Patents by Inventor Nan Wang

Nan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11657412
    Abstract: The embodiments of the present disclosure provide systems and methods for outbound forecasting, comprising receiving an initial distribution of priority values to each fulfillment center (FC) in each region, running a simulation, using a simulation algorithm, of the initial distribution, calculating an outbound capacity utilization value of each FC, determining a number of FCs comprising an outbound capacity utilization value that exceeds a predetermined threshold, feeding the simulation algorithm with the determined number of FCs to generate one or more additional distributions of priority values, generating a FC priority filter comprising an optimal set of priority values based on the one or more additional distributions of priority values, and modifying an allocation of a plurality of SKUs among a plurality of FCs based on the generated FC priority filter.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: May 23, 2023
    Assignee: Coupang Corp.
    Inventors: Nan Wang, Ke Ma, Christopher Carlson, Bin Gu, Shixian Li
  • Patent number: 11652674
    Abstract: In one example aspect, a method is provided of preparing a symbol for transmission, the method comprising applying a window function to a symbol to generate a modified symbol, wherein a property of the window function is based on a channel length of a transmission channel over which the modified symbol is to be transmitted, and causing the modified symbol to be transmitted over the transmission channel.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: May 16, 2023
    Assignee: Telefonaktiebolagget LM Ericsson (Publ)
    Inventors: Ang Feng, Tao Huang, Jinlai He, Nan Wang, Dong Wang, Guozhu Li
  • Publication number: 20230126707
    Abstract: An electrical connector configured to connect terminals of battery units in a battery pack includes a body made of an electrically conductive material, the body having at least a first body part and a second body part, and at least one terminal connection part disposed adjacent the first body part configured to connect to the terminal of the battery unit. The at least one terminal connection part includes a first connection component and a second connection component spaced apart from each other. Each of the first and second connection components includes a contact part for contacting the terminal of the battery unit, and a stem connecting the contact part to the body. The stem has a smaller cross section than the contact part. The stem is operable as a fuse configured to cut off an excessively high current.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 27, 2023
    Inventors: Hei Man LEE, Lifeng WANG, Shengfu YU, Weipeng CHEN, Nan WANG, Zexin CHEN
  • Patent number: 11621166
    Abstract: A semiconductor device and a method for forming the semiconductor device are provided. The method includes providing a substrate, and forming a first core layer on the substrate. The substrate includes a pull-up transistor region. The method also includes forming separately arranged second core layers on the first core layer, and forming a first sacrificial sidewall spacer on a sidewall of a second core layer. A gap is formed between adjacent first sacrificial sidewall spacers over the pull-up transistor region. In addition, the method includes removing the second core layers, and then etching the first core layer using the first sacrificial sidewall spacers as a mask until the substrate is exposed. The gap is transferred to a region between adjacent etched first core layers over the pull-up transistor region. Further, after etching the first core layer, the method includes forming a dielectric layer to fully fill the gap.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: April 4, 2023
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventor: Nan Wang
  • Publication number: 20230098671
    Abstract: Semiconductor structure and forming method thereof are provided. The forming method includes: forming a substrate including a power rail region, the power rail region including a first area and a second area, the power rail region having a first fin and a second fin spanning the second area; forming sidewall spacers on sidewall surfaces of the first fin and the second fin after forming the first fin and the second fin; forming a first patterned layer on the substrate, the first patterned layer having a first opening in the first patterned layer exposing the power rail region; etching the substrate using the first patterned layer as a mask to form power rail openings in the substrate; forming isolation films on inner wall surfaces of the power rail openings; and forming buried power rails in the power rail openings after forming the isolation films.
    Type: Application
    Filed: September 26, 2022
    Publication date: March 30, 2023
    Inventor: Nan WANG
  • Publication number: 20230093835
    Abstract: A semiconductor structure and its fabrication method are provided. The semiconductor structure includes: a substrate including a base substrate, fins, and an isolation structure; a first dielectric layer; gate structures in the first dielectric layer, where each gate structure includes a gate electrode layer and a gate dielectric layer; air spacers and second spacers on sidewalls of gate electrode layers, where the air spacers are located between the gate electrode layers and the second spacers to expose the sidewalls of the gate electrode layers and the second spacers; source/drain layers in the fins at sides of each gate structure; first conductive structures in the first dielectric layer and on the source/drain layers; and a second dielectric layer on the first dielectric layer and the gate structures, located on the air spacers. The air spacers are also located between the first conductive structures and the gate electrode layers.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 30, 2023
    Inventor: Nan WANG
  • Publication number: 20230066327
    Abstract: A method for controlling the transparency level in smart glass is provided. The method includes receiving a signal indicative of an ambient light intensity from a sensor in a smart glass, selecting a transparency level for an eyepiece in the smart glass based on the signal, and providing the transparency level to a control circuit so that the eyepiece can receive a desired current to activate a dimming device in the eyepiece to a desired level.
