Abstract: There is provided a coating method which can apply a coating solution uniformly onto a substrate surface while reducing the amount of the coating solution supplied. The coating method for applying a coating solution onto a wafer includes the steps of: supplying a solvent for the coating solution onto the wafer to form an annular liquid film of the solvent in a peripheral area of the wafer; supplying the coating solution to the center of the wafer while rotating the wafer at a first rotational speed (time t1-t2); and allowing the coating solution to spread on the wafer by rotating the wafer at a second rotational speed which is higher than the first rotational speed (time t4-t5). The supply of the solvent is continued until just before the coating solution comes into contact with the liquid film of the solvent (time t0-t3).

Abstract: A coating treatment method of applying a coating solution onto a substrate, includes: a solvent liquid film formation step of forming a first liquid film of a solvent at a middle portion of the substrate and forming a ring-shaped second liquid film having a film thickness larger than a film thickness of the first liquid film of the solvent at an outer peripheral portion of the substrate; a coating solution supply step of supplying the coating solution to a center portion of the substrate while rotating the substrate at a first rotation speed; and a coating solution diffusion step of diffusing the coating solution on the substrate by rotating the substrate at a second rotation speed higher than the first rotation speed while supplying the coating solution.

Abstract: An opto-electric hybrid board includes opto-electric module portions respectively defined on opposite end portions of an elongated insulation layer, and an interconnection portion defined on a portion of the insulation layer between the opto-electric module portions and including an optical waveguide. A metal reinforcement layer extends over the opto-electric module portions into the interconnection portion. A portion of the metal reinforcement layer present in the interconnection portion has a smaller width than portions of the metal reinforcement layer present in the opto-electric module portions, and has a discontinuity extending widthwise across the metal reinforcement layer. This arrangement makes it possible to protect the optical waveguide from the bending and the twisting of the interconnection portion, while ensuring the flexibility of the interconnection portion including the optical waveguide.

Abstract: A method for producing a Group III nitride semiconductor comprising forming mesas on a main surface of a substrate, and growing Group III nitride semiconductor in a c-axis direction thereof, wherein the plane most parallel to the side surfaces of the mesas or the dents among the low-index planes of growing Group III nitride semiconductor is a m-plane (1-100), and when a projected vector obtained by orthogonally projecting a normal vector of the processed side surface to the main surface is defined as a lateral vector, an angle between the lateral vector and a projected vector obtained by orthogonally projecting a normal vector of the m-plane of the growing Group III nitride semiconductor to the main surface is 0.5° or more and 6° or less.

Abstract: There are provided a liquid processing method, a liquid processing apparatus and a recording medium for liquid processing which can enhance the uniformity of the coating state of a processing liquid on a substrate. A coating unit includes a rotary holder for rotating a wafer, a nozzle for supplying a processing liquid onto a surface of the wafer, and a controller for controlling the position of the nozzle with respect to the wafer.

Abstract: A fixing member has a fixing body, which slidably moves in a straight line direction, and a first engaging part. The first engaging part projects downward from a lower surface of the fixing body to pass through an operation panel. The first engaging part is engaged with a part to be engaged formed on a lower surface of the operation panel, thereby restricting the fixing body so as not to move in the straight line direction. A space is formed in a height direction between one side end portion in the straight line direction of the fixing body and the upper surface of the operation panel. When the one side end portion in the straight line direction of the fixing body is pressed downward and is subjected to bending deformation, engagement of the first engaging part and the part to be engaged is released.

Abstract: An inventive opto-electric hybrid board includes: opto-electric module portions respectively provided on opposite end portions of an elongated insulation layer and including a first electric wiring of a first electrically conductive pattern and an optical element provided on a front surface of the insulation layer; and an interconnection portion provided on a portion of the insulation layer extending from the opto-electric module portions, and including an elongated optical waveguide on a back surface of the insulation layer optically coupled with the optical elements, and having a light signal transmission core. Further, an electrically conductive dummy pattern is provided on the front surface of the insulation layer in the interconnection portion for reinforcing the interconnection portion. The electrically conductive dummy pattern reinforces the interconnection portion to protect the waveguide from bending and twisting, while ensuring the flexibility of the interconnection portion.

