Abstract: An opto-electric hybrid module is provided, which is excellent in bending resistance and optical element mountability. In the opto-electric hybrid module, a light-path core of an optical waveguide is provided on a surface of an under-cladding layer, and non-light-path dummy cores are provided on opposite sides of the light-path core in spaced relation to the light-path core as projecting from the surface of the under-cladding layer. An electric circuit having mounting pads is provided on top surfaces of the dummy cores. An over-cladding layer is provided on side surfaces and a top surface of the light-path core, and projects to cover the core. The non-light-path dummy cores each have an elastic modulus that is set higher than the elastic modulus of the under-cladding layer and the elastic modulus of the over-cladding layer. The optical element is mounted on the mounting pads, and positioned above the projecting over-cladding layer.

Abstract: In an opto-electric hybrid board according to the present invention, an electrical interconnect line and an optical element are provided on a first surface of a substrate, and an optical waveguide optically coupled to the optical element is provided on a second surface of the substrate. A reinforcement layer for reinforcing the substrate is integrally mounted on the first surface of the substrate on which the electrical interconnect line and the optical element are provided, with an adhesive layer therebetween. A connector pad part for externally electrically connecting the electrical interconnect line is provided on the second surface of the substrate on which the optical waveguide is provided. With this configuration, the reinforcement layer is mounted on the substrate with high strength without adverse effects exerted on the optical element and the optical waveguide.

Abstract: An inventive opto-electric hybrid board includes: opto-electric module portions respectively provided on opposite end portions of an elongated insulation layer and including a first electric wiring of a first electrically conductive pattern and an optical element provided on a front surface of the insulation layer; and an interconnection portion provided on a portion of the insulation layer extending from the opto-electric module portions, and including an elongated optical waveguide on a back surface of the insulation layer optically coupled with the optical elements, and having a light signal transmission core. Further, an electrically conductive dummy pattern is provided on the front surface of the insulation layer in the interconnection portion for reinforcing the interconnection portion. The electrically conductive dummy pattern reinforces the interconnection portion to protect the waveguide from bending and twisting, while ensuring the flexibility of the interconnection portion.

Abstract: An image forming apparatus includes an image scanning section, an exit tray, and an upper housing. The image scanning section scans an image of an original document. The exit tray is disposed below the image scanning section. A sheet bearing an image is ejected onto the exit tray. The upper housing houses the image scanning section. The image forming apparatus has a sheet ejection space that is formed between the exit tray and the upper housing. A user's hand is inserted into the sheet ejection space for taking out the sheet from the exit tray. The upper housing includes a bottom plate having a surface that faces the exit tray. The bottom plate includes a plurality of reinforcing members that are disposed on the surface of the bottom plate and that extend in a direction in which the user takes out the recording medium from the exit tray.

Abstract: There are provided a liquid processing method, a liquid processing apparatus and a recording medium for liquid processing which can enhance the uniformity of the coating state of a processing liquid on a substrate. A coating unit U1 includes a rotary holder 20 for rotating a wafer W, a nozzle 32 for supplying a processing liquid R onto a surface Wa of the wafer W, and a controller 60 for controlling the position of the nozzle 32 with respect to the wafer W.

Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. The opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit includes fitting holes for fitting engagement with the aligning protrusion, the fitting holes being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide. The connector and the opto-electric hybrid unit are coupled together.

Abstract: With a vehicle-mounted equipment operating device, upon receipt of an input from an operator by an operation input unit, and when any one of a plurality of vehicle-mounted instruments, for example, an air conditioner, exists on a line of sight of the operator, a control unit sets the vehicle-mounted instrument that exists on the line of sight as an operation target device, and thereafter, the control unit controls the operation target device based on the input of the operator that has been received by the operation input unit.

Abstract: An opto-electric hybrid module is provided which has a linear light-path core and an electric circuit including mounting pads and an electric circuit body provided on a surface of an under-cladding layer of an optical waveguide. An optical element is mounted with its electrodes in abutment against the mounting pads. The electric circuit body and a portion of the surface of the under-cladding layer other than a core formation portion and an electric circuit formation portion are covered with a stack including a core material layer and an over-cladding material layer. A surface portion of the stack present between the mounting pads and the electric circuit body is located at a lower height position than a surface portion of the stack present on the electric circuit body.

Abstract: There is provided a coating method which can apply a coating solution uniformly onto a substrate surface while reducing the amount of the coating solution supplied. The coating method for applying a coating solution onto a wafer includes the steps of: supplying a solvent for the coating solution onto the wafer to form an annular liquid film of the solvent in a peripheral area of the wafer; supplying the coating solution to the center of the wafer while rotating the wafer at a first rotational speed (time t1-t2); and allowing the coating solution to spread on the wafer by rotating the wafer at a second rotational speed which is higher than the first rotational speed (time t4-t5). The supply of the solvent is continued until just before the coating solution comes into contact with the liquid film of the solvent (time t0-t3).

