Patents by Inventor Norio Okada
Norio Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100149616Abstract: A semiconductor optical modulation device includes a semiconductor optical modulator, wires, an output side line, an input side line and a resistor. The semiconductor optical modulator is an electroabsorption optical modulator. One of the wires is connected between an electrode of the semiconductor optical modulator and the input side line. The other of the wires is connected between the electrode of the semiconductor optical modulator and the output side line. The resistor is connected in series with the output side line. Impedance of the output side line and impedance of the resistor are different from each other.Type: ApplicationFiled: April 14, 2009Publication date: June 17, 2010Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Norio OKADA, Tatsuo HATTA, Atsushi SUGITATSU
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Publication number: 20100117191Abstract: The present invention provides a semiconductor device that shows excellent manufacturing stability and has lower contact resistance, and a method for manufacturing the semiconductor device. The semiconductor device includes an upper interconnect, a lower interconnect, insulating layers interposed between the upper interconnect and the lower interconnect, a connecting portion that is formed in the insulating layers and connects the upper interconnect and the lower interconnect, and an element that is placed in one of the insulating layers and has a conductive layer connected to the connecting portion. The connecting portion is formed over the lower interconnect and the end portions of the conductive layer of the element, and is in contact with the upper face of the lower interconnect and the upper faces and side faces of the end portions of the conductive layer of the element.Type: ApplicationFiled: November 12, 2009Publication date: May 13, 2010Applicant: NEC ELECTRONICS CORPORATIONInventors: DAISUKE OSHIDA, HIROYUKI KUNISHIMA, NORIO OKADA
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Patent number: 7679871Abstract: A semiconductor device includes a semiconductor substrate, a fuse which comprises a conductive material and is formed on a semiconductor substrate, a contacting target conductor region which is placed around the fuse on the semiconductor substrate and formed so as to make electrical contact with the fuse through the conductive material constituting the fuse when a process for cutting the fuse is carried out, and a determination unit which detects whether or not the fuse is electrically disconnected, and detects whether or not the contacting target conductor region and the fuse are electrically connected, and determines that the fuse is in a cut state when electrical disconnection of said fuse is detected or electrical connection between said contacting target conductor region and said fuse is detected.Type: GrantFiled: June 1, 2007Date of Patent: March 16, 2010Assignee: NEC Electronics CorporationInventors: Norio Okada, Takehiro Ueda
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Publication number: 20100059839Abstract: A light receiving element comprises: a photodiode including an optical waveguide, an end surface of the optical waveguide being a light receiving surface of the photodiode; a signal electrode and a bias electrode on a common surface of the photodiode, the signal electrode being connected to an anode of the photodiode, the bias electrode being connected to a cathode of the photodiode; an insulating film on the bias electrode; and a metal electrode on the insulating film.Type: ApplicationFiled: August 18, 2009Publication date: March 11, 2010Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Norio OKADA, Masaharu Nakaji
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Publication number: 20100060390Abstract: A transmission line substrate comprises: a dielectric substrate; a signal line formed on the upper surface of the dielectric substrate; first and second ground conductors formed on the upper surface of the dielectric substrate, field-coupled to the signal line, having potentials different from each other; a dielectric film formed between a part of the overlapping first ground conductor and a part of the second ground conductor to constitute a MIM capacitor; a capacitor connected between the first ground conductor and the second ground conductor in parallel with the dielectric film; and a resistor connected between the first ground conductor and the second ground conductor in series with the capacitor.Type: ApplicationFiled: February 25, 2009Publication date: March 11, 2010Applicant: MITSUBISHI ELECTRIC CORPORATIONInventor: Norio OKADA
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Patent number: 7666734Abstract: A fuse used for redundancy function in a semiconductor device includes a pair of fuse terminals formed as a common layer with top interconnect lines by using a damascene technique, and a fuse element made of refractive metal and bridging the fuse terminals. The fuse element is formed as a common layer with the protective cover films covering the interconnect lines.Type: GrantFiled: March 22, 2005Date of Patent: February 23, 2010Assignee: NEC Electronics CorporationInventor: Norio Okada
