Abstract: To make it possible to determine authenticity of a two-dimensional code used for guidance to various kinds of websites, advertisement, or authentication or the like. A terminal apparatus 10 acquires a first two-dimensional code to be a determination target and a plurality of pieces of first additional information for determining authenticity of the first two-dimensional code. A server apparatus 30 that communicates with the terminal apparatus 10 via a communication network 20 includes a database DB in which a plurality of pieces of second additional information are registered in advance in association with identification information corresponding to a two-dimensional code guaranteed to be authentic. The terminal apparatus 10 determines the authenticity of the first two-dimensional code by determining whether the plurality of pieces of first additional information are registered in the database DB.

Abstract: The present disclosure is a sensor unit that is installed in an automatic vending machine, and unlocks the automatic vending machine, based on encrypted data transmitted from a terminal apparatus. The sensor unit includes: an encryption processor that generates a public key and a private key, and encrypts an unlocking code with the public key; a hash generator that hashes, through a hash function, sensor information including at least a sensor ID and position information on a sensor, and outputs a hash value; a manager that stores, in a storage, at least the public key and the hash value in association with each other, and manages the public key and the hash value; and an unlocker that determines success or failure of encrypted data transmitted from the terminal apparatus, and unlocks the automatic vending machine when the encrypted data matches with encrypted data generated by the encryption processor.

Abstract: An optical module includes a substrate in which a through hole or a recess is formed; a first component that is arranged in the through hole or the recess of the substrate, and is bonded to an inner wall surface of the through hole or the recess by a thermosetting adhesive in a portion of a gap between the first component and the inner wall surface of the through hole or the recess; and a second component that is connected to an electrode on one surface of the first component and an electrode on one surface of the substrate, across the gap between the first component and the inner wall surface of the through hole or the recess.

Abstract: A holding member is configured to hold an optical fiber of which an end connects to an optical circuit formed on a semiconductor substrate, the holding member includes a first surface configured to surround an exposed end of the held optical fiber, a second surface configured to be bonded to the semiconductor substrate to surround the first surface, and a groove configured to be formed along an edge of the first surface and provided between the edge of the first surface and an edge of the second surface.

Abstract: An optical module includes a semiconductor chip, a first gold-tin layer formed over the semiconductor chip and having gold and tin as main components, a barrier layer formed over the first gold-tin layer, having slower diffusion velocity into tin than diffusion velocity of gold into tin, and having electric conductivity, a second gold-tin layer formed over the barrier layer and having gold and tin as main components, and an optical device provided over the second gold-tin layer.

Abstract: An optical module includes a semiconductor chip, a first solder layer formed over the semiconductor chip and having gold and tin as main components, and an optical device provided over the first solder layer, wherein the first solder layer has a portion in which a change in percentage of gold content is different from a change in percentage of gold content in another portion of the first solder layer, in response to a change in position in a facing direction of the semiconductor chip and the optical device.

Abstract: An optical module includes: a substrate including a through hole, a first chip including a first heating member and disposed in the through hole, a second chip including a second heating member and bonded to a first upper surface of the substrate and a second upper surface of the first chip via bumps, and a first heat sink adhered to a lower surface of the substrate with a first adhesive and adhered to a lower surface of the first chip with a second adhesive, wherein the substrate includes a slit which is provided on a side of a first portion, to which the second chip is bonded, of the substrate with respect to the through hole, and communicates with the through hole.

Abstract: An optical module includes a substrate, a silicon photonics chip disposed in an opening of the substrate, a control chip disposed across the substrate and the silicon photonics chip, a plurality of laser diodes disposed over the silicon photonics chip, and a metallic bar in contact with each of terminals of the plurality of laser diodes and electrically coupling each of the terminals with the silicon photonics chip or the substrate.

Abstract: A holding member is configured to hold an optical fiber of which an end connects to an optical circuit formed on a semiconductor substrate, the holding member includes a first surface configured to surround an exposed end of the held optical fiber, a second surface configured to be bonded to the semiconductor substrate to surround the first surface, and a groove configured to be formed along an edge of the first surface and provided between the edge of the first surface and an edge of the second surface.

