Abstract: Provided are an optical waveguide capable of propagating light, and a position sensor and an optical circuit board including the same. The optical waveguide includes cores each partially formed in an S-shape. The S-shaped portion includes a first curved portion upstream as seen in the direction of light propagation, and a second curved portion downstream as seen in the direction of light propagation and curved in a direction opposite to the first curved portion. The first curved portion and the second curved portion are connected to each other via a straight portion having a length in the range of from 0 mm to 30 mm. One of the width of the exit of the first curved portion and the width of the entrance of the second curved portion is smaller than the width of a core portion upstream of the S-shaped portion.

Abstract: An object of the invention is to provide a hot and cold water mixing device for reducing degradation in the measurement accuracy of a flowmeter. In the device according to the invention, the flowmeter is disposed in one of a hot water supply path and a cold water supply path, having a higher flow rate. At least first and second temperature sensors are individually disposed in at least two of the hot and cold water supply paths and a mixed water path. A hot and cold water adjustment unit adjusts a mixing volume of hot water and cold water based on measurement values of the flowmeter disposed in one of the flow paths having a higher flow rate, a mixed water path flowmeter and at least the first and second temperature sensors.

Abstract: A film forming method for forming a coating film by applying a coating solution onto a substrate having projections and recesses formed on a surface thereof by a predetermined pattern, includes: applying the coating solution onto the surface of the substrate to form a thick film having a depth of projections and recesses on a surface of the film of a predetermined value or less and having a film thickness larger than a target film thickness of the coating film; and removing the surface of the thick film to form the coating film having the target film thickness.

Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. This opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit 2 includes recesses for fitting engagement with the aligning protrusion, the recesses being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide.

Abstract: There is provided a tungsten film forming method which includes: forming a first tungsten film on a substrate; and forming a second tungsten film on the first tungsten film. The forming a first tungsten film includes alternately supplying a first raw material gas containing tungsten and a diborane gas together with a first carrier gas to the substrate. The forming a second tungsten film includes alternately supplying a second raw material gas containing tungsten and a hydrogen gas together with a second carrier gas to the substrate on which the first tungsten film is formed. The first carrier gas is a nitrogen gas. The second carrier gas includes at least one kind of inert gas and has a noble gas at a flow rate of 70% or more with respect to a total flow rate of the second carrier gas.

Abstract: A method of forming a tungsten film having low resistance is provided. The method includes forming a discontinuous film containing a metal on a substrate; and forming the tungsten film on the substrate on which the discontinuous film is formed. In the forming of the discontinuous film, a first source gas and a nitriding gas are supplied onto the substrate alternately along with, for example, a carrier gas. In the forming of the tungsten film, a second source gas and a reducing gas are supplied onto the substrate alternately along with, for example, a carrier gas.

Abstract: There are provided an optical waveguide including cores arranged in a lattice form in which intersection loss is further reduced where, at each intersection of the cores including first and second cores extending in two intersecting directions, the first core is separated by the second core and a gap is formed between the second core and each of the end portions of the first core, and a position sensor using the same. The position sensor includes an optical waveguide including cores arranged in a lattice form. At each intersection of the cores including first and second cores extending in two intersecting directions, the first core is separated by the second core, and a gap is formed between the second core and each of the end portions of the first core. The width of the end portions of the first core is greater than the width of the second core.

Abstract: Provided are an optical waveguide capable of propagating light, and a position sensor and an optical circuit board including the same. The optical waveguide includes cores each partially formed in an S-shape. The S-shaped portion includes a first curved portion upstream as seen in the direction of light propagation, and a second curved portion downstream as seen in the direction of light propagation and curved in a direction opposite to the first curved portion. The first curved portion and the second curved portion are connected to each other via a straight portion having a length in the range of greater than 0 mm to 30 mm. One of the width of the exit of the first curved portion and the width of the entrance of the second curved portion is smaller than the width of a core portion upstream of the S-shaped portion.

Abstract: There is provided a coating method which can apply a coating solution uniformly onto a substrate surface while reducing the amount of the coating solution supplied. The coating method for applying a coating solution onto a wafer includes the steps of: supplying a solvent for the coating solution onto the wafer to form an annular liquid film of the solvent in a peripheral area of the wafer; supplying the coating solution to the center of the wafer while rotating the wafer at a first rotational speed (time t1-t2); and allowing the coating solution to spread on the wafer by rotating the wafer at a second rotational speed which is higher than the first rotational speed (time t4-t5). The supply of the solvent is continued until just before the coating solution comes into contact with the liquid film of the solvent (time t0-t3).

Abstract: A coating treatment method of applying a coating solution onto a substrate, includes: a solvent liquid film formation step of forming a first liquid film of a solvent at a middle portion of the substrate and forming a ring-shaped second liquid film having a film thickness larger than a film thickness of the first liquid film of the solvent at an outer peripheral portion of the substrate; a coating solution supply step of supplying the coating solution to a center portion of the substrate while rotating the substrate at a first rotation speed; and a coating solution diffusion step of diffusing the coating solution on the substrate by rotating the substrate at a second rotation speed higher than the first rotation speed while supplying the coating solution.

Abstract: An opto-electric hybrid board includes opto-electric module portions respectively defined on opposite end portions of an elongated insulation layer, and an interconnection portion defined on a portion of the insulation layer between the opto-electric module portions and including an optical waveguide. A metal reinforcement layer extends over the opto-electric module portions into the interconnection portion. A portion of the metal reinforcement layer present in the interconnection portion has a smaller width than portions of the metal reinforcement layer present in the opto-electric module portions, and has a discontinuity extending widthwise across the metal reinforcement layer. This arrangement makes it possible to protect the optical waveguide from the bending and the twisting of the interconnection portion, while ensuring the flexibility of the interconnection portion including the optical waveguide.

