Patents by Inventor Naoki Shibata

Naoki Shibata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220386463
    Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Ryosuke SASAOKA, Naoki SHIBATA, Yasunari OYABU
  • Publication number: 20220386459
    Abstract: A wiring circuit board includes a base insulating layer; a first wiring disposed on the base insulating layer; an intermediate insulating layer disposed on the base insulating layer so as to cover the first wiring; a second wiring disposed on the intermediate insulating layer; a single layer first terminal, disposed on the base insulating layer, and electrically connected to the first wiring; and a single layer second terminal, disposed on the base insulating layer, and electrically connected to the second wiring. The first terminal is continuous with the first wiring. The second terminal is discontinuous from the second wiring. The wiring circuit board further includes a connecting portion disposed on the base insulating layer and continuous with the second terminal to electrically connect to the second wiring.
    Type: Application
    Filed: October 13, 2020
    Publication date: December 1, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Rihito FUKUSHIMA, Hayato TAKAKURA, Naoki SHIBATA
  • Publication number: 20220381081
    Abstract: A mobile body control system includes: a window open or close instruction recognition unit that recognizes an open or close instruction of a window provided to a mobile body in accordance with a voice operation or an operation of a mobile terminal performed by a passenger on the mobile body; a window control unit that executes a window open or close control for opening or closing the window, when the open or close instruction of the window is recognized; and a window operation restriction unit that executes at least one of window operation inhibition processing for inhibiting execution of the window open or close control by the window control unit in accordance with an operation of a switch provided to the mobile body, and window operation stop processing for stopping the window being operated by the window open or close control in accordance with an operation of the switch.
    Type: Application
    Filed: May 27, 2022
    Publication date: December 1, 2022
    Inventors: Mizuki Katsu, Naoki Shibata, Atsushi Sekiguchi, Shigeki Takahashi, Tomohiro Suzuki, Takamune Tsukahara, Kenichiro Kagawa, Futoshi Kobayashi, Masayuki Watarai, Makoto Ono, Katsuyasu Yamane, Koji Hashimoto, Hironori Takano
  • Patent number: 11503716
    Abstract: A wiring circuit board assembly sheet is partitioned by a product region in which a plurality of wiring circuit boards serving as products are disposed in alignment and a margin region surrounding the product region with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area. The wiring circuit board assembly sheet includes a dummy wiring circuit board disposed in at least a portion of the first area and smaller than the wiring circuit board.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: November 15, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Takuya Taniuchi, Ryohei Kakiuchi, Naoki Shibata, Yasunari Oyabu
  • Patent number: 11475025
    Abstract: The invention comprises a decentralized consensus protocol for blockchains in which the computation can be used to search for good approximate solutions to any optimization problem. This protocol allows the wasted energy to be used for finding approximate solutions to problems submitted by any nodes (called clients). This protocol works in a similar way to proof-of-work, and it makes nodes evaluate a large number of solution candidates to add a new block to the chain. A client provides a search program that implements any search algorithm that finds a good solution by evaluating a large number of solution candidates. The node that finds the best approximate solution is rewarded by the client.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: October 18, 2022
    Assignee: PROOF-OF-SEARCH K.K.
    Inventor: Naoki Shibata
  • Publication number: 20220312191
    Abstract: A setting apparatus includes: a CPU and a memory connected to the CPU. The memory is configured to store information regarding each of a plurality of users individually using a single space. The CPU is configured to perform: identifying a user to use the space; authenticating the user identified in the identifying; setting devices provided in the space based on the information stored in the memory. The information stored in the memory includes: first information; and second information given stricter restriction than the first information. The CPU is configured to perform: the setting including performing a predetermined setting of the devices provided in the space based on the first information of the user identified in the identifying.
    Type: Application
    Filed: March 25, 2022
    Publication date: September 29, 2022
    Inventors: Yoshihiro Matsugi, Kazune Furudo, Naoki Shibata, Naoki Kikuchi, Shigeki Takahashi, Yuki Matsuura, Shogo Usui, Koji Hashimoto
  • Patent number: 11452215
    Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: September 20, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Ryosuke Sasaoka, Naoki Shibata, Yasunari Oyabu
  • Publication number: 20220251816
    Abstract: A cleaning device including a disinfection water supply portion to supply cleaning water with a dissolved disinfection component, and a bubble generation portion to contain bubbles into the cleaning water on a downstream side of the disinfection water supply portion.
    Type: Application
    Filed: May 28, 2020
    Publication date: August 11, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yasunari MAEDA, Naoki SHIBATA, Sakiho ASA, Mai SAITO
  • Publication number: 20220256712
    Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. A thickness of the ground lead residual portion is thinner than a thickness of the first terminal.
