Abstract: The thermoelectric device includes a first leg made from a first material, anchored at the level of its first end to a support, and a second leg made from a second material, anchored at the level of its first end to said support. In addition, an electric connecting element provided with first and second contact areas is respectively in electric contact with the first leg and second leg so as to form a thermocouple. The device includes means for varying the position of the first and contact areas at the level of the first and second legs.

Abstract: A racket (10) having a handle (14), a frame (12) attached to the handle (14), and strings (18, 20) with two perpendicular strings stretched in the frame (12), running back and forth in the frame (12). The system also includes: for each string (18, 20), a piezoelectric sheath (24) coating said string (18, 20) along most of its length, said sheath (24) being divided along its length into at least three piezoelectric areas (28, 30, 32) capable of each generating an independent voltage according to mechanical stress exerted on the strings; and an electronic circuit (44) connected to the piezoelectric areas (28, 30, 32) of the strings (18, 20) to identify a portion of the strings submitted to the highest mechanical stress according to the voltages generated by the piezoelectric areas of the strings.

Abstract: A substrate of SOI type is covered by an etching mask defining three distinct semiconductor patterns. A lateral spacer is formed around the three patterns and performs the connection between two adjacent patterns. The buried insulating layer is eliminated so as to define a cavity which suspends a part of a first pattern. The first etching mask is eliminated. A gate dielectric is formed on two opposite main surfaces of the first pattern. The resist is deposited in the cavity and on the first pattern and is then exposed to form two patterns defining the bottom and top gates. An electrically conducting material is deposited in the cavity and on the first pattern so as to form the bottom gate and the top gate on each side of the first semiconductor material pattern.

Abstract: A method for forming a film of particles on a carrier liquid present in a receptacle, for depositing this film onto a substrate, the method including: making a film blank between a barrier and a head including a tilted ramp, the blank being obtained by dispensing particles via the tilted ramp and carried out until the particles floating on the carrier liquid occupy a space between the barrier and an upstream front of particles located on the tilted ramp; and elongating the film by continuing dispensing the particles, and moving the head to move away from the barrier, the film elongation being performed to hold a front of particles on the ramp.

Abstract: A device forming a manometer, configured to measure pressure of a biphasic fluid in a fluidic network, including: a first channel inside which a biphasic fluid is able to flow; a second channel emerging into the first channel, wherein the second channel is blind, with each of its dimensions less than capillary length of the fluid's liquid phase, and with at least one of its lengthways wall having a surface energy gradient that decreases from its inlet to the end. The surface energy gradient enables the wetting angle of the meniscus of the fluid's liquid phase to be increased in the blind channel from its inlet to the end. Such a device may find application to measurement of pressure of a biphasic fluid in a heat exchanger or in a fuel cell.

Abstract: An interface device comprises a layer of a material thoroughly crossed by metal electrodes intended to electrically connect two electronic circuits. According to the present invention, the layer of material comprises a graphene layer and the electrodes each comprise a central electrically-conductive element formed across the thickness of the graphene layer and an electrically-insulating peripheral layer, interposed between the central element and the graphene layer.

Abstract: The thermoelectric module includes a first electric path including a first set of thermocouples electrically connected in series. It further includes a second electric path including a second set of thermocouples electrically connected in series, the number of thermocouples of the second set being smaller than the number of thermocouples of the first set.

Abstract: An assembly converting thermal energy into electrical energy including: at least one temperature sensitive bimetallic strip arranged in a space delimited by a hot source and a cold source facing each other, the bimetallic strip extending along a longitudinal axis; at least one suspended element fixed in movement to the sensitive element and extending laterally from the sensitive element and including a free end; and at least one piezoelectric element suspended from a part fixed relative to the sensitive element and vibrated by the suspended element such that it is vibrated when the bimetallic strip changes configuration and the suspended element comes into contact with the piezoelectric element, the piezoelectric element being located outside the space defined between the bimetallic strip and the hot source and outside the space between the bimetallic strip and the cold source.

Abstract: The invention relates to a device for converting heat energy into mechanical energy comprising a first (4) and a second (6) bistable area passing from a first stable state to a second stable state by means of a thermal effect or mechanical action, said areas (4, 6) being mechanically coupled such that the passage from one state to the other of one area (4, 6) by means of a thermal effect causes the other area (6,4) to pass from one state to the other, each area (4, 6) having a blistering temperature and an unblistering temperature, the blistering temperature being higher than the unblistering temperature. Said device is intended to be placed in contact with an environment (SC) having at least one given temperature, such that the temperature of the environment (SC) is lower than the blistering temperature of the first area (4) and is higher than the blistering temperature (Tc6) of the second area (6).

Abstract: An integrated circuit chip cooling device includes a network of micropipes. A first pipe portion and a second pipe portion of the network are connected by at least one valve. The valve is formed of a bilayer strip. In response to change in temperature, the shape of the bilayer strip changes to move the valve from a substantially closed position to an open position. In one configuration, the change is irreversible. In another configuration, the change is reversible in response to an opposite change in temperature.

