Patents by Inventor Pei Pei

Pei Pei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7858643
    Abstract: Enantiomerically pure compound of formula 1 are provided, as well as methods for their synthesis and use. Preferred compounds are potent inhibitors of the c-Met protein kinase, and are useful in the treatment of abnormal cell growth disorders, such as cancers.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: December 28, 2010
    Assignee: Agouron Pharmaceuticals, Inc.
    Inventors: Jingrong Jean Cui, Lee Andrew Funk, Lei Jia, Pei-Pei Kung, Jerry Jialun Meng, Mitchell David Nambu, Mason Alan Pairish, Hong Shen, Michelle Tran-Dube
  • Publication number: 20100324061
    Abstract: Enantiomerically pure compound of formula 1 are provided, as well as methods for their synthesis and use. Preferred compounds are potent inhibitors of the c-Met protein kinase, and are useful in the treatment of abnormal cell growth disorders, such as cancers.
    Type: Application
    Filed: September 1, 2010
    Publication date: December 23, 2010
    Inventors: Jingrong Jean Cui, Lee Andrew Funk, Lei Jia, Pei-Pei Kung, Jerry Jialun Meng, Mitchell David Nambu, Mason Alan Pairish, Hong Shen, Michelle Tran-Dube
  • Publication number: 20100159030
    Abstract: Provided herein is a method of screening a tumour cell for resistance to a tubulin-binding agent, the method comprising detecting the expression of any one or more of class II, class III and class IVb ?-tubulin by the tumour cell, wherein the expression of any one or more of class II, class III and class IVb ?-tubulin indicates that the tumour cell has resistance or potential resistance to the tubulin-binding agent. Also provided are methods of modulating the sensitivity of a tumour cell. Also provided is a method of modulating the tumorigenesis of a tumour cell.
    Type: Application
    Filed: September 8, 2009
    Publication date: June 24, 2010
    Applicant: NewSouth Innovations Pty Limited
    Inventors: Maria Kavallaris, Pei Pei Gan, Joshua Adam McCarroll
  • Patent number: 7721439
    Abstract: A manufacturing system for processing a container body into a heat dissipating device includes: a support for supporting the container body thereon; an elastically deformable member covering a periphery of an opening in an upper wall of the container body and defining a cavity in fluid communication with interior of the container body through the opening; a vacuuming device connected to the elastically deformable member for vacuuming the inner space; a working fluid-loading device connected to the elastically deformable member for filling a predetermined amount of the working fluid into the container body; a depressing device including opposite upper and lower pressing members; and a driving mechanism for driving movement of at least one of the upper and lower pressing members.
    Type: Grant
    Filed: September 2, 2005
    Date of Patent: May 25, 2010
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Jao-Ching Lin, Pei-Pei Ding, Hsiu-Wei Yang, Wen-Hwa Yu, Yen-Wen Chen
  • Publication number: 20100093696
    Abstract: The present invention is directed to compounds of formula (I), and pharmaceutically acceptable salts thereof, their synthesis, and their use as HSP-90 inhibitors.
    Type: Application
    Filed: January 25, 2008
    Publication date: April 15, 2010
    Inventors: Michael J. Bennett, Luke R. Zehnder, Sacha Ninkovic, Pei-Pei Kung, Jerry Jialun Meng, Huang Buwen
  • Publication number: 20100041681
    Abstract: The present invention is directed to compounds of formula (I), or pharmaceutically acceptable salts thereof, their synthesis, and their use as HSP-90 inhibitors.
    Type: Application
    Filed: August 4, 2009
    Publication date: February 18, 2010
    Inventors: Pei-Pei Kung, Jerry Jialun Meng
  • Publication number: 20090308585
    Abstract: An improved method for manufacturing tube and fin heat exchangers that, according to a preferred embodiment, includes a process for increasing the stiffness and rigidity of heat exchanger fins. Stiffer fins have a greater tendency to maintain proper alignment within a stack of fins, which aids in lacing long stacks of fins with small (e.g., 5 mm) diameter tubing. Preferably, fin stiffness is increased by forming a plurality of longitudinal ribs within the fin during the fin stamping process. More preferably still, two ribs for each longitudinal row of collared holes are provided. The preferred embodiment also includes a slotted heat exchanger fin that is dimensioned and arranged for optimized thermodynamic performance when used with small diameter tubing, thus reducing the space required for a given heat exchanger system.
    Type: Application
    Filed: June 15, 2009
    Publication date: December 17, 2009
    Inventors: Pei Pei Chen, Russell Tharp
  • Publication number: 20090215742
    Abstract: The present invention is directed to compounds of formula (I), and pharmaceutically acceptable salts and solvates thereof, their synthesis, and their use as HSP-90 inhibitors.