Abstract: An inventive opto-electric hybrid board includes: opto-electric module portions respectively defined on opposite end portions of an elongated insulation layer, and each including a first electric wiring of an electrically conductive pattern and an optical element provided on a front surface of the insulation layer; and an interconnection portion defined on a portion of the insulation layer extending from the opto-electric module portions, and including an optical waveguide optically coupled with the optical elements. A metal reinforcement layer provided on a back surface of the insulation layer as extending over the opto-electric module portions into the interconnection portion. A portion of the metal reinforcement layer present the interconnection portion has a smaller width than the opto-electric module portions, and the smaller width portion has rounded proximal corners.

Abstract: There are provided an optical waveguide including cores arranged in a lattice form in which intersection loss is further reduced where, at each intersection of the cores including first and second cores extending in two intersecting directions, the first core is separated by the second core and a gap is formed between the second core and each of the end portions of the first core, and a position sensor using the same. The position sensor includes an optical waveguide including cores arranged in a lattice form. At each intersection of the cores including first and second cores extending in two intersecting directions, the first core is separated by the second core, and a gap is formed between the second core and each of the end portions of the first core. The width of the end portions of the first core is greater than the width of the second core.

Abstract: In an opto-electric hybrid board according to the present invention, an electrical interconnect line and an optical element are provided on a first surface of a substrate, and an optical waveguide optically coupled to the optical element is provided on a second surface of the substrate. A reinforcement layer for reinforcing the substrate is integrally mounted on the first surface of the substrate on which the electrical interconnect line and the optical element are provided, with an adhesive layer therebetween. A connector pad part for externally electrically connecting the electrical interconnect line is provided on the second surface of the substrate on which the optical waveguide is provided. With this configuration, the reinforcement layer is mounted on the substrate with high strength without adverse effects exerted on the optical element and the optical waveguide.

Abstract: An opto-electric hybrid board includes opto-electric module portions respectively defined on opposite end portions of an elongated insulation layer, and an interconnection portion defined on a portion of the insulation layer between the opto-electric module portions and including an optical waveguide. A metal reinforcement layer extends over the opto-electric module portions into the interconnection portion. A portion of the metal reinforcement layer present in the interconnection portion has a smaller width than portions of the metal reinforcement layer present in the opto-electric module portions, and has a discontinuity extending widthwise across the metal reinforcement layer. This arrangement makes it possible to protect the optical waveguide from the bending and the twisting of the interconnection portion, while ensuring the flexibility of the interconnection portion including the optical waveguide.

Abstract: An opto-electric hybrid board according to the present invention includes a substrate including an insulation layer and a metal reinforcement layer. An electric circuit part is provided on the front surface of the substrate, and an optical waveguide part is provided on the back surface thereof. The metal reinforcement layer includes an optical coupling through hole and an alignment through hole. The electric circuit part includes an electrical interconnect line, an optical element, a first alignment mark for positioning of a mirror part, and a second alignment mark for positioning of the optical element. The mirror part of the optical waveguide part is positioned with respect to the first alignment mark visually recognized through the alignment through hole, and the optical element of the electric circuit part is positioned with respect to the second alignment mark.

Abstract: An image forming apparatus includes an image scanning section, an exit tray, and an upper housing. The image scanning section scans an image of an original document. The exit tray is disposed below the image scanning section. A sheet bearing an image is ejected onto the exit tray. The upper housing houses the image scanning section. The image forming apparatus has a sheet ejection space that is formed between the exit tray and the upper housing. A user's hand is inserted into the sheet ejection space for taking out the sheet from the exit tray. The upper housing includes a bottom plate having a surface that faces the exit tray. The bottom plate includes a plurality of reinforcing members that are disposed on the surface of the bottom plate and that extend in a direction in which the user takes out the recording medium from the exit tray.