Abstract: An opto-electric hybrid module is provided, which is excellent in bending resistance and optical element mountability. In the opto-electric hybrid module, a light-path core of an optical waveguide is provided on a surface of an under-cladding layer, and non-light-path dummy cores are provided on opposite sides of the light-path core in spaced relation to the light-path core as projecting from the surface of the under-cladding layer. An electric circuit having mounting pads is provided on top surfaces of the dummy cores. An over-cladding layer is provided on side surfaces and a top surface of the light-path core, and projects to cover the core. The non-light-path dummy cores each have an elastic modulus that is set higher than the elastic modulus of the under-cladding layer and the elastic modulus of the over-cladding layer. The optical element is mounted on the mounting pads, and positioned above the projecting over-cladding layer.

Abstract: An opto-electric hybrid module is provided, which is configured so that no air bubbles are present in a sealing resin which seals a space defined between an optical waveguide and an optical element. In the opto-electric hybrid module, an electric circuit is provided directly on an over-cladding layer of the optical waveguide, and the optical element is provided on predetermined portions (mounting pads) of the electric circuit. The over-cladding layer has a projection which covers a core, and a center portion of the optical element is positioned above the projection with the intervention of a sealing resin.

Abstract: A vehicular display apparatus on a vehicle includes a display device which displays a magnitude of an acceleration which is being detected by an acceleration sensor on a display unit, and also displays a magnitude of an acceleration detected by the acceleration sensor when an ESC controller generated a braking force on road wheels on the display unit.

Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. This opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit 2 includes recesses for fitting engagement with the aligning protrusion, the recesses being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide.

Abstract: A developer storage container includes a container main body, a developer discharge port, a moving shaft, a moving plate, a guide portion and an elastic member. The container main body includes a wall defining an internal storing space. The developer discharge port is arranged at a predetermined position of the container main body. The moving shaft is arranged to extend in a first direction in the internal space. The moving plate moves in the first direction along the moving shaft in the internal space and conveys the developer toward the developer discharge port. The guide portion guides a movement of the moving plate in the first direction while maintaining the posture of the moving plate. The elastic member is attached to the moving plate and slides in contact with an inner surface of the wall of the container main body when the moving plate moves in the first direction.

Abstract: Group III nitride semiconductor having reduced threading dislocation density and uniform Ga-polar surface is provided. Forming a capping layer on a buffer layer containing Al as an essential element at a temperature lower than a temperature at which an oxide of element constituting the buffer layer is formed. Heat treating the substrate having the buffer layer covered by the capping layer at a temperature higher than a temperature at which a crystal of body semiconductor grows without exposing the surface of the buffer layer. The substrate temperature is decreased to a temperature at which a crystal of the body semiconductor grows and the body semiconductor is grown.

Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. The opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit includes fitting holes for fitting engagement with the aligning protrusion, the fitting holes being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide. The connector and the opto-electric hybrid unit are coupled together.

Abstract: A first side surface of post of the first stripe is formed so that a plane which is most parallel to the first side surface among low-index planes of the growing Group III nitride semiconductor is a m-plane (10-10), and a first angle between the first lateral vector obtained by orthogonally projecting a normal vector of the first side surfaces to the main surface and a m-axis projected vector obtained by orthogonally projecting a normal vector of the m-plane of the growing semiconductor to the main surface is from 0.5° to 6°. A second side surface of post of the second stripe is formed so that a plane which is most parallel to the second side surface among low-index planes of the growing semiconductor is an a-plane (11-20), and a second angle between the second lateral vector and an a-axis projected vector of the a-plane is from 0° to 10°.

Abstract: A method for producing a Ga-containing group III nitride semiconductor having reduced threading dislocation is disclosed. A buffer layer in a polycrystal, amorphous or polycrystal/amorphous mixed state, comprising AlGaN is formed on a substrate. The substrate having the buffer layer formed thereon is heat-treated at a temperature higher than a temperature at which a single crystal of a Ga-containing group III nitride semiconductor grows on the buffer layer and at a temperature that the Ga-containing group III nitride semiconductor does not grow, to reduce crystal nucleus density of the buffer layer as compared with the density before the heat treatment. After the heat treatment, the temperature of the substrate is decreased to a temperature that the Ga-containing group III nitride semiconductor grows, the temperature is maintained, and the Ga-containing group III nitride semiconductor is grown on the buffer layer.

Abstract: In an image reading device, an image reading portion is fixed at a predetermined position on a route on which a document sheet is conveyed by a document sheet conveying portion, and can read an image from the document sheet. A color reference plate is disposed opposingly to the image reading portion, and is a member having a predetermined reference color at a part thereof opposing the image reading portion. An oscillation portion can oscillate the color reference plate in one of or both a primary scanning direction and a secondary scanning direction. A color reference data setting portion sets, based on image data read from the color reference plate by the image reading portion when the color reference plate is being oscillated by the oscillation portion, color reference data to be used for shading correction executed on image data read from the document sheet by the image reading portion.

Abstract: A method of manufacturing an optical waveguide is provided which enables a recognition device such as a CCD camera to easily recognize an alignment mark for positioning a mold for over cladding layer formation. The method includes the steps of: forming protruding cores and a protruding alignment mark on an upper surface of an under cladding layer on a substrate by a photolithographic method; and forming the over cladding layer by use of the mold positioned using the alignment mark as a guide. For the formation of the alignment mark, a photomask is used which has an opening pattern for alignment mark formation including an opening, and a light transmission amount reduction region provided around the opening and having an aperture ratio within a range greater than 10% and less than 80%. The alignment mark is formed to have a peripheral side surface in the form of an inclined surface.