    Type: Application
    Filed: April 21, 2006
    Publication date: August 27, 2009
    Inventors: Lee Andrew Funk, Mary Catherine Johnson, Pei-Pei Kung, Zhongxiang Zhou
  • Patent number: 7469740
    Abstract: A heat dissipating device includes: a container body defining an inner space therein and having a fluid passage and opposite upper and lower walls; a working fluid received in the inner space in the container body; a wick structure mounted in the inner space; and a sealing material that seals the fluid passage of the container body. One of the upper and lower walls has a wall portion that is disposed adjacent to the fluid passage and that is depressed in such a manner that the depressed wall portion cooperates with the other of the upper and lower walls to form a sealing mechanism that functions to isolate the fluid passage from the inner space.
    Type: Grant
    Filed: September 2, 2005
    Date of Patent: December 30, 2008
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Jao-Ching Lin, Pei-Pei Ding, Hsiu-Wei Yang, Wen-Hwa Yu, Yen-Wen Chen
  • Patent number: 7465842
    Abstract: The invention relates to biocatalytic methods for preparing enantiomerically pure stereoisomers of 1-(2,6-dichloro-3-fluorophenyl)ethanol. Disclosed are methods of preparation of the desired (S)-enantiomer, which methods are based on a combination of enzymatic resolution, chemical esterification and chemical hydrolysis with inversion of 1-(2,6-dichloro-3-fluorophenyl)ethyl esters or stereoselective bio-reduction of 2,6-dichloro-3-fluoro-acetophenone with a biocatalyst such as an enzyme or a microorganism. The chiral (S)-enantiomer can be used in the synthesis of certain enantiomerically enriched, ether linked 2-aminopyridine compounds that potently inhibit auto-phosphorylation of human heptocyte growth factor receptor.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: December 16, 2008
    Assignee: Agouron Pharmaceuticals, Inc.
    Inventors: Pei-Pei Kung, Carlos Martinez, Junhua Tao
  • Patent number: 7464463
    Abstract: A method for making a heat dissipating device includes the steps of: mounting an elastically deformable member on a container body in such a manner that the elastically deformable member covers a periphery of an opening in the container body and that the elastically deformable member cooperates with the container body to define a cavity in fluid communication with an inner space in the container body through the opening; vacuuming the inner space in such a manner that air in the inner space is drawn through the opening and the cavity to the outside of the container body; filling the inner space with a predetermined amount of a working fluid through the opening and the cavity; and forming a sealing mechanism that functions to isolate the inner space from the opening.
    Type: Grant
    Filed: September 2, 2005
    Date of Patent: December 16, 2008
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Jao-Ching Lin, Pei-Pei Ding, Hsiu-Wei Yang, Wen-Hwa Yu, Yen-Wen Chen
  • Patent number: 7461450
    Abstract: A method for making a heat dissipating device includes the steps of: preparing a container body that has a fluid passage and opposite upper and lower walls, the fluid passage being in fluid communication with an inner space in the container body; vacuuming the inner space through the fluid passage; filling the inner space with a predetermined amount of a working fluid through the fluid passage; and depressing a wall portion of a selected one of the upper and lower walls in such a manner that the depressed wall portion is deformed toward the other of the upper and lower walls so as to form a depression in the selected one of the upper and lower walls, and so as to form a sealing mechanism that functions to isolate the fluid passage from the inner space.
    Type: Grant
    Filed: September 2, 2005
    Date of Patent: December 9, 2008
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Jao-Ching Lin, Pei-Pei Ding, Hsiu-Wei Yang, Wen-Hwa Yu, Yen-Wen Chen
  • Publication number: 20080080133
    Abstract: A flat type heat pipe device includes a packaging unit and a bonding member. The packaging unit further includes a first shell member and a second shell member. The first shell member has a work zone, a first joining part surrounding the work zone and an upright stop part disposed between the work zone and the joining part. The second shell member provides a shape corresponding to the first shell member to cover the first shell member and has a shell lid part spacing apart from the work zone and a second joining part disposed on the first joining part. The bonding member is disposed between the first joining part and the second joining part to adhere the first joining part to the second joining part. When the first shell member is pressingly fit with second shell member, the stop part is capable of preventing the bonding member from entering the packaging unit.
