Abstract: A light receiving element comprises: a photodiode including an optical waveguide, an end surface of the optical waveguide being a light receiving surface of the photodiode; a signal electrode and a bias electrode on a common surface of the photodiode, the signal electrode being connected to an anode of the photodiode, the bias electrode being connected to a cathode of the photodiode; an insulating film on the bias electrode; and a metal electrode on the insulating film.

Abstract: A connection unit includes: a ceramic substrate; a first signal line on the ceramic substrate; a first grounded conductor on the ceramic substrate and electromagnetically coupled to the first signal line; a first lead pin having a first end connected to an upper surface of the first signal line and a second end protruding beyond the ceramic substrate; a second lead pin having a first end connected to an upper surface of the first grounded conductor and a second end protruding beyond the ceramic substrate; a flexible substrate including an insulating layer through which the first and second lead pins penetrate, a second signal line on a first major surface of the insulating layer and connected to the second end of the first lead pin, and a second grounded conductor on a second major surface of the insulating layer and connected to the second end of the second lead pin.

Abstract: A temperature control module and a support block are mounted on a metal stem. A dielectric substrate is mounted on a side surface of the support block. A support block is mounted on a cooling surface of the temperature control module. A dielectric substrate is mounted on a side surface of the support block. A semiconductor optical modulation element is mounted on the dielectric substrate. A lead pin and a signal line are connected through a bonding wire. The signal line and a signal conductor are connected through a bonding wire. The signal conductor and the semiconductor optical modulation element are connected through a bonding wire.

Abstract: An uncooled optical semiconductor device includes: a semiconductor laser outputting laser light; an electric field absorption optical modulator absorbing light depending on a voltage applied to the electric field absorption optical modulator; a monitor photodiode monitoring backlight of the semiconductor laser; an auto power control circuit feeding back current of the monitor photodiode to a bias current supplied to the semiconductor laser; and a bias circuit feeding back an average value of a light absorption current to control a bias voltage applied to the electric field absorption optical modulator. The light absorption current is generated when the electric field absorption optical modulator absorbs the laser light.

Abstract: A semiconductor device includes an upper interconnect, a lower interconnect, insulating layers interposed between the upper interconnect and the lower interconnect, a connecting portion that is formed in the insulating layers and connects the upper interconnect and the lower interconnect, and an element that is placed in one of the insulating layers and has a conductive layer connected to the connecting portion. The connecting portion is formed over the lower interconnect and the end portions of the conductive layer of the element, and is in contact with the upper face of the lower interconnect and the upper faces and side faces of the end portions of the conductive layer of the element.

Abstract: An optical detecting device includes a light-detecting element for outputting an electrical signal, a pre-amplifier for amplifying the electrical signal, a signal line connected to an output of the pre-amplifier, and a resistor and a capacitor connected in series between the signal line and GND.

Abstract: An optical module includes a metallic stem a lead pin penetrating through the metallic stem and electrically insulated from the metallic stem, an optical semiconductor element on the metallic stem and connected to a first end of the lead pin, and a flexible substrate including first and second signal lines. A first end of the first signal line is connected to a second end of the lead pin. A second end of the first signal line is connected to a first end of the second signal line. The lead pin has a penetrating portion penetrating through the metallic stem. Each of the penetrating portion and the second signal line has a smaller impedance than the impedance of the first signal line.

Abstract: An uncooled optical semiconductor device includes: a semiconductor laser outputting laser light; an electric field absorption optical modulator absorbing light depending on a voltage applied to the electric field absorption optical modulator; a monitor photodiode monitoring backlight of the semiconductor laser; an auto power control circuit feeding back current of the monitor photodiode to a bias current supplied to the semiconductor laser; and a bias circuit feeding back an average value of a light absorption current to control a bias voltage applied to the electric field absorption optical modulator. The light absorption current is generated when the electric field absorption optical modulator absorbs the laser light.

Abstract: A light modulation device includes: an input terminal into which a modulation signal is input; a light modulation element including an anode connected to the input terminal and a cathode that is grounded; a matching resistor connected in parallel with the light modulation element; a matching capacitor connected to the light modulation element and connected in series to the matching resistor; and a protective resistor connected in parallel with the light modulation element, the matching resistor, and the matching capacitor.

