Abstract: A polarization separation device includes a first end surface on which incident light is incident, a polarization separation surface that reflects an s-polarized light component and transmits a p-polarized light component, a second end surface that is arranged to be opposed to the first end surface, converts the p-polarized light component transmitted through the polarization separation surface to the s-polarized light component, and reflects the converted light component to an optical axis direction which is the same as the incident light, a third end surface from which the s-polarized light component reflected by the polarization separation surface without transmitting through the polarization separation surface is output, and a fourth end surface that is arranged to be opposed to the third end surface and from which the s-polarized light component reflected by the second end surface and the polarization separation surface is output.

Abstract: A first diffraction optical element is disposed on a light incident surface of a light guide, a second diffraction optical element is disposed on a light emitting surface of the light guide, and a reflection layer is disposed on an end surface of the light guide. A diffraction grating of the first diffraction optical element and a diffraction grating of the second diffraction optical element has an inclined portion respectively. The inclined portion of the first diffraction optical element and the inclined portion of the second diffraction optical element are inclined in same direction.

Abstract: An illuminating device includes light emitting elements extending in a lengthwise direction and a light guide plate having a first principal surface for emitting light from the light emitting elements and a second principal surface facing the first principal surface. The light guide plate has light guide regions corresponding to the light emitting elements. The light emitting elements overlap the light guide plate on a side of the second principal surface of the light guide plate in plan view. The side of the second principal surface of the light guide plate has first sectional surfaces, on which light originated from each of the light emitting elements is incident. The side of the second principal surface of the light guide plate has second sectional surfaces, each having a reflection surface for reflecting the light originated from each light emitting element toward the first sectional surface, corresponding to the light emitting elements.

Abstract: Provided is a method of forming a copper (Cu) wiring in a recess formed to have a predetermined pattern in an insulating film formed on a surface of a substrate. The method includes: forming a barrier film at least on a surface of the recess, the barrier film serving as a barrier for blocking diffusion of Cu; forming a Ru film on the barrier film by Chemical Mechanical Deposition (CVD); forming a Cu alloy film on the Ru film by Physical Vapor Deposition (PVD) to bury the recess; forming a Cu wiring using the Cu alloy film buried in the recess; and forming a dielectric film on the Cu wiring.

Abstract: In a display apparatus, image light emitted from an image forming device is incident on an image light incidence portion of a light guide member after being diffracted by a second diffractive optical element, and emitted from an image light emission portion after moving forward in the light guide member. The image light emitted from the image light emission portion is diffracted by a first diffractive optical element and reaches the eyes of an observer. On a position where unnecessary external light is made incident on the light guide member, an external light noise reduction element which has a polarizing member and the like is provided. For this reason, even when the unnecessary external light is made incident on the light guide member, it is possible to inhibit the unnecessary external light from reaching the eye of the observer.

Abstract: A method of forming a Cu wiring in a trench or hole formed in a substrate is provided. The method includes forming a barrier film on the surface of the trench or hole, forming a Ru film on the barrier film, and embedding Cu in the trench or hole by forming a Cu film on the Ru film using PVD while annealing the substrate such that migration of copper into the trench or hole occurs.

Abstract: A method of forming a Cu wiring in a trench or hole formed in a substrate is provided. The method includes forming a barrier film on the surface of the trench or hole, forming a Ru film on the barrier film, and embedding Cu in the trench or hole by forming a Cu film on the Ru film using PVD while annealing the substrate such that migration of copper into the trench or hole occurs.

Abstract: An optical device includes a light-conducting member, having a first panel surface disposed facing an image forming unit, that conducts image light incident on a light entry plane formed at an end of the first panel surface to a light exit plane formed in front of the viewer's eye; a first diffractive optics element, provided on the light entry plane, that diffracts the image light incident on the light entry plane in a predetermined direction and transmits that light into the light-conducting member; a second diffractive optics element, provided on the light exit plane, that diffracts the image light exiting from the light exit plane in a predetermined direction and transmits that light to the front of the viewer's eye; and one or more reflective planes disposed within a waveguide for the image light diffracted by the first diffractive optics element.

Abstract: In a plasma processing method, plasma processing is performed in a state where the object is attracted and held on the electrostatic chuck by applying a first voltage as an application voltage thereto and a thermal conduction gas is supplied to a gap between the electrostatic chuck and the object. The application voltage is decreased while stopping the supply of the thermal conduction gas and exhausting the thermal conduction gas remaining between the electrostatic chuck and the object upon completion of the plasma processing. The object is separated from the electrostatic chuck by setting the application voltage to the electrostatic chuck to zero after the application voltage is decreased.

Abstract: In a plasma processing apparatus, a mounting table is provided in a processing chamber, and a remote plasma generating unit is configured to generate an excited gas by exiting a hydrogen-containing gas. The remote plasma generating unit has an outlet for discharging the excited gas. A diffusion unit is provided to correspond to the outlet of the remote plasma generating unit and serves to receive the excited gas flowing from the outlet and diffuse the hydrogen active species having a reduced amount of hydrogen ions. An ion filter is disposed between the diffusion unit and the mounting table while being separated from the diffusion unit. The ion filter serves to capture the hydrogen ions contained in the hydrogen active species diffused by the diffusion unit and allow the hydrogen active species having a further reduced amount of hydrogen ions to pass therethrough the mounting table.

