Abstract: An integrated circuit chip cooling device includes a network of micropipes. A first pipe portion and a second pipe portion of the network are connected by at least one valve. The valve is formed of a bilayer strip. In response to change in temperature, the shape of the bilayer strip changes to move the valve from a substantially closed position to an open position. In one configuration, the change is irreversible. In another configuration, the change is reversible in response to an opposite change in temperature.

Abstract: A method of transferring objects onto a substrate, or a moving substrate, the objects to be transferred being placed in a transfer area including an inlet and an outlet spaced apart from one another by two lateral edges opposite one another, and holding a carrier liquid forming a conveyor, the objects being held by a compact film of particles floating on the carrier liquid of the transfer area, in which the objects are moved with the particle film to be transferred onto the substrate when they reach the outlet.

Abstract: An assembly converting thermal energy into electrical energy including: at least one temperature sensitive bimetallic strip arranged in a space delimited by a hot source and a cold source facing each other, the bimetallic strip extending along a longitudinal axis; at least one suspended element fixed in movement to the sensitive element and extending laterally from the sensitive element and including a free end; and at least one piezoelectric element suspended from a part fixed relative to the sensitive element and vibrated by the suspended element such that it is vibrated when the bimetallic strip changes configuration and the suspended element comes into contact with the piezoelectric element, the piezoelectric element being located outside the space defined between the bimetallic strip and the hot source and outside the space between the bimetallic strip and the cold source.

Abstract: Integrated circuit equipped with at least two levels of superimposed transistors, comprising: a first transistor at a first level, a first plug, a second plug and a third plug, connected to a drain region, a gate and a source region respectively of the first transistor, the first plug, the second plug and the third plug passing through an insulating layer covering the first transistor a second transistor equipped with an active zone defined in a semi-conducting layer arranged at one end of the plugs and facing the first transistor, the transistor comprising a gate arranged between the first plug and the third plug.

Abstract: A facility for depositing a film of ordered particles onto a moving substrate, the facility including: a transfer area including an entry of particles and an exit of particles spaced apart from each other by two side edges facing each other, retaining a carrier liquid on which the particles float, a capillary bridge ensuring connection between the carrier liquid contained in the transfer area and the substrate, and a plurality of suction nozzles capable of attracting the particles towards its two side edges.

Abstract: A process for depositing a compact film of particles on an internal surface of a part, including: a) placing the part in a carrier liquid; b) generating a carrier liquid stream in a hollow of the part towards a surface of the carrier liquid, to create a protuberance; c) dispensing the particles to form a compact film floating on the liquid between a contact line and an upstream front of particles; and d) transferring the film onto the internal surface by operating a relative displacement between the part and the surface of the carrier liquid, while continuing dispensing the particles on the upstream front.

Abstract: A device includes a deformable shell that defines an inner space under a gas pressure higher than the atmospheric pressure. A flexible piezoelectric membrane is applied against an inner wall of the deformable shell under the effect of the pressure present in the inner space. The membrane is capable of generating electric energy under the effect of a deformation of the shell. An electric circuit is electrically connected to the piezoelectric membrane and includes an element for storing the electric energy that it generates and a rigid structure. Longilineal resilient elements for holding the electric circuit according to a predetermined position of the inner space are each arranged between the rigid structure of the electric circuit and the inner wall of the deformable shell and secured to the piezoelectric membrane and to the rigid structure.

Abstract: A device includes a rigid outer shell defining a hollow inner space. The device also includes an inner shell defining a hollow inner space. The inner shell is housed in the inner space of the outer shell and capable of freely displacing therein and including at least one layer of piezoelectric material capable of generating electric energy under the effect of an impact to which it is submitted against the outer shell. An electric circuit is housed in the inner space of the inner shell, electrically connected to the piezoelectric material layer, and includes an element for storing the electric energy generated by the piezoelectric material layer of the inner shell. Further, the device includes elements for holding the electric circuit in the inner shell.

Abstract: The device includes a thermoelectric module provided with a thermocouple. Said thermocouple includes a first and second leg which are made of different thermoelectric materials, electrically connected by a connecting element configured to deform according to the temperature thereof so as to assume: a first deformation position in which the first and second legs are electrically connected in series solely by means of the connecting element; and a second deformation position in which the connecting element is in electrical contact with a shunt contact pad of the device, said shunt contact pad being made of a material, the electrical conductivity of which is greater than the electric conductivity of the connecting element and of the first and second legs. The device also includes a load, the electrical resistance of which is lower than the electrical resistance of the thermoelectric module, said load being electrically connected to the shunt contact pad.

Abstract: A method for depositing particles on a substrate, or a running substrate, including: (a) producing at least one first compact film of particles floating on a carrier liquid provided in a transfer area having an outlet of particles arranged facing the substrate; (b) producing at least one pattern by depositing a substance on the first film in the transfer area, along a contour of the pattern, the substance maintaining the particles of the film together in contact with the substance; (c) removing at least one portion of the particles of the first film located interiorly relatively to the contour, or exteriorly relatively to the contour; and then (d) transferring patterns onto the substrate through the outlet of particles.