Abstract: An optical module includes: a substrate including a through hole, a first chip including a first heating member and disposed in the through hole, a second chip including a second heating member and bonded to a first upper surface of the substrate and a second upper surface of the first chip via bumps, and a first heat sink adhered to a lower surface of the substrate with a first adhesive and adhered to a lower surface of the first chip with a second adhesive, wherein the substrate includes a slit which is provided on a side of a first portion, to which the second chip is bonded, of the substrate with respect to the through hole, and communicates with the through hole.

Abstract: An optical module includes a first board that includes a recessed portion and a first conductor layer, a second board accommodated in the recessed portion and includes an optical waveguide and a second conductor layer, a semiconductor element installed across the first board and the second board and coupled to the first conductor layer and the second conductor layer, and a first bonding material disposed between a sidewall and a bottom surface of the recessed portion and the second board so as to bond the first board and the second board to each other.

Abstract: An optical module includes a substrate, a silicon photonics chip disposed in an opening of the substrate, a control chip disposed across the substrate and the silicon photonics chip, a plurality of laser diodes disposed over the silicon photonics chip, and a metallic bar in contact with each of terminals of the plurality of laser diodes and electrically coupling each of the terminals with the silicon photonics chip or the substrate.

Abstract: An optical module includes an optical element having a group of first pads which is formed on a first surface thereof, a substrate having a group of second pads which is formed on a second surface thereof facing the first surface so as to correspond to the group of first pads, respectively, and a group of solders that respectively bonds the group of first pads and the group of second pads to each other, wherein, in a plan view, the corresponding first and second pads partially overlap each other, and a center of gravity of the group of first pads coincides with a center of gravity of the group of second pads.

Abstract: A laminated semiconductor device includes: three or more semiconductor chips that are laminated; resins that are disposed among the semiconductor chips, the resins softening by heating; and support members that are disposed among the semiconductor chips and that contacts the adjacent semiconductor chips, the support members deforming by external force when a temperature of the support members reaching a predetermined temperature.

Abstract: An optical module includes a housing; a substrate configured to have a through hole; a first chip configured to have a first heating member and be disposed inside the through hole; a second chip configured to have a second heating member, the second chip being placed on the substrate and the first chip with a bump interposed; a first heat conduction member configured to be sandwiched between a lower wall of the housing and the first chip and transfer heat generated by the first heating member to the lower wall of the housing; and a second heat conduction member configured to be sandwiched between an upper wall of the housing and the second chip and transfer heat generated by the second heating member to the upper wall of the housing.

Abstract: An optical module includes a first board that includes a recessed portion and a first conductor layer, a second board accommodated in the recessed portion and includes an optical waveguide and a second conductor layer, a semiconductor element installed across the first board and the second board and coupled to the first conductor layer and the second conductor layer, and a first bonding material disposed between a sidewall and a bottom surface of the recessed portion and the second board so as to bond the first board and the second board to each other.

Abstract: An optical module includes an optical element having a group of first pads which is formed on a first surface thereof, a substrate having a group of second pads which is formed on a second surface thereof facing the first surface so as to correspond to the group of first pads, respectively, and a group of solders that respectively bonds the group of first pads and the group of second pads to each other, wherein, in a plan view, the corresponding first and second pads partially overlap each other, and a center of gravity of the group of first pads coincides with a center of gravity of the group of second pads.

Abstract: A first insulating film is applied onto a joining face of a semiconductor device including a connection terminal on a joining face, and the connection terminal is embedded inside the first insulating film. The second insulating film is formed on a joining target face of a joining target, which includes a connection target terminal on the joining target face, and the connection target terminal is embedded inside the second insulating film. The semiconductor device and the joining target are joined together by applying pressure and causing the semiconductor device and the joining target to make contact with each other.

Abstract: An optical module comprising: an optical waveguide transports light, the optical waveguide including a first mirror which reflects first light; an adhesive sheet formed over the optical waveguide, the adhesive sheet including a first gap above the first mirror; a first light-transmissive layer formed in the first gap; a lens sheet arranged over the adhesive sheet, the lens sheet including a first lens which is formed above the first light-transmissive layer; and a light-emitting device formed above the lens sheet, the light-emitting device including a light-emitting portion which emits the first light to the first lens.

Abstract: A laminated semiconductor device includes: three or more semiconductor chips that are laminated; resins that are disposed among the semiconductor chips, the resins softening by heating; and support members that are disposed among the semiconductor chips and that contacts the adjacent semiconductor chips, the support members deforming by external force when a temperature of the support members reaching a predetermined temperature.