Abstract: A virtual image display apparatus includes an organic EL device that outputs light having one kind of wavelength band, a light guide member, and a reflection-type volume hologram that is disposed on a first face of the light guide member and diffracts and reflects light of a predetermined wavelength band of the light that has entered. The organic EL device includes an optical resonance structure that causes the above-mentioned light of one-kind wavelength band to resonate.

Abstract: A thin film forming method in which a thin film is formed on a surface of a target object to be processed to fill a recess formed in the surface of the target object includes the steps of forming a metal layer for filling on the surface of the target object to fill the recess formed in the surface of the target object and forming a metal film for preventing diffusion on an entire surface of the target object to cover the metal layer for filling. The thin film forming method further includes the step of annealing the target object having the metal film for preventing diffusion formed thereon.

Abstract: A film forming method which generates metal ions from a metal target with a plasma in a processing chamber and attracts the metal ions with a bias to deposit a metal thin film on a target object wherein trenches are formed. The method includes: generating metal ions from a target and attracting the metal ions into a target object with a bias to form a base film in a trench; ionizing a rare gas with the bias in a state where no metal ion is generated and attracting the generated ions into the target object to etch the base film; and plasma sputtering the target to generate metal ions and attracting the metal ions into the object with a high frequency power for bias to deposit a main film as a metal film, while reflowing the main film by heating.

Abstract: A method of forming a Cu wiring in a trench or hole formed in a substrate is provided. The method includes forming a barrier film on the surface of the trench or hole, forming a Ru film on the barrier film, and embedding copper in the trench or hole by forming a Cu film on the Ru film using PVD while heating the substrate such that migration of copper into the trench or hole occurs.

Abstract: A film formation method is disclosed for depositing a metal film on a target substrate by supplying a metal carbonyl source in gas phase to a surface of the target substrate and decomposing the source near the surface of the target substrate. The method includes a step of preferentially decomposing the metal carbonyl source in an area near the outer peripheral portion of the target substrate when the metal film is being deposited on the surface of the target substrate. As a result, a CO concentration in the atmosphere is increased locally near the outer peripheral portion of the target substrate and the depositing of the metal film on the outer peripheral portion is better controlled.

Abstract: In a Cu wiring forming method which is followed by a post-process including a treatment of a temperature of 500° C. or higher, an adhesion film made of a metal having a lattice spacing that differs from the lattice spacing of Cu by 10% or less is formed on a substrate having a trench and/or a hole in the surface such that the adhesion film is deposited on at least the bottom and side surfaces of the trench and/or hole. A Cu film is formed on the adhesion film to fill the trench and/or hole. An annealing process is performed on the substrate on which the Cu film has been formed at 350° C. or higher. The CU film is polished to leave only the part of the Cu film which corresponds to the trench and/or hole. A cap is formed on the polished Cu film to form a Cu wiring.

Abstract: A method of forming a Cu wiring in a trench or hole formed in a substrate is provided. The method includes forming a barrier film on the surface of the trench or hole, forming a Ru film on the barrier film, and embedding Cu in the trench or hole by forming a Cu film on the Ru film using PVD while annealing the substrate such that migration of copper into the trench or hole occurs.

Abstract: An object of the present invention is to provide a A display device capable of narrowing the area of the frame. In order to achieve this object, the display device according to the present invention has a substrate having a plurality of arranged display elements and a wiring layer of a power source on the peripheral side; a bank layer for mutually separating the display elements; an electrode layer for covering the plurality of display elements and the bank layer; and a sealing substrate for further covering the electrode layer by joining the peripheral portion of the substrate and the sealing portion circling around the periphery via a joining element such as an adhesive; wherein the periphery of the sealing substrate is positioned inside the periphery of the substrate, and the peripheral portion of the electrode layer is connected to the wiring of the power source within the sealing portion.

Abstract: An object of the present invention is to provide a display device capable of narrowing the area of the frame. In order to achieve this object, the display device according to the present invention has a substrate having a plurality of arranged display elements and a wiring layer of a power source on the peripheral side; a bank layer for mutually separating the display elements; an electrode layer for covering the plurality of display elements and the bank layer; and a sealing substrate for further covering the electrode layer by joining the peripheral portion of the substrate and the sealing portion circling around the periphery via a joining element such as an adhesive; wherein the periphery of the sealing substrate is positioned inside the periphery of the substrate, and the peripheral portion of the electrode layer is connected to the wiring of the power source within the sealing portion.

Abstract: An object of the present invention is to provide a display device capable of narrowing the area of the frame. In order to achieve this object, the display device according to the present invention has a substrate having a plurality of arranged display elements and a wiring layer of a power source on the peripheral side; a bank layer for mutually separating the display elements; an electrode layer for covering the plurality of display elements and the bank layer; and a sealing substrate for further covering the electrode layer by joining the peripheral portion of the substrate and the sealing portion circling around the periphery via a joining element such as an adhesive; wherein the periphery of the sealing substrate is positioned inside the periphery of the substrate, and the peripheral portion of the electrode layer is connected to the wiring of the power source within the sealing portion.