Abstract: A wiring circuit board includes a metal supporting layer, an insulating base layer, and a wiring layer. The wiring circuit board further includes a plurality of streak groove portions disposed on one surface of the metal supporting layer in the thickness direction and a plurality of concave portions depressed in the metal supporting layer in the thickness direction. The plurality of concave portions forms a dot pattern. Each of the dots in the dot pattern has one concave surface. The concave surface has an approximately spherical cap shape or an approximately cone shape.

Abstract: A wiring circuit board includes a base insulating layer; a first wiring disposed on the base insulating layer; an intermediate insulating layer disposed on the base insulating layer so as to cover the first wiring; a second wiring disposed on the intermediate insulating layer; a single layer first terminal, disposed on the base insulating layer, and electrically connected to the first wiring; and a single layer second terminal, disposed on the base insulating layer, and electrically connected to the second wiring. The first terminal is continuous with the first wiring. The second terminal is discontinuous from the second wiring. The wiring circuit board further includes a connecting portion disposed on the base insulating layer and continuous with the second terminal to electrically connect to the second wiring.

Abstract: A blockchain system is capable of reducing the generation of isolated blocks and unfairness among miners resulting from block propagation delays caused by an increase in block data size. Each block is divided into part A and part B, and transaction information is stored in part B. After the miner receives Part A of a certain block and before the reception of Part B is completed, the miner determines the transaction data to be included in the next block after the received block from the information stored in Part A and starts mining the next block after the received block. In addition, the miner maintains multiple blockchains in case the reception of part B is not completed, and switches the blockchain to be mined according to the conditions.

Abstract: A semiconductor light-emitting apparatus includes: a package substrate; a semiconductor light-emitting element flip-chip bonded on the package substrate; and a sealing member that covers the semiconductor light-emitting element on the package substrate and has translucency at an emission wavelength of the semiconductor light-emitting element. The semiconductor light-emitting element includes an anode electrode and a cathode electrode bonded to the package substrate, a semiconductor layer on the anode electrode and the cathode electrode, and a translucent substrate on the semiconductor layer. The translucent substrate has an upper surface in contact with the sealing member and a side surface in contact with the sealing member between the upper surface and the semiconductor layer, and an area of the side surface is equal to or less than an area of the upper surface.

Abstract: Provided is a wiring circuit board that allows the electrical connection between the elements and the terminals to be easy and sure. The wiring circuit board includes an insulating base layer, a plurality of wires with different thicknesses from each other, and an insulating cover layer sequentially toward an upper side. The wires include a first wire having the greatest thickness. The wiring circuit board further includes a plurality of terminals disposed on an upper surface of the insulating base layer. The terminals are electrically connected with the wires, respectively. The upper surfaces and of the terminals are each located at an upper side as compared to an upper surface of the insulating cover layer (a wire covering portion) covering the first wire.

Abstract: A cleaning device including a disinfection water supply portion to supply cleaning water with a dissolved disinfection component, and a bubble generation portion to contain bubbles into the cleaning water on a downstream side of the disinfection water supply portion.

Abstract: A semiconductor light-emitting apparatus includes: a package substrate; a semiconductor light-emitting element flip-chip bonded on the package substrate; a frame body provided around the semiconductor light-emitting element on the package substrate; and a sealing member that covers an upper surface of the semiconductor light-emitting element on the package substrate, covers an upper surface of the frame body, and has translucency at an emission wavelength of the semiconductor light-emitting element. The upper surface of the semiconductor light-emitting element has a plurality of corner portions, and a distance from each of the plurality of corner portions to the frame body is smaller than a width of the upper surface of the frame body.

Abstract: A semiconductor light-emitting apparatus includes: a package substrate; a frame body provided around the semiconductor light-emitting element on the package substrate; and a semiconductor light-emitting element flip-chip bonded on the package substrate; a sealing member that covers an upper surface of the semiconductor light-emitting element on the package substrate, covers an upper surface of the frame body, and has translucency at an emission wavelength of the semiconductor light-emitting element. A height of the upper surface of the frame body is smaller than a height of the upper surface of the semiconductor light-emitting element. The upper surface of the semiconductor light-emitting element has a plurality of corner portions, and a distance from each of the plurality of corner portions to the frame body is smaller than a width of the upper surface of the frame body.

Abstract: A semiconductor light-emitting apparatus includes: a package substrate; a semiconductor light-emitting element including an anode electrode and a cathode electrode bonded to the package substrate, a semiconductor layer on the anode electrode and the cathode electrode, and a translucent substrate on the semiconductor layer; and a covering member that is in contact with an upper surface of the translucent substrate, has a dome shape that is convex upward, has translucency at an emission wavelength of the semiconductor light-emitting element, has a lower refractive index than the translucent substrate, and that is not in contact with the package substrate.

Abstract: A semiconductor light-emitting apparatus includes: a package substrate; a semiconductor light-emitting element flip-chip bonded on the package substrate; a frame body provided around the semiconductor light-emitting element on the package substrate; and a sealing member that covers the semiconductor light-emitting element on the package substrate, covers an upper surface of the frame body, and has translucency at an emission wavelength of the semiconductor light-emitting element. A height of the upper surface of the frame body is smaller than a height ha of an upper surface of the semiconductor light-emitting element.