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Publication number: 20090170576Abstract: A keypad and a slide type mobile terminal having the same are provided. The slide type mobile terminal includes a first main body; a keypad having an upper surface part and a lower surface part, and a second main body coupled to the first plate positioned at one end of the upper surface part of the keypad and slidably connected to the first main body. The upper surface part has a plurality of parallel first plates that form an upper surface of the keypad, and the first plates positioned at each end of the upper surface part each have a downward facing first latch disposed at one side thereof and the remaining first plates each have a downward facing first latch disposed at two sides thereof. The lower surface part has a plurality of parallel second plates that form a lower surface of the keypad, and each second plate has an upward facing second latch disposed at two sides thereof. One second latch of each second plate contacts an adjacent first latch.Type: ApplicationFiled: December 24, 2008Publication date: July 2, 2009Applicant: Samsung Electronics Co., LtdInventors: Keiichi MINAMIDE, Norio Okada, Hideki Hayashi, Jong Seong Lee
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Publication number: 20090167697Abstract: A folder type portable terminal and a method for setting a key input unit thereof are disclosed. The folder type portable terminal includes a key input unit, a body, and a folder. The key input unit includes a first key set having a plurality of keys, each key being allocated a dial key to make a call and an alphabet key based on a QWERTY-type letter arrangement, a second key set having alphabet keys, a third key to perform a plurality of functions including making calls, and a fourth key set. The body is equipped with the key input unit. The folder is rotatably coupled to the body with respect to a hinge. At least a part of the key input unit protrudes from the body when the folder rotates with respect to the hinge to be opened with respect to the body.Type: ApplicationFiled: December 2, 2008Publication date: July 2, 2009Applicant: Samsung Electronics Co., Ltd.Inventors: Norio Okada, Keiichi Minamide, Hideki Hayashi, Jong-Seong Lee
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Publication number: 20090162070Abstract: An optical transmission module includes a first transmission line for transmitting an electric signal, a resistance element used as a termination point, a second transmission line connected to the resistance element, and a surface ground pattern forming a coplanar line through the first and second transmission lines on a surface of a substrate. A modulator-integrated light-emitting element for outputting output light from an output end face is connected to the surface ground pattern. An electrode pad for modulator driving is located near the output end face on a top face of the modulator-integrated light-emitting element. The first transmission line and the electrode pad are connected by a first wire. The electrode pad and the second transmission line are connected by a second wire. A first notch portion is located in the substrate at a point of intersection between a propagation path of output light of the modulator integrated light-emitting element and a first side face of the substrate.Type: ApplicationFiled: June 2, 2008Publication date: June 25, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Takeshi Saito, Norio Okada
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Patent number: 7551945Abstract: Herein disclosed is a mobile communication apparatus, comprising: a body provided with a liquid crystal screen (5) having image data or character data displayed thereon, and an operating unit (6) for selectively performing operations, the body being divided into first and second housings (2 and 3) along a lateral direction perpendicular to a rotation axis; rotating means (4) for connecting the liquid crystal screen (5) with the operating unit (6) with the liquid crystal screen (5) with the operating unit (6) being rotatable with respect to each other around the rotation axis extending in the longitudinal direction of the liquid crystal screen (5) with the operating unit (6); a system control unit (21) for selectively setting predetermined operation modes in response to the rotation positions of the liquid crystal screen (5) with the operating unit (6) assumed when the liquid crystal screen (5) with the operating unit (6) are rotated with respect to each other through the rotating means (4).Type: GrantFiled: November 13, 2003Date of Patent: June 23, 2009Assignee: Panasonic CorporationInventors: Norio Okada, Mihoko Hotta
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Publication number: 20090016056Abstract: Herein disclosed is an electronic device which can have, without deteriorating the effect of notification by light, an extended area to have electronic parts mounted thereon at the portion of the main body 20 covered with the accessory exterior panel 30, the extended area being extended in size compared with the conventional electronic device, the electronic device available for a cellular phone. The cellular phone 10 comprises a main body 20, an accessory exterior panel 30 detachably mounted on the main body 20, and four screws 50 for fixing the accessory exterior panel 30 to the main body 20. The main body 20 has LEDs and a light guide plate 22c irradiated by the LEDs. The light guide plate 22c is positioned to emit a light to the inner portion of the accessory exterior panel 30 through the side surface 30a of the accessory exterior panel 30.Type: ApplicationFiled: January 27, 2006Publication date: January 15, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Shinichi Morikita, Tetsuya Kubo, Makoto Tamaru, Norio Okada