Abstract: A method for producing a Group III nitride semiconductor comprising forming mesas on a main surface of a substrate, and growing Group III nitride semiconductor in a c-axis direction thereof, wherein the plane most parallel to the side surfaces of the mesas or the dents among the low-index planes of growing Group III nitride semiconductor is a m-plane (1-100), and when a projected vector obtained by orthogonally projecting a normal vector of the processed side surface to the main surface is defined as a lateral vector, an angle between the lateral vector and a projected vector obtained by orthogonally projecting a normal vector of the m-plane of the growing Group III nitride semiconductor to the main surface is 0.5° or more and 6° or less.

Abstract: There are provided a liquid processing method, a liquid processing apparatus and a recording medium for liquid processing which can enhance the uniformity of the coating state of a processing liquid on a substrate. A coating unit includes a rotary holder for rotating a wafer, a nozzle for supplying a processing liquid onto a surface of the wafer, and a controller for controlling the position of the nozzle with respect to the wafer.

Abstract: A fixing member has a fixing body, which slidably moves in a straight line direction, and a first engaging part. The first engaging part projects downward from a lower surface of the fixing body to pass through an operation panel. The first engaging part is engaged with a part to be engaged formed on a lower surface of the operation panel, thereby restricting the fixing body so as not to move in the straight line direction. A space is formed in a height direction between one side end portion in the straight line direction of the fixing body and the upper surface of the operation panel. When the one side end portion in the straight line direction of the fixing body is pressed downward and is subjected to bending deformation, engagement of the first engaging part and the part to be engaged is released.

Abstract: An inventive opto-electric hybrid board includes: opto-electric module portions respectively provided on opposite end portions of an elongated insulation layer and including a first electric wiring of a first electrically conductive pattern and an optical element provided on a front surface of the insulation layer; and an interconnection portion provided on a portion of the insulation layer extending from the opto-electric module portions, and including an elongated optical waveguide on a back surface of the insulation layer optically coupled with the optical elements, and having a light signal transmission core. Further, an electrically conductive dummy pattern is provided on the front surface of the insulation layer in the interconnection portion for reinforcing the interconnection portion. The electrically conductive dummy pattern reinforces the interconnection portion to protect the waveguide from bending and twisting, while ensuring the flexibility of the interconnection portion.

Abstract: An inventive opto-electric hybrid board includes: opto-electric module portions respectively defined on opposite end portions of an elongated insulation layer, and each including a first electric wiring of an electrically conductive pattern and an optical element provided on a front surface of the insulation layer; and an interconnection portion defined on a portion of the insulation layer extending from the opto-electric module portions, and including an optical waveguide optically coupled with the optical elements. A metal reinforcement layer provided on a back surface of the insulation layer as extending over the opto-electric module portions into the interconnection portion. A portion of the metal reinforcement layer present the interconnection portion has a smaller width than the opto-electric module portions, and the smaller width portion has rounded proximal corners.

Abstract: There are provided an optical waveguide including cores arranged in a lattice form in which intersection loss is further reduced where, at each intersection of the cores including first and second cores extending in two intersecting directions, the first core is separated by the second core and a gap is formed between the second core and each of the end portions of the first core, and a position sensor using the same. The position sensor includes an optical waveguide including cores arranged in a lattice form. At each intersection of the cores including first and second cores extending in two intersecting directions, the first core is separated by the second core, and a gap is formed between the second core and each of the end portions of the first core. The width of the end portions of the first core is greater than the width of the second core.

Abstract: In an opto-electric hybrid board according to the present invention, an electrical interconnect line and an optical element are provided on a first surface of a substrate, and an optical waveguide optically coupled to the optical element is provided on a second surface of the substrate. A reinforcement layer for reinforcing the substrate is integrally mounted on the first surface of the substrate on which the electrical interconnect line and the optical element are provided, with an adhesive layer therebetween. A connector pad part for externally electrically connecting the electrical interconnect line is provided on the second surface of the substrate on which the optical waveguide is provided. With this configuration, the reinforcement layer is mounted on the substrate with high strength without adverse effects exerted on the optical element and the optical waveguide.

Abstract: An opto-electric hybrid board includes opto-electric module portions respectively defined on opposite end portions of an elongated insulation layer, and an interconnection portion defined on a portion of the insulation layer between the opto-electric module portions and including an optical waveguide. A metal reinforcement layer extends over the opto-electric module portions into the interconnection portion. A portion of the metal reinforcement layer present in the interconnection portion has a smaller width than portions of the metal reinforcement layer present in the opto-electric module portions, and has a discontinuity extending widthwise across the metal reinforcement layer. This arrangement makes it possible to protect the optical waveguide from the bending and the twisting of the interconnection portion, while ensuring the flexibility of the interconnection portion including the optical waveguide.

Abstract: An image forming apparatus includes an image scanning section, an exit tray, and an upper housing. The image scanning section scans an image of an original document. The exit tray is disposed below the image scanning section. A sheet bearing an image is ejected onto the exit tray. The upper housing houses the image scanning section. The image forming apparatus has a sheet ejection space that is formed between the exit tray and the upper housing. A user's hand is inserted into the sheet ejection space for taking out the sheet from the exit tray. The upper housing includes a bottom plate having a surface that faces the exit tray. The bottom plate includes a plurality of reinforcing members that are disposed on the surface of the bottom plate and that extend in a direction in which the user takes out the recording medium from the exit tray.