Patents by Inventor Noriaki Oda

Noriaki Oda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having gold wiring layer provided with a barrier metal layer
    Patent number: 5416359
    Abstract: A semiconductor device having a gold wiring layer for an element region is disclosed, in which the gold wiring layer is connected to the element region through a barrier metal layer, the barrier metal layer comprising first and second layers each containing titanium and a third layer sandwiched between the first and second layers and made of a selected one from platinum and palladium. The third layer effectively prevents gold in the gold wiring layer from diffusing into the element region and the second layer enhances the adhesion between the gold wiring layer and an insulating film.
    Type: Grant
    Filed: May 10, 1993
    Date of Patent: May 16, 1995
    Assignee: NEC Corporation
    Inventor: Noriaki Oda