Abstract: In a luminous flux diameter expanding element, a light guide body includes an incident-side diffraction grating (first incident-side diffraction grating) provided on a surface thereof and an exit-side diffraction grating (first exit-side diffraction grating) provided on another surface thereof. The incident-side diffraction grating and the exit-side diffraction grating have the same grating direction and the same grating period. The diffraction angle of a positive first-order diffracted light and the diffraction angle of a negative first-order diffracted light of a beam incident on the incident-side diffraction grating are greater than or equal to a critical angle determined by the refractive index of the light guide body. The positive first-order diffracted light and the negative first-order diffracted light of the beam diffracted by the incident-side diffraction grating propagate in opposite directions along a y-direction within the light guide body and are emitted from the exit-side diffraction grating.

Abstract: Provided is an image display device that attains see-through characteristics and visual perceptibility with a simple structure.

Abstract: An optical device includes a light guide plate; a first diffraction element that is a transmission type diffraction element provided on a first face of the light guide plate and that diffracts and ejects at least a portion of light which is guided along inside the light guide plate; a second diffraction element that is a transmission type diffraction element provided on the first face of the light guide plate and that diffracts at least a portion of light proceeding to the light guide plate; and a third diffraction element that is a reflection type diffraction element provided on a face which is an opposite face of the light guide plate from the first face, and that diffracts at least a portion of light which enters an inside of the light guide plate via the second diffraction element.

Abstract: A light flux diameter-expanding element (pupil expanding element) which is used in a retina scanning type display apparatus includes a first diffraction grating having a grating pattern extending in a first direction X, a second diffraction grating, a third diffraction grating, and a fourth diffraction grating, and expands a diameter of the incident light flux in a second direction Y so as to emit the light. In addition, the light flux diameter-expanding element includes a fifth diffraction grating having a grating pattern extending in the second direction Y, a sixth diffraction grating, a seventh diffraction grating, and an eighth diffraction grating, and expands a diameter of the incident light flux in the first direction X so as to emit the light.

Abstract: A light flux diameter expanding element (a pupil expanding element) used in a retina scanning display device includes first to fourth diffraction gratings which are provided with grating patterns extending in a first direction, and fifth to eighth diffraction gratings which are provided with grating patterns extending in a second direction, and includes a half-wave plate between the first diffraction grating and the fifth diffraction grating. A first light flux of polarized light in which an electric field vector oscillates in the first direction enters the first diffraction grating. A second light flux of polarized light in which the electric field vector oscillates in the second direction enters the fifth diffraction grating due to the half-wave plate. Therefore, it is possible to expand a diameter of the incident first light flux in the first direction and the second direction and emit the result as the third light flux.

Abstract: In a Cu wiring manufacturing method, a MnOx film which becomes a self-formed barrier film by reaction with an interlayer insulating film of a substrate is formed on a surface of a recess formed in the interlayer insulating film by ALD. A hydrogen radical process is performed on a surface of the MnOx film to reduce the surface of the MnOx film. A Ru film is formed by CVD on the surface of the MnOx film which has been reduced by the hydrogen radical process. A Cu-based film is formed on the Ru film by PVD to be filled in the recess. When the Ru film is formed, a film-formation condition of the MnOx film and a condition of the hydrogen radical process are set such that nucleus formation is facilitated and the Ru film is formed in a state where a surface smoothness is high.

Abstract: A Cu wiring forming method of forming Cu wiring that is to be arranged in contact with tungsten wiring, by filling Cu into a recess formed in a substrate, includes: removing a tungsten oxide formed on a surface of the tungsten wiring; forming a nitriding preventing film at least on the surface of the tungsten wiring in the recess; forming a barrier film that prevents diffusion of Cu, on a surface in the recess from above the nitriding preventing film; forming a liner film on the barrier film; and filling a Cu film on the liner film.