    Type: Application
    Filed: August 19, 2022
    Publication date: March 2, 2023
    Inventors: Nan Wang, Johana Gabriela Coyoc Escudero, Julian Joseph Maurice Fessard, Cory Angelo Harris, Melinda Dora Szabo
  • Patent number: 11595386
    Abstract: Techniques for storage management involve: receiving, at a storage server, an access request for target data from a client, wherein the access request occurs in a session between the storage server and the client; determining, based on attribute information of the client, security information of the session, wherein the security information indicates whether the session is subjected to antivirus protection; and executing, based on the security information, an access operation specified by the access request on the target data. Therefore, the performance of the storage server can be improved while the security of the storage server is ensured.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: February 28, 2023
    Assignee: EMC IP Holding Company LLC
    Inventors: Ying Yu, Jing Li, Ming Yue, Jia Huang, Nan Wang
  • Patent number: 11589476
    Abstract: A computing system includes a liquid cooled segment and an air cooled segment that are both removably received and secured inside a chassis with a fixed physical arrangement relative to one another. The fluid cooled segment includes an enclosure forming an enclosed space for placement of one or more high heat generating components. The enclosed space being in fluid communication with an inlet tube for receiving a cooling fluid and an outlet tube for expelling the cooling fluid that has been used to cool the high heat generating components. The enclosure includes a leak proof connector configured on the enclosure. The air cooled segment includes one or more reduced heat generating components. The reduced heat generating components are electrically coupled to the high heat generating components through the leak proof connector.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: February 21, 2023
    Inventors: Xin Zhi Ma, Nan Wang
  • Publication number: 20230050121
    Abstract: A process is provided for capturing fines present in fluid fine tailings, in particular, in oil sands fluid fine tailings (FFT), present in a tailings containment structure by spreading coarse sand into the tailings containment structure below an interface that has formed between a water cap and the fluid fine tailings to form a uniform, non-segregating and homogenous fines-rich, a high total solids content mixture that will ultimately form a beach below FFT (BB-FFT) at the bottom of the tailings containment structure.
    Type: Application
    Filed: August 5, 2022
    Publication date: February 16, 2023
    Inventors: Nan WANG, James LORENTZ, George DOGBE, Wayne MIMURA
  • Publication number: 20230038672
    Abstract: One or more processors of a computing system, such as a server architecture, such as a disaggregated server architecture. The one or more processors are to access cable information pertaining to a cable coupled to an I/O port of the computing system. The one or more processors are to configure a first memory circuitry of the computing system based on the cable information. A cable structure includes the cable, and further includes a second memory circuitry storing the cable information, and accessible by the one or more processors.
    Type: Application
    Filed: October 25, 2022
    Publication date: February 9, 2023
    Applicant: Intel Corporation
    Inventors: Nan Wang, Zhiming Li, Rudong Shi, Francisco Javier Lasa Gutierrez
  • Publication number: 20230041202
    Abstract: A device including a frame and an eyepiece is provided. The eyepiece includes a front glass, a rear glass, and an active element sandwiched between the front glass and the rear glass. The active layer is electrically activated, via an interconnect, by a flex circuit enclosed between a top portion of the frame and a cap, the flex circuit including a memory and a processor. A method for assembling the above device is also provided.
    Type: Application
    Filed: July 12, 2022
    Publication date: February 9, 2023
    Inventors: Igor Markovsky, Johana Gabriela Coyoc Escudero, Demetrios Basil Karanikos, Brandon Potens, Rafat Mehdi, Sebastian Sztuk, Pablo Castillo Canales, Eric Daniels, Andriy Pletenetskyy, Abhinav Subramani, Jaykishan Dakshesh Choksi, Katherine Suzi Torigoe, Raymond Lee, Evan Lawrence Coons, Yi-Chen Kuo, Kai Tashima McKenney, Simon David-Levinskas Hodgson, Trevor Grant Boswell, Punit Narendra Govenji, Nan Wang, Melinda Dora Szabo, Yewching Chen, Afsoon Jamali
  • Patent number: 11545552
    Abstract: A semiconductor structure and a method for forming the same are provided. One form of a forming method includes: providing a base, the base including a device region and a dummy device region, the base including an isolation layer, gate structures located on the isolation layer, a first mask layer located on the gate structures, a source-drain plug located between the gate structures and on the isolation layer, and a second mask layer located on the source-drain plug. In implementations of the present disclosure, the first mask layer and the second mask layer on the dummy device region are separately removed. Correspondingly, the first opening and the second opening respectively expose the gate structures and the source-drain plug in the dummy device region. The gate structures exposed by the first opening and the source-drain plug exposed by the second opening are removed in the same step.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: January 3, 2023
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventor: Nan Wang
  • Patent number: 11546299
    Abstract: Described herein are systems, methods, and software to enhance firewall implementation for virtual machines. In one implementation, a method of managing firewall rules for a virtual machine includes identifying, in the virtual machine, an attach process for one or more applications to the virtual machine. The method further includes, identifying one or more firewall rules that correspond to the one or more applications and providing the one or more firewall rules to networking manager for the virtual machine.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: January 3, 2023
    Assignee: VMware, Inc.