Abstract: A racket having a handle, a frame attached to the handle, and strings with two perpendicular strings stretched in the frame, running back and forth in the frame. The system also includes: for each string, a piezoelectric sheath coating said string along most of its length, said sheath being divided along its length into at least three piezoelectric areas capable of each generating an independent voltage according to mechanical stress exerted on the strings; and an electronic circuit connected to the piezoelectric areas of the strings to identify a portion of the strings submitted to the highest mechanical stress according to the voltages generated by the piezoelectric areas of the strings.

Abstract: A device comprising a deformable shell (16) defining an inner space (14), including at least one piezoelectric system (26, 28, 30), said system including: a flexible piezoelectric membrane (26) capable of generating electric energy under the effect of a deformation to which it is submitted; a rechargeable electric power source (28), formed on a flexible substrate; an electronic circuit (30) including: a processing circuit for generating and storing data according to the electric energy generated by the piezoelectric membrane, and connected to the electric power source for its electric power supply; and a wireless transmitter connected to the processing circuit to transmit the data stored therein and connected to the electric power source for its electric power supply. Each piezoelectric system (26, 28, 30) is totally arranged on and/or inside of the deformable shell (16).

Abstract: A method for manufacturing two series-connected photovoltaic cells includes: forming an insulating substrate; forming a stack including; a first conductive layer formed on the substrate; a semiconductor layer comprising a first absorption layer and a second semiconductor layer forming a junction with the first absorption layer; and a second transparent conductive layer, formed on the absorption layer; forming an area dividing the stack into two cells series-connected by an electric path. The forming of said path comprises: forming a first trench all the way to the substrate; forming a second trench all the way to the first conductive layer; and depositing a conductive solution on the first trench and at last a portion of the second trench, so that the solution does not penetrate into the first trench all the way to the first conductive layer and penetrates into the second trench all the way to the first conductive layer.

Abstract: Method for producing one or more connection elements for integrated circuit including the formation of sacrificial elements passing through a porous layer formed between two superimposed levels of transistors, then the removal of the sacrificial elements through the porous layer and their replacement by a conductor material before or after having produced a higher level transistor.

Abstract: A method for producing an assembly of particles bound by a substrate, including: making a compact film of solid particles floating on a carrier liquid, the solid particles potentially holding objects between them; spraying particles onto a face of the compact film opposite to the one immersed in a carrier liquid, to create a substrate-forming-skin adhering to the solid particles; and extracting an obtained assembly outside the carrier liquid.

Abstract: The invention relates to a method for producing a multilevel microelectronic structure, comprising at least: the formation of a first layer (236); the production of at least one second layer (239) at least partially covering the first layer (236); the production of at least one microelectronic pattern (220, 220a, 220b) on or in the second layer (239); characterised in that: the second layer (239) is formed so as to generate a mechanical stress in it; the first layer (236) forms for the second layer (239) a support preventing relaxation of said stress; and in that it comprises at least the following steps performed after the production of at least one microelectronic pattern (220, 220a, 220b), elimination of at least part of the first layer (236), thus making it possible to relax at least part of the mechanical stress on the second layer (239) so that at least a portion of the second layer (239) covering said eliminated part of the first layer (236) moves; fixing the moved portion of the second lay

Abstract: A device and method recovering heat energy and converting the heat energy into electrical energy by heat-sensitive molecules to which are connected magnetic particles, with the heat-sensitive molecules able to move the magnetic particles in relation to a conductive circuit to generate an induced current in the circuit.

Abstract: A cooling device of a component includes at least one channel in which a first cooling fluid flows designed to cool a hot area of the component. It further includes a thermoelectric module configured to measure a temperature difference between the hot area of the component and the channel, and a control circuit configured to modulate the flowrate of the first cooling fluid in the channel according to the temperature difference.

Abstract: A method for producing a conductive area in a polymer material comprises: providing a polymer layer comprising conductive particles with a density such that the polymer layer is insulating, heating the polymer material to a temperature higher than or equal to the glass transition temperature of the polymer material, compressing a portion of the polymer layer using a stamp, in order to obtain a density of conductive particles such that the portion becomes conductive, and removing the stamp from the polymer layer.

Abstract: A substrate of SOI type is covered by an etching mask defining three distinct semiconductor patterns. A lateral spacer is formed around the three patterns and performs the connection between two adjacent patterns. The buried insulating layer is eliminated so as to define a cavity which suspends a part of a first pattern. The first etching mask is eliminated. A gate dielectric is formed on two opposite main surfaces of the first pattern. The resist is deposited in the cavity and on the first pattern and is then exposed to form two patterns defining the bottom and top gates. An electrically conducting material is deposited in the cavity and on the first pattern so as to form the bottom gate and the top gate on each side of the first semiconductor material pattern.