    Type: Application
    Filed: April 8, 2020
    Publication date: August 11, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
  • Publication number: 20220201871
    Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. The base insulating layer has a through hole penetrating in the thickness direction. The ground lead residual portion has an opening continuous so as to surround the through hole.
    Type: Application
    Filed: March 31, 2020
    Publication date: June 23, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
  • Patent number: 11284503
    Abstract: A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: March 22, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Masaki Ito, Naoki Shibata, Yasunari Oyabu, Kenya Takimoto
  • Patent number: 11272615
    Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: March 8, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naoki Shibata, Hiroaki Machitani, Yasunari Oyabu, Masaki Ito, Kenya Takimoto
  • Publication number: 20220035808
    Abstract: The invention comprises a decentralized consensus protocol for blockchains in which the computation can be used to search for good approximate solutions to any optimization problem. This protocol allows the wasted energy to be used for finding approximate solutions to problems submitted by any nodes (called clients). This protocol works in a similar way to proof-of-work, and it makes nodes evaluate a large number of solution candidates to add a new block to the chain. A client provides a search program that implements any search algorithm that finds a good solution by evaluating a large number of solution candidates. The node that finds the best approximate solution is rewarded by the client.
    Type: Application
    Filed: March 12, 2021
    Publication date: February 3, 2022
    Inventor: Naoki SHIBATA
  • Patent number: 11141758
    Abstract: A film forming method for forming a coating film by applying a coating solution onto a substrate having projections and recesses formed on a surface thereof by a predetermined pattern, includes: applying the coating solution onto the surface of the substrate to form a thick film having a depth of projections and recesses on a surface of the film of a predetermined value or less and having a film thickness larger than a target film thickness of the coating film; and removing the surface of the thick film to form the coating film having the target film thickness.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: October 12, 2021
    Assignee: Tokyo Electron Limited
    Inventors: Kentaro Yoshihara, Yuichi Yoshida, Naoki Shibata, Kousuke Yoshihara
  • Publication number: 20210212208
    Abstract: A wiring circuit board includes an insulating layer and a conductive layer disposed on a front surface of the insulating layer. The conductive layer includes a first wiring, a first terminal electrically connected to the first wiring, a second wiring independent of the first wiring and having a thick thickness T2 with respect to a thickness T1 of the first wiring, and a second terminal electrically connected to the second wiring. The surfaces of the first terminal and the second terminal are disposed at generally the same position in a thickness direction.
    Type: Application
    Filed: May 10, 2019
    Publication date: July 8, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naoki SHIBATA, Hiroaki MACHITANI, Yasunari OYABU, Masaki ITO, Kenya TAKIMOTO
  • Publication number: 20210212196
    Abstract: A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.
    Type: Application
    Filed: May 10, 2019
    Publication date: July 8, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masaki ITO, Naoki SHIBATA, Yasunari OYABU, Kenya TAKIMOTO
  • Publication number: 20210204402
    Abstract: A wiring circuit board assembly sheet includes a support sheet having two end edges parallel with each other and a plurality of wiring circuit boards disposed at spaced intervals to each other in the support sheet. The wiring circuit board includes a metal-based portion having a generally rectangular frame shape. The metal-based portion includes a first piece along a first direction perpendicular to a thickness direction of the support sheet, and a second piece along a second direction perpendicular to the thickness direction and the first direction. Both the first piece and the second piece are inclined with respect to the end edge of the support sheet.
    Type: Application
    Filed: May 10, 2019
    Publication date: July 1, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takuya TANIUCHI, Naoki SHIBATA, Ryosuke SASAOKA, Yasunari OYABU
  • Publication number: 20210185826
    Abstract: A wiring circuit board assembly sheet is partitioned by a product region in which a plurality of wiring circuit boards serving as products are disposed in alignment and a margin region surrounding the product region with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area. The wiring circuit board assembly sheet includes a dummy wiring circuit board disposed in at least a portion of the first area and smaller than the wiring circuit board.
    Type: Application
    Filed: July 12, 2019
    Publication date: June 17, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takuya TANIUCHI, Ryohei KAKIUCHI, Naoki SHIBATA, Yasunari OYABU
  • Publication number: 20210185832
    Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.
    Type: Application
    Filed: July 12, 2019
    Publication date: June 17, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Ryosuke SASAOKA, Naoki SHIBATA, Yasunari OYABU
  • Patent number: D914046
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: March 23, 2021
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Keisuke Tsukahara, Naoki Shibata, Tomoyuki Enomoto, Teppei Teshima, Hidenobu Otsu