Abstract: A temperature control module and a support block are mounted on a metal stem. A dielectric substrate is mounted on a side surface of the support block. A support block is mounted on a cooling surface of the temperature control module. A dielectric substrate is mounted on a side surface of the support block. A semiconductor optical modulation element is mounted on the dielectric substrate. A lead pin and a signal line are connected through a bonding wire. The signal line and a signal conductor are connected through a bonding wire. The signal conductor and the semiconductor optical modulation element are connected through a bonding wire.

Abstract: A keypad and a slide type mobile terminal having the same are provided. The slide type mobile terminal includes a first main body; a keypad having an upper surface part and a lower surface part, and a second main body coupled to the first plate positioned at one end of the upper surface part of the keypad and slidably connected to the first main body. The upper surface part has a plurality of parallel first plates that form an upper surface of the keypad, and the first plates positioned at each end of the upper surface part each have a downward facing first latch disposed at one side thereof and the remaining first plates each have a downward facing first latch disposed at two sides thereof. The lower surface part has a plurality of parallel second plates that form a lower surface of the keypad, and each second plate has an upward facing second latch disposed at two sides thereof. One second latch of each second plate contacts an adjacent first latch.

Abstract: A method of controlling a display unit of a portable terminal includes receiving a signal corresponding to a user gesture from a touch sensor unit located in a peripheral area of the display unit; and activating or deactivating at least part of the display unit according to the signal received from the touch sensor unit.

Abstract: An optical transmission module includes a first transmission line for transmitting an electric signal, a resistance element used as a termination point, a second transmission line connected to the resistance element, and a surface ground pattern forming a coplanar line through the first and second transmission lines on a surface of a substrate. A modulator-integrated light-emitting element for outputting output light from an output end face is connected to the surface ground pattern. An electrode pad for modulator driving is located near the output end face on a top face of the modulator-integrated light-emitting element. The first transmission line and the electrode pad are connected by a first wire. The electrode pad and the second transmission line are connected by a second wire. A first notch portion is located in the substrate at a point of intersection between a propagation path of output light of the modulator integrated light-emitting element and a first side face of the substrate.

Abstract: A transmission line substrate includes: a dielectric substrate; a signal line disposed on the upper surface of the dielectric substrate; first and second ground conductors disposed on the upper surface of the dielectric substrate, field-coupled to the signal line, having potentials different from each other; a dielectric film disposed between an overlapping part of the first ground conductor and a part of the second ground conductor at which the first and second ground conductors overlap each other, to constitute a MIM capacitor; a capacitor connected between the first ground conductor and the second ground conductor in parallel with the dielectric film; and a resistor connected between the first ground conductor and the second ground conductor in series with the capacitor.

Abstract: A semiconductor optical modulation device includes a semiconductor optical modulator, wires, an output side line, an input side line and a resistor. The semiconductor optical modulator is an electroabsorption optical modulator. One of the wires is connected between an electrode of the semiconductor optical modulator and the input side line. The other of the wires is connected between the electrode of the semiconductor optical modulator and the output side line. The resistor is connected in series with the output side line. Impedance of the output side line and impedance of the resistor are different from each other.

Abstract: A UPS device is coupled to an external power source and another UPS device through a power line. The UPS device includes: a storage battery in which power from the external power source is charged, the UPS device being configured to be capable of supplying power charged in the first storage battery to the power line coupled to the UPS device; a communication unit that communicates with the another UPS device through the power line; and a determination unit that determines whether the power line is in normal condition or not based on whether a communication between the UPS device and the another UPS device has been successfully established or not. Power is supplied from the storage battery to the power line that has been determined to be in normal condition by the determination unit.

Abstract: A power system interconnection system includes: a voltage detecting section configured to detect voltage values of a power system line to generate detection voltage values; and a PWM signal generating section configured to generate a PWM signal such that an output voltage follows the detection voltage values. A voltage converting circuit is configured to generate and supply the output voltage to the power system line by performing a pulse-width-modulation control on the power supplied from a power supply based on the PWM signal.