Abstract: Provided is a method of forming a copper (Cu) wiring in a recess formed to have a predetermined pattern in an insulating film formed on a surface of a substrate. The method includes: forming a barrier film at least on a surface of the recess, the barrier film serving as a barrier for blocking diffusion of Cu; forming a Ru film on the barrier film by Chemical Mechanical Deposition (CVD); forming a Cu alloy film on the Ru film by Physical Vapor Deposition (PVD) to bury the recess; forming a Cu wiring using the Cu alloy film buried in the recess; and forming a dielectric film on the Cu wiring.

Abstract: Cu wiring fabrication method for fabricating Cu wiring with respect to substrate having interlayer dielectric film having trench formed thereon, includes: forming barrier film on surface of the trench; forming Ru film on surface of the barrier film by CVD; burying the trench by forming Cu film or Cu alloy film on the Ru film; forming Cu film or Cu alloy film at corners of bottom of the trench while re-sputtering the formed Cu film or Cu alloy film in a condition where first formed Cu film or Cu alloy film re-sputtered by an ion action of the plasma generation gas; and subsequently burying the Cu film or the Cu alloy film in the trench in condition where the Cu film or the Cu alloy film is formed on field portion of the substrate, and reflows in the trench by an ion action of the plasma generation gas.

Abstract: A Cu wiring forming method of forming Cu wiring that is to be arranged in contact with tungsten wiring, by filling Cu into a recess formed in a substrate, includes: removing a tungsten oxide formed on a surface of the tungsten wiring; forming a nitriding preventing film at least on the surface of the tungsten wiring in the recess; forming a barrier film that prevents diffusion of Cu, on a surface in the recess from above the nitriding preventing film; forming a liner film on the barrier film; and filling a Cu film on the liner film.

Abstract: A method of forming a copper wiring buried in a recess portion of a predetermined pattern formed in an interlayer insulation layer of a substrate is disclosed. The method includes: forming a manganese oxide film at least on a surface of the recess portion, the manganese oxide film serving as a self-aligned barrier film through reaction with the interlayer insulation layer; performing hydrogen radical treatment with respect to a surface of the manganese oxide film; placing a metal more active than ruthenium on the surface of the manganese oxide film after the hydrogen radical treatment; forming a ruthenium film on the surface where the metal more active than ruthenium is present; and forming a copper film on the ruthenium film by physical vapor deposition (PVD) to bury the copper film in the recess portion.

Abstract: A light flux diameter-expanding element (pupil expanding element) which is used in a retina scanning type display apparatus includes a first diffraction grating having a grating pattern extending in a first direction X, a second diffraction grating, a third diffraction grating, and a fourth diffraction grating, and expands a diameter of the incident light flux in a second direction Y so as to emit the light. In addition, the light flux diameter-expanding element includes a fifth diffraction grating having a grating pattern extending in the second direction Y, a sixth diffraction grating, a seventh diffraction grating, and an eighth diffraction grating, and expands a diameter of the incident light flux in the first direction X so as to emit the light.

Abstract: An optical element includes a light guide is provided with a incidence section and a emission section, a semitransmissive reflective film is provided in the inside of the light guide, a first diffraction element is provided in the incidence section, and is provided with a plurality of gratings, a second diffraction element is provided in the emission section, and is provided with a plurality of gratings, and a reflective film is provided in the incidence section in a periphery of the first diffraction element, in which the pitch of the plurality of gratings of the first diffraction element is equivalent to the pitch of the plurality of gratings of the second diffraction element, and each extension direction of the plurality of gratings of the first diffraction element is the same direction as each extension direction of the plurality of gratings of the second diffraction element.

Abstract: A virtual image display apparatus includes a first light guide that not only causes a display light flux incident through a first light incident surface to repeatedly undergo internal reflection to travel in a first direction away from the first light incident surface but also causes part of the display light flux to exit to the outside through areas of a first light exiting surface that is at least one of interfaces with the outside and extends in the first direction, a first light-incident-side diffraction grating that diffracts light incident thereon to cause the diffracted light to enter the first light guide, and a first light-exiting-side diffraction grating that diffracts light incident from the first light guide.