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Publication number: 20070278617Abstract: A semiconductor device includes a semiconductor substrate, a fuse which comprises a conductive material and is formed on a semiconductor substrate, a contacting target conductor region which is placed around the fuse on the semiconductor substrate and formed so as to make electrical contact with the fuse through the conductive material constituting the fuse when a process for cutting the fuse is carried out, and a determination unit which detects whether or not the fuse is electrically disconnected, and detects whether or not the contacting target conductor region and the fuse are electrically connected, and determines that the fuse is in a cut state when electrical disconnection of said fuse is detected or electrical connection between said contacting target conductor region and said fuse is detected.Type: ApplicationFiled: June 1, 2007Publication date: December 6, 2007Applicant: NEC ELECTRONICS CORPORATIONInventors: Norio Okada, Takehiro Ueda
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Patent number: 7301244Abstract: A semiconductor device should have a structure that allows locating electronic components in a region under a bonding pad. The semiconductor device includes a bonding pad constituting the external connection terminal; a region under the bonding pad including at least two copper layers and a connection via plug, under said bonding pad, disposed so as to connect copper layers that form a pair out of the at least two copper layers; a seal ring constituted of an annular conductor, disposed so as to surround the region under the bonding pad, and to connect a lower one of the copper layers that form said pair to copper layer to form a pair with the lower copper layer; and an interconnect connected to the bonding pad outside the seal ring.Type: GrantFiled: June 16, 2005Date of Patent: November 27, 2007Assignee: NEC Electronics CorporationInventors: Yutaka Tsutsui, Norio Okada
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Publication number: 20070262370Abstract: In an interface between different interlayer insulating films formed of different insulating materials, a flaking-off of the film is easily created, as compared with an interface between interlayer insulating films formed of a same insulating material. A semiconductor device 1 includes a semiconductor substrate 10, an interlayer insulating film 20 (first interlayer insulating film), an interlayer insulating film 30 (second interlayer insulating film) and an interconnect structure 40. The interlayer insulating film 20 is provided on the semiconductor substrate 10. The interlayer insulating film 20 is formed of a first insulating material. The interlayer insulating film 30 is provided on the interlayer insulating film 20. The interlayer insulating film 30 is formed of a second insulating material. Here, the first and the second insulating materials are different insulating materials. The interconnect structure 40 is formed in the circumference region of the semiconductor device 1.Type: ApplicationFiled: May 8, 2007Publication date: November 15, 2007Applicant: NEC ELECTRONICS CORPORATIONInventor: Norio Okada
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Patent number: 7268087Abstract: In order to provide a manufacturing method of a semiconductor device which can improve the interconnection lifetime, while controlling the increase in resistance thereof, and, in addition, can raise the manufacturing stability; by applying a plasma treatment to the surface of a copper interconnection 17 with a source gas comprising a nitrogen element being used, a copper nitride layer 24 is formed, and thereafter a silicon nitride film 18 is formed. Hereat, under the copper nitride layer 24, a thin copper silicide layer 25 is formed.Type: GrantFiled: July 28, 2004Date of Patent: September 11, 2007Assignee: NEC Electronics CorporationInventors: Hidemitsu Aoki, Hiroaki Tomimori, Norio Okada, Tatsuya Usami, Koichi Ohto, Takamasa Tanikuni
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Publication number: 20070195397Abstract: A semiconductor optical modulation device includes a semiconductor optical modulator, an input terminal which is connected to a drive circuit for supplying an electrical signal to the semiconductor optical modulator, an output terminal which is connected to a terminating resistor, an input wire which connects the input terminal to an electrode of the semiconductor optical modulator, and an output wire which connects the output terminal to the electrode of the semiconductor optical modulator. In addition, an additional capacitor or an additional resistor is disposed between the input terminal and the output terminal, and connected in parallel with a series circuit including the input wire and the output wire.Type: ApplicationFiled: September 11, 2006Publication date: August 23, 2007Applicant: MITSUBISHI ELECTRIC CORPORATIONInventor: Norio OKADA
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Publication number: 20070188424Abstract: It is an object of the invention to provide a portable terminal device in which a display of a high visual effect can be performed. The portable terminal device of the invention has: plural light emitting elements 11; and a controlling section 21 which selectively drives the respective plural light emitting elements 11 to cause the plural light emitting elements 11 to perform a matrix display based on display data.Type: ApplicationFiled: March 11, 2005Publication date: August 16, 2007Inventors: Norio Okada, Sachio Aoyama, Toshinari Suo, Takayuki Miyazawa, Naoshi Tsunehiro
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Patent number: D542286Type: GrantFiled: February 4, 2005Date of Patent: May 8, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Satoru Taniyama, Norio Okada, Yoshito Ishikawa
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Patent number: D570323Type: GrantFiled: June 19, 2007Date of Patent: June 3, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Norio Okada, Yuzuru Masuda, Jong Seong Lee
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Patent number: D622245Type: GrantFiled: November 5, 2009Date of Patent: August 24, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Norio Okada, Jong-Seong Lee, Yusuru Masuda