    Type: Application
    Filed: October 2, 2006
    Publication date: April 3, 2008
    Inventors: Hsiu-Wei Yang, Pei-Pei Ding, Wen-Hwa Yu, Chih-Hua Wu, Tsao-Hsiang Cheng
  • Publication number: 20070294892
    Abstract: A method for making a plate type heat pipe includes the steps of: stacking a wick structure on a first plate, the wick structure defining a plurality of capillaries; high frequency welding the wick structure to the first plate; stacking a second plate on the wick structure; and connecting hermetically peripheral edges of the first and second plates together so as to form an enclosed cavity between the first and second plates for enclosing the wick structure.
    Type: Application
    Filed: October 24, 2006
    Publication date: December 27, 2007
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Hsiuwei Yang, Pei-Pei Ding, Wenhwa Yu, Tsao-Hsiang Cheng
  • Publication number: 20070261243
    Abstract: A method for making a plate type heat pipe includes following steps: (A) providing a metallic hollow casing unit, which includes a first casing member with a first joining part at the periphery thereof and a second casing member with a second joining part at the periphery thereof corresponding to and matching the first joining part to form a containing space, and an injection part being arranged at one of the casing members for the containing space communicating with outside; (B) forming a bonding layer on a surface of at least one of the joining parts facing the other one of the joining parts with a treatment of gas phase deposit; and (C) the first joining part being disposed on the second joining part and being heated up to melt the bonding layer. The bonding layer is adhered to the second joining part with consistent thickness to allow the first joining part engaging with the second joining part air-tightly.
    Type: Application
    Filed: May 11, 2006
    Publication date: November 15, 2007
    Inventors: Hsiu-Wei Yang, Pei-Pei Ding, Jao-Ching Lin, Wen-Hwa Yu
  • Patent number: 7267755
    Abstract: A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: September 11, 2007
    Assignee: Sentelic Corporation
    Inventors: Jao-Ching Lin, Pei-Pei Ding
  • Patent number: 7230098
    Abstract: Aminopyridine and aminopyrazine compounds of formula (1), compositions including these compounds, and methods of their use are provided.
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: June 12, 2007
    Assignee: Sugen, Inc.
    Inventors: Jingrong Jean Cui, Dilip Bhumralkar, Iriny Botrous, Ji Yu Chu, Lee A. Funk, Cathleen Elizabeth Hanau, G. Davis Harris, Lei Jia, Joanne Johnson, Stephen A. Kolodziej, Pei-Pei Kung, Xiaoyuan (Sharon) Li, Jason (Qishen) Lin, Jerry Jialun Meng, Mitchell David Nambu, Christopher G. Nelson, Mason Alan Pairish, Hong Shen, Michelle Tran-Dube, Allison Walter, Fang-Jie Zhang, Jennifer Zhang
  • Publication number: 20070072874
    Abstract: Aminopyridine and aminopyrazine compounds of formula (1), compositions including these compounds, and methods of their use are provided. Preferred compounds of formula 1 have activity as protein kinase inhibitors, including as inhibitors of c-MET.
    Type: Application
    Filed: November 14, 2006
    Publication date: March 29, 2007
    Inventors: Jingrong Cui, Dilip Bhumralkar, Iriny Botrous, Ji Chu, Lee Funk, Cathleen Hanau, G. Harris, Lei Jia, Joanne Johnson, Stephen Kolodziej, Pei-Pei Kung, Xiaoyuan Li, Jason Lin, Jerry Meng, Mitchell Nambu, Christopher Nelson, Mason Pairish, Hong Shen, Michelle Tran-Dube, Allison Walter, Fang-Jie Zhang, Jennifer Zhang
  • Publication number: 20060225908
    Abstract: A heat dissipating microdevice is made from comprising the steps of: a board including an insulator layer having a first and facing second surfaces and a conductor layer on the first surface by forming in the layer a hole that extends between the surfaces to form a fluid microsystem including: first and second micro-channel structures disposed respectively in first and second areas of the board and bounded by the layer, and first and second micro-conduit structures that permit fluid communication between the micro-channel structures. The first micro-conduit structure has a first end in fluid communication with the second micro-channel structure and a second end section in fluid communication with the first micro-channel structure. The second micro-conduit structure has a first end section in fluid communication with the first micro-channel structure and a second end section in fluid communication with the second micro-channel structure. A cover is put on the second surface.
    Type: Application
    Filed: June 5, 2006
    Publication date: October 12, 2006
    Applicant: SENTELIC CORPORATION
    Inventors: Pei-Pei Ding, Chang-Chi Lee, Jao-Ching Lin
  • Patent number: D632374
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: February 8, 2011
    Assignee: Goodman Global, Inc.
    Inventors: Pei Pei Chen, Russell Tharp