Abstract: An object of the invention is to provide a hot and cold water mixing device for reducing degradation in the measurement accuracy of a flowmeter. In the device according to the invention, the flowmeter is disposed in one of a hot water supply path and a cold water supply path, having a higher flow rate. At least first and second temperature sensors are individually disposed in at least two of the hot and cold water supply paths and a mixed water path. A hot and cold water adjustment unit adjusts a mixing volume of hot water and cold water based on measurement values of the flowmeter disposed in one of the flow paths having a higher flow rate, a mixed water path flowmeter and at least the first and second temperature sensors.

Abstract: With a vehicle-mounted equipment operating device, upon receipt of an input from an operator by an operation input unit, and when any one of a plurality of vehicle-mounted instruments, for example, an air conditioner, exists on a line of sight of the operator, a control unit sets the vehicle-mounted instrument that exists on the line of sight as an operation target device, and thereafter, the control unit controls the operation target device based on the input of the operator that has been received by the operation input unit.

Abstract: In an image reading device, an image reading portion is fixed at a predetermined position on a route on which a document sheet is conveyed by a document sheet conveying portion, and can read an image from the document sheet. A color reference plate is disposed opposingly to the image reading portion, and is a member having a predetermined reference color at a part thereof opposing the image reading portion. An oscillation portion can oscillate the color reference plate in one of or both a primary scanning direction and a secondary scanning direction. A color reference data setting portion sets, based on image data read from the color reference plate by the image reading portion when the color reference plate is being oscillated by the oscillation portion, color reference data to be used for shading correction executed on image data read from the document sheet by the image reading portion.

Abstract: A fixing member has a fixing body, which slidably moves in a straight line direction, and a first engaging part. The first engaging part projects downward from a lower surface of the fixing body to pass through an operation panel. The first engaging part is engaged with a part to be engaged formed on a lower surface of the operation panel, thereby restricting the fixing body so as not to move in the straight line direction. A space is formed in a height direction between one side end portion in the straight line direction of the fixing body and the upper surface of the operation panel. When the one side end portion in the straight line direction of the fixing body is pressed downward and is subjected to bending deformation, engagement of the first engaging part and the part to be engaged is released.

Abstract: An opto-electric hybrid module is provided which has a linear light-path core and an electric circuit including mounting pads and an electric circuit body provided on a surface of an under-cladding layer of an optical waveguide. An optical element is mounted with its electrodes in abutment against the mounting pads. The electric circuit body and a portion of the surface of the under-cladding layer other than a core formation portion and an electric circuit formation portion are covered with a stack including a core material layer and an over-cladding material layer. A surface portion of the stack present between the mounting pads and the electric circuit body is located at a lower height position than a surface portion of the stack present on the electric circuit body.

Abstract: An opto-electric hybrid board according to the present invention includes a substrate including an insulation layer and a metal reinforcement layer. An electric circuit part is provided on the front surface of the substrate, and an optical waveguide part is provided on the back surface thereof. The metal reinforcement layer includes an optical coupling through hole and an alignment through hole. The electric circuit part includes an electrical interconnect line, an optical element, a first alignment mark for positioning of a mirror part, and a second alignment mark for positioning of the optical element. The mirror part of the optical waveguide part is positioned with respect to the first alignment mark visually recognized through the alignment through hole, and the optical element of the electric circuit part is positioned with respect to the second alignment mark.

Abstract: An inventive opto-electric hybrid board includes: opto-electric module portions respectively defined on opposite end portions of an elongated insulation layer, and each including a first electric wiring of an electrically conductive pattern and an optical element provided on a front surface of the insulation layer; and an interconnection portion defined on a portion of the insulation layer extending from the opto-electric module portions, and including an optical waveguide optically coupled with the optical elements. A metal reinforcement layer provided on a back surface of the insulation layer extending over the opto-electric module portions into the interconnection portion. A portion of the metal reinforcement layer present the interconnection portion has a smaller width than the opto-electric module portions, and the smaller width portion has rounded proximal corners.