Abstract: A setting apparatus includes: a CPU and a memory connected to the CPU. The memory is configured to store information regarding each of a plurality of users individually using a single space. The CPU is configured to perform: identifying a user to use the space; authenticating the user identified in the identifying; setting devices provided in the space based on the information stored in the memory. The information stored in the memory includes: first information; and second information given stricter restriction than the first information. The CPU is configured to perform: the setting including performing a predetermined setting of the devices provided in the space based on the first information of the user identified in the identifying.

Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

Abstract: A light output prediction method for nitride semiconductor light-emitting element that is a method for predicting light output of a nitride semiconductor light-emitting element, the method including a model creation step of creating a trained model by learning at least a correlation of at least one of a composition parameter or a physical property parameter of a layer constituting the nitride semiconductor light-emitting element and a manufacturing condition parameter, relative to light output of the nitride semiconductor light-emitting element; and a light output prediction step of predicting light output using the trained model. In the model creation step, at least one of the composition parameter or the physical property parameter of a predetermined layer of the nitride semiconductor light-emitting element is used for the learning, and a growth temperature of the predetermined layer is used as the manufacturing condition parameter for the learning.

Abstract: A lifetime prediction method for nitride semiconductor light-emitting element that is a method for predicting lifetime of a nitride semiconductor light-emitting element, the method including a model creation step of creating a trained model by learning at least a correlation of at least one of a composition parameter or a physical property parameter of a layer constituting the nitride semiconductor light-emitting element and a manufacturing condition parameter, relative to lifetime of the nitride semiconductor light-emitting element; and a lifetime prediction step of predicting lifetime using the trained model. In the model creation step, at least one of the composition parameter or the physical property parameter of a predetermined layer of the nitride semiconductor light-emitting element is used for the learning, and a growth temperature of the predetermined layer is used as the manufacturing condition parameter for the learning.

Abstract: A substrate processing system provided with a plurality of apparatuses to perform a patterning on a plurality of the substrates, wherein a transfer container accommodating the plurality of substrates is transferred to the plurality of apparatuses in a sequential manner. The substrate processing system includes: a first apparatus of the plurality of apparatuses, which is configured to form a metal-containing resist film on each substrate; a second apparatus of the plurality of apparatuses, which is configured to perform a development on the metal-containing resist film after exposure; and an atmosphere regulator having an accommodation space where the substrates, on each of which the metal-containing resist film before being subjected to the development is formed, are accommodated and configured to regulate an atmosphere of the accommodation space so as to regulate a degree of progress of a reaction of the metal-containing resist film on each substrate.

Abstract: A mobile object setting system includes a setting device configured to perform a process of setting equipment provided in a mobile object and a plurality of terminal devices capable of communicating with the setting device. The setting device includes a storage device configured to store a program and setting information of the equipment and a hardware processor. The hardware processor manages the setting information in association with a user of the mobile object by executing the program stored in the storage device, identifies the user of the mobile object based on a result of communicating with the plurality of terminal devices, and acquires the setting information of the equipment associated with the identified user from the storage device to perform the process of setting the equipment based on the acquired setting information. The plurality of terminal devices instruct the setting device to change the setting of the equipment by transmitting the terminal information stored therein to the setting device.

Abstract: A mobile object setting system includes a setting device configured to perform a process of setting equipment provided in a mobile object and a plurality of terminal devices capable of communicating with the setting device. The setting device includes a storage device configured to store a program and setting information of the equipment and a hardware processor. The hardware processor manages the setting information in association with a user of the mobile object by executing the program stored in the storage device, identifies the user of the mobile object, detects a specific action to be performed when the user of the mobile object boards the mobile object, and acquires setting information of the equipment associated with the identified user from the storage device to set the equipment based on the acquired setting information. The hardware processor receives a selection manipulation of the user until a predetermined manipulation is performed after the specific action is detected.

Abstract: A mobile object setting device for setting equipment provided in a mobile object includes a storage device configured to store a program and setting information of the equipment and a hardware processor. The hardware processor manages the setting information in association with a user of the mobile object by executing the program stored in the storage device, registers user information about the user and the setting information of the equipment in the storage device, identifies the user of the mobile object, and acquires the setting information of the equipment associated with the identified user from the storage device to set the equipment based on the acquired setting information.

Abstract: An in-vehicle equipment setup device includes: a storage configured to store user setting information including settings of in-vehicle equipment desired by a user; a setter configured to set a set value in the user setting information of a selected user for the corresponding in-vehicle equipment; a settings comparator configured to acquire a current set value from the in-vehicle equipment and to compare the acquired current set value with a user set value which is a set value in the setting information included in the user setting information of the selected user; and a notifier configured to notify the user. When there is non-set in-vehicle equipment which is in-vehicle equipment of which the user set value is different from the current set value according to a result of the comparison, the settings comparator causes the notifier to notify that there is non-set in-vehicle equipment on the basis of travel information including a traveling state of the vehicle.

Abstract: A moving body setting apparatus can receive an operation terminal ID transmitted from an operation terminal holding the operation terminal ID, and includes: a storage unit storing first information associating the operation terminal ID of the operation terminal with a user ID of a moving body, and second information associating the user ID with setting information of equipment included in the moving body; a user selection unit that selects a user of the moving body, based on a user operation, or based on the operation terminal ID received from the operation terminal, and the first information; a moving body setting unit that acquires, from the second information, setting information of the equipment associated with a user ID of a user selected by the user selection unit, and sets the equipment based on the acquired setting information; and an update unit that updates, when switching of user is performed by the user selection unit based on the user operation, a user ID associated with the operation terminal ID