    Inventors: Nan Wang, YiSan Zhao, Shengbo Teng, Wen Wang, Peter Zhang
  • Publication number: 20220415044
    Abstract: The present disclosure provides a method, apparatus, medium and device for extracting a river drying-up region and frequency, and belongs to the technical field of remote sensing. The method for extracting a river drying-up region and frequency can be applied to efficiently acquiring river drying-up information for a long time within the large spatial region. With the inverse normalized difference water index (iNDWI) and the maximum value composite (MVC) method for the remote sensing images, the present disclosure omits the troublesome step of separately extracting a river range for each image in the conventional method. In addition, the present disclosure quickly obtains the drying-up frequency by counting the total number of available images and the number of non-water images at the same pixel position, and yields a greater efficiency for extracting the river drying-up region and frequency.
    Type: Application
    Filed: April 26, 2022
    Publication date: December 29, 2022
    Inventors: Chen WANG, Jixi GAO, Chao WANG, Jianhui ZHANG, Xuelei WANG, Yihuang NIE, Xing JIA, Huan ZHAO, Shoujing YIN, Qian ZHAO, Xiaogang ZHANG, Yanting WU, Dan XU, Hao SUN, Nan WANG, Hongyan YANG, Bin MENG, Yaming ZHOU
  • Publication number: 20220403165
    Abstract: A one-component type polyurethane prepolymer composition comprises a reaction product formed through a reaction between reactants comprising (a) at least one polyisocyanate, and (b) a polyol blend comprising at least one bifunctional polyether polyol, wherein the bifunctional polyether polyol is a homopolymer of propylene oxide, homopolymer of butylene oxide, or copolymer of alkylene oxide, and has a number average molecular weight from 3000 g/mol to 9000 g/mol, and at least one trifunctional polyether polyol, wherein the trifunctional polyether polyol is a copolymer of alkylene oxide and end-capped with 10 wt % to 28 wt %, by the total weight of the trifunctional polyether polyol, of ethylene oxide, and has a number average molecular weight from 5000 g/mol to 8000 g/mol, wherein the bifunctional polyether polyol and the trifunctional polyether polyol are present in a parts by weight ratio from 4:1 to 2.
    Type: Application
    Filed: August 6, 2019
    Publication date: December 22, 2022
    Inventors: Cheng Shen, Nan Wang, Gang Sun, Masayuki Suzuki, Jiawen Xiong, Wei Li
  • Publication number: 20220389295
    Abstract: Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening agent and a compatibilizer which has at least one silane group and at least one epoxy terminal group. The curable composition exhibits enhanced adhesion strength and good elongation at break. A method for applying the curable composition on the surface of a substrate is also provided.
    Type: Application
    Filed: November 15, 2019
    Publication date: December 8, 2022
    Inventors: Zhengming Tang, Yongchun Chen, Xiuqing Xu, Hongyu Chen, Xuemei Zhai, Ke Shi, Nan Wang, Qingwei Meng
  • Publication number: 20220389276
    Abstract: Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening-compatibilizing agent which has at least one silane group and at least two amine groups. The curable composition exhibits enhanced adhesion strength and good elongation at break. A method for applying the curable composition on the surface of a substrate is also provided.
    Type: Application
    Filed: November 15, 2019
    Publication date: December 8, 2022
    Inventors: Zhengming Tang, Yongchun Chen, Xiuqing Xu, Hongyu Chen, Ke Shi, Nan Wang, Qingwei Meng
  • Publication number: 20220380515
    Abstract: Described is a curable composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; a compatibilizer having at least one silane group and at least one epoxy terminal group or at least one nitrogen-containing groups; and optionally a hardening agent; wherein the composition further optionally comprises at least one of a nitrogen-containing unsaturated heterocyclic compound catalyst and a nitrogen-containing phenol catalyst. The curable composition exhibits high hermeticity, fast curing speed, quick adhesion build up, dry surface and strong adhesion strength. A method for applying the curable composition on the surface of a substrate is also provided.
    Type: Application
    Filed: November 15, 2019
    Publication date: December 1, 2022
    Inventors: Yongchun Chen, Zhengming Tang, Hongyu Chen, Jian Kang, Xiuqing Xu, Nan Wang, Qingwei Meng, Chuanwei Zuo
  • Publication number: 20220365017
    Abstract: A pH measurement system includes a measurement apparatus that is capable of connection to a mobile device and a server and that includes a measuring instrument and a monitoring device. The measuring instrument includes a tube, and a sensor rod that is disposed is the tube and that is for sensing a pH value of a measurement target. The monitoring device includes a microcontroller communicatively connected to the sensor rod, an operation module for operation by a user, a communication module for communication with the mobile device and the server, and a display module for displaying information. The microcontroller provides the pH value to the mobile device or the server through the communication module.
    Type: Application
    Filed: December 27, 2021
    Publication date: November 17, 2022
    Inventors: Chang-Hsien Tai, Yao-Nan Wang, Cheng-Huei Yang, Chin-Lung Chang, Tsung-Che Wu