Abstract: An illuminating device includes light emitting elements extending in a lengthwise direction and a light guide plate having a first principal surface for emitting light from the light emitting elements and a second principal surface facing the first principal surface. The light guide plate has light guide regions corresponding to the light emitting elements. The light emitting elements overlap the light guide plate on a side of the second principal surface of the light guide plate in plan view. The side of the second principal surface of the light guide plate has first sectional surfaces, on which light originated from each of the light emitting elements is incident. The side of the second principal surface of the light guide plate has second sectional surfaces, each having a reflection surface for reflecting the light originated from each light emitting element toward the first sectional surface, corresponding to the light emitting elements.

Abstract: In a plasma processing method, plasma processing is performed in a state where the object is attracted and held on the electrostatic chuck by applying a first voltage as an application voltage thereto and a thermal conduction gas is supplied to a gap between the electrostatic chuck and the object. The application voltage is decreased while stopping the supply of the thermal conduction gas and exhausting the thermal conduction gas remaining between the electrostatic chuck and the object upon completion of the plasma processing. The object is separated from the electrostatic chuck by setting the application voltage to the electrostatic chuck to zero after the application voltage is decreased.

Abstract: Cu wiring fabrication method for fabricating Cu wiring with respect to substrate having interlayer dielectric film having trench formed thereon, includes: forming barrier film on surface of the trench; forming Ru film on surface of the barrier film by CVD; burying the trench by forming Cu film or Cu alloy film on the Ru film; forming Cu film or Cu alloy film at corners of bottom of the trench while re-sputtering the formed Cu film or Cu alloy film in a condition where first formed Cu film or Cu alloy film re-sputtered by an ion action of the plasma generation gas; and subsequently burying the Cu film or the Cu alloy film in the trench in condition where the Cu film or the Cu alloy film is formed on field portion of the substrate, and reflows in the trench by an ion action of the plasma generation gas.

Abstract: There is provided a protection clip for a torque receiving part. The protection clip is fitted into a concave portion of a torque receiving part of a caliper body, into which a lug part of a brake pad of a disc brake is inserted. The protection clip includes first and second separation preventing claws. The first separation preventing claw is bent from an outer periphery-side wall surface of the concave portion toward an upper attaching surface of the torque receiving part, and is configured to be fitted into one of a pair of recesses formed over an opening of the concave portion. The second separation preventing claw is bent from a lower attaching surface of the torque receiving part toward the concave portion, and is configured to be fitted into the other of the pair of recesses.

Abstract: An optical device includes a light guide plate; a first diffraction element that is a transmission type diffraction element provided on a first face of the light guide plate and that diffracts and ejects at least a portion of light which is guided along inside the light guide plate; a second diffraction element that is a transmission type diffraction element provided on the first face of the light guide plate and that diffracts at least a portion of light proceeding to the light guide plate; and a third diffraction element that is a reflection type diffraction element provided on a face which is an opposite face of the light guide plate from the first face, and that diffracts at least a portion of light which enters an inside of the light guide plate via the second diffraction element.

Abstract: A method of forming a copper wiring buried in a recess portion of a predetermined pattern formed in an interlayer insulation layer of a substrate is disclosed. The method includes: forming a manganese oxide film at least on a surface of the recess portion, the manganese oxide film serving as a self-aligned barrier film through reaction with the interlayer insulation layer; performing hydrogen radical treatment with respect to a surface of the manganese oxide film; placing a metal more active than ruthenium on the surface of the manganese oxide film after the hydrogen radical treatment; forming a ruthenium film on the surface where the metal more active than ruthenium is present; and forming a copper film on the ruthenium film by physical vapor deposition (PVD) to bury the copper film in the recess portion.