for powering the memory modules plugged into the memory module slots of a motherboard. A power-good signal is issued when the motherboard is powered up. A power safety device on the motherboard then issues a 2.5V to the memory module slot. If DDR DRAM type of memory modules are not detected after a while, the power safety device will turn off the 2,5V supply and provide a 3.3V, which is suitable for SDRAM type memory modules.This invention avoids sending a 3.3V to DDR DRAM modules, thereby burning the memory chip. The presence of DDR DRAM modules can be detected by a general-purpose purpose input/output port through accessing the recorded data in the EEPROM of the memory module. Alternatively, memory module type can be determined by sending out a low-current pulse signal to the memory module slot. Hence, a suitable voltage source is automatically provided to power the memory modules in the slots.

Abstract: A power controller for a computer system capable of supporting multiple processor types. The power controller receives a voltage identification signal from the microprocessor and a microprocessor selection signal from a motherboard to provide a correct voltage specification signal and terminal voltage to the microprocessor. The invention also provides voltage specification signals and terminal voltages to the motherboard of a computer system that can support a multiple of processor types.

Abstract: A software-based simulation system is provided, which can provide the combined functionality of a South Bridge test module and a North Bridge test module based solely on either one of the two modules, i.e., either the South Bridge test module or the North Bridge test module without having to use both. This software-based simulation system is characterized in the use of a PCI master modeling circuit and a PCI slave modeling circuit which are capable of simulating the functionality of the North Bridge chipset in the case that only the South Bridge chipset and no North Bridge chipset is included in the simulation system, and are further capable of simulating the functionality of the South Bridge chipset in the case that only the North Bridge chipset and no South Bridge chipset is included in the simulation system.

Abstract: A multi-option setting device is provided for use in association with a connecting pin of a chipset for allowing user-selection from more than two setting options to set the chipset to perform one of more than two I/O functions through the associated connecting pin. The multi-option setting device includes voltage setting means for generating a user-specified input voltage; voltage comparison circuits for use to determine which pre-specified voltage range the user-specified input voltage lies; and latch circuits each for latching the corresponding output of the voltage comparison circuits. This allows the associated connecting pin to be optionally set to be used for a user-specified I/O function.

Abstract: A ball grid array packaging structure for sealing a silicon chip on a substrate is disclosed. The substrate includes a front wiring layer and a back wiring layer. The front wiring layer includes a plurality of inner power rings and an outer power ring. The inner power rings are attached and together they surround a central region where the silicon chip is attached. The inner power rings and the outer power ring have a substantially identical width and the outer power ring surrounds all the inner power rings. The back wiring layer has a large number of interface power balls and core power balls. The interface power balls may be further subdivided into groups of inner power balls, while each group of inner power balls corresponds and couples with one of the inner power rings of the front wiring layer. The core power balls connect with the outer power ring and surround the interface power balls.

Abstract: A data processing system including a control chip, a central processing unit and a printed circuit board is disclosed. The control chip has a substrate stack that includes, from top to bottom, a first signal layer, a first reference layer at a first reference voltage, a second reference layer at a second reference voltage and a second signal layer. The central processing unit has a substrate stack that includes, from top to bottom, a third signal layer, a third reference layer at the first reference voltage, a fourth reference layer at the second reference voltage and a fourth signal layer. The printed circuit board has a stack structure that includes, from top to bottom, a fifth signal layer, a fifth reference layer at the first reference voltage, a sixth reference layer at the second reference voltage and a sixth signal layer. The second signal layer of the control chip and the fourth signal layer of the central processing unit are adjacent to the fifth signal layer.

Abstract: A conductive pad layout is implemented on a substrate for BGA packaging structure. The substrate has a top trace surface on which is attached a chip, and a bottom trace surface. The top trace surface includes a first contact pad, a second contact pad placed closer to the chip than the first contact pad, and a reference contact pad placed adjacent to the second contact pad. A first bonding wire connects the first contact pad to the chip, and second and third bonding wires of shorter length respectively connect the second contact pad and the reference contact pad to the chip. Thereby, critical signal can pass through the second bonding wire and second contact pad with reduced interference. A reference dummy ball pad is also placed adjacent to a ball pad corresponding to the second contact pad on a bottom trace surface of the substrate to reduce interference.

Abstract: A memory access control method and system is provided for use on a computer system having a CPU and a memory unit for controlling the memory access operation by the CPU to the memory unit. The memory unit is of the type having an auto-precharge feature. By this method and system, a CPU interface is coupled to the CPU, which is capable of promptly issuing an internal read-request signal in response to each read request from the CPU and is further capable of generating a cross-page signal concurrently with the internal read-request signal in the event that the data requested by the read request are located in a closed page in the memory unit.

Abstract: The invention provides a method of performing data transfers on a PCI bus between a PCI bus master and a selected device. Wherein, there is a request signal and a grant signal on the PCI bus for a read/write transaction, and during the read/write transaction, the request signal and the grant signal are idle. The method comprises the steps of: (a) driving a first ready signal by the PCI bus master; (b) driving a second read signal by the selected device in response to the first ready signal, which initiates the read/write transaction; (c) using the request signal and the grant signal as a data transfer strobe signal during the write and read transaction, respectively, the data transfer strobe signal has a plurality of clocks; and (d) performing the data transfers on rising and falling edges of the clocks of the data transfer strobe signal.

Abstract: A motherboard with reduced power consumption is disclosed. The motherboard has a memory module slot, a DDR termination array, and a control chip. The DDR termination array couples to the memory module slot and provides a termination resistor that has one terminal coupled to a voltage source. The control chip provides a control signal. When the motherboard enters a power saving mode or before the memory module being inserted in the memory module slot, the control signal gives an indication to the DDR termination array for cutting off the connection between the termination resistor and the memory module slot. A switch and several termination resistors may substitute the DDR termination array as requirements. The control chip provides the control signal to open the switch and therefore cuts off the connections between termination resistors and the voltage source to achieve the power-conserving purpose.

Abstract: A circuit sub-board for regulating constant power source and strengthening ground connections. The circuit sub-board is a double-layered printed circuit board having a large surface power-source layer and a ground-connection layer. The circuit sub-board is utilized to cover the insufficiently ground-covered main board signaling lines as well as insufficiently ground-connected power and ground signaling lines on the main board. With the installation of the circuit sub-board, signals can be transmitted more reliably and with less interference.

Abstract: An input/output buffer capable of supporting multiple transmission logic bus specifications. The input/output buffer has a coordinating controller, a logic control circuit, a first transistor, a second transistor, a first resistor element, and a second resistor element. The logic control circuit picks up a microprocessor-type signal to determine the type of microprocessors used. According to the microprocessor type, conductivity of the first transistor, the second transistor, the first resistor element and the second resistor element are reassigned to fit the particular logic bus specification of the microprocessor. Hence, a single chipset on a main circuit board is able to accommodate various types of microprocessors.

Abstract: A memory access control method and system is provided for use on a computer system to control the memory access operation by a central processing unit (CPU) to a memory unit in a more efficient manner than the prior art. This memory access control method and system is characterized by, for each read request from the CPU, the prompt transfer of the corresponding internal read-request signal to the memory control unit, right after it is issued and without waiting until the CPU issues the L1 write-back signal of the current read request. If the current read request is a hit to the cache memory, a read-stop signal is promptly issued to stop the current read operation on the memory unit, and then a cache write-back operation is performed to write the cache data back into the memory unit. This method and system can help reduce the period of waiting states by the CPU, thus increasing the overall memory access performance by the CPU and the overall system performance of the computer system.

Abstract: An apparatus and a method for supporting multi-processors and a motherboard using the same are provided. The apparatus receives the pins Z36 and AK36 of the Socket-370 central processing unit to determine which type the Socket-370 central processing unit is. According to the suspend status input signal transmitted from the south bridge of the motherboard, the determined result is latched, and some appropriate circuits are coupled to the Socket-370 central processing unit via a switch circuit. Meanwhile, the suspend status input signal is delayed and used to cut off the connection between the Socket-370 central processing unit and the apparatus. The delayed suspend status input signal is further delayed and then sent to an ATX power supply to activate the whole system.

Abstract: A mother board and a computer system capable of flexibly using the SDRAM and the DDRAM. The mother board has several memory module slots, a voltage comparator, a clock generator and a chip set. Each of the memory module slots comprises a reference voltage pin, and the reference voltage pins of the memory module slots are connected to each other in parallel. The voltage comparator is coupled to the reference voltage pins of the memory module slots to detect whether the voltage at the reference voltage pin is equivalent to a reference voltage. The clock generator is coupled to an output of the voltage comparator. When the voltage at the reference voltage pin is equal to the reference voltage, a differential clock signal is generated, and when the votlage is different from the reference voltage, a normal clock signal is generated. The chip set is coupled to the output of the voltage comparator. When the voltage is equal to the reference voltage, the chip set is operated under a double data rate mode.