Abstract: A thermoelectric device includes first and second legs extending continuously between first and second heat sources. The first and second legs respectively include first and second conducting elements and third and fourth conducting elements. The first and third conducting elements are adjacent and separated by an insulator. The second and fourth conducting elements are adjacent and separated by an insulator. The device also includes selection means enabling formation of a first thermocouple from the first and second conducting elements and formation of a second thermocouple from the third and fourth conducting elements.

Abstract: A method for depositing particles on a substrate, or a running substrate, including: (a) producing at least one first compact film of particles floating on a carrier liquid provided in a transfer area having an outlet of particles arranged facing the substrate; (b) producing at least one pattern by depositing a substance on the first film in the transfer area, along a contour of the pattern, the substance maintaining the particles of the film together in contact with the substance; (c) removing at least one portion of the particles of the first film located interiorly relatively to the contour, or exteriorly relatively to the contour; and then (d) transferring patterns onto the substrate through the outlet of particles.

Abstract: The invention relates to a method for displacing an object in a solid system involving the following steps: placing the object in a matrix which is solid at a first temperature and capable of softening due to the effect of a temperature increase; if necessary, increasing the temperature until the matrix softens; applying an external action to the object so as to move it inside the matrix; lowering the temperature until the matrix solidifies.

Abstract: System for converting thermal energy into electrical energy (S1) intended to be arranged between a hot source (SC) and a cold source (SF), comprising means for converting thermal energy into mechanical energy (6) and a piezoelectric material, with the means for converting thermal energy into mechanical energy (6) comprising groups (G1, G2) of at least three bimetallic strips (9, 11, 13) linked mechanically together by their longitudinal ends and suspended above a substrate (12), each bimetallic strip (9, 11, 13) comprising two stable states wherein it has in each of the states a curvature, with two directly adjacent bimetallic strips (9, 11, 13) having for a given temperature opposite curvatures, with the switching from one stable state of the bimetallic strips (9, 11, 13) to the other causing the deformation of a piezoelectric material.

Abstract: A hybrid substrate comprises first and second active areas made from semiconductor materials laterally offset from one another and separated by an isolation area. The main surfaces of the isolation area and of the first active area form a plane. The hybrid substrate is obtained from a source substrate successively comprising layers made from a first and second semiconductor materials separated by an isolation layer. A single etching mask is used to pattern the isolation area, first active area and second active area. The main surface of the first active area is released thereby forming voids in the source substrate. The etching mask is eliminated above the first active area. A first isolation material is deposited, planarized and etched until the main surface of the first active area is released.

Abstract: A method for depositing particles onto a substrate, or a running substrate, including: (a) making a compact film of particles floating on a carrier liquid provided in a transfer area having an outlet of particles laid out facing the substrate; (b) depositing a substance on the compact film of particles, in the transfer area; (c) transferring, through the outlet of particles and onto the substrate, the compact film of particles coated with the substance; and then (d) removing the substance to carry away with the substance the particles of the film which adhere to the substance, to generate at least one recessed area within the film deposited on the substrate.

Abstract: A method of transferring objects onto a substrate, or a moving substrate, the objects to be transferred being placed in a transfer area including an inlet and an outlet spaced apart from one another by two lateral edges opposite one another, and holding a carrier liquid forming a conveyor, the objects being held by a compact film of particles floating on the carrier liquid of the transfer area, in which the objects are moved with the particle film to be transferred onto the substrate when they reach the outlet.

Abstract: The device includes a thermoelectric module provided with a thermocouple. Said thermocouple includes a first and second leg which are made of different thermoelectric materials, electrically connected by a connecting element configured to deform according to the temperature thereof so as to assume: a first deformation position in which the first and second legs are electrically connected in series solely by means of the connecting element; and a second deformation position in which the connecting element is in electrical contact with a shunt contact pad of the device, said shunt contact pad being made of a material, the electrical conductivity of which is greater than the electric conductivity of the connecting element and of the first and second legs. The device also includes a load, the electrical resistance of which is lower than the electrical resistance of the thermoelectric module, said load being electrically connected to the shunt contact pad.

Abstract: A cooling device of a component includes at least one channel in which a first cooling fluid flows designed to cool a hot area of the component. It further includes a thermoelectric module configured to measure a temperature difference between the hot area of the component and the channel, and a control circuit configured to modulate the flowrate of the first cooling fluid in the channel according to the temperature difference.

Abstract: A thermal management system configured to be installed between a heat source and a heat sink, including a first heat conductor and a second heat conductor, a thermal switch configured to allow or prevent thermal connection between the first and second heat conductors, the thermal switch including at least one thermally conductive material that can connect the first and second conductors by a change in its volume, and the thermal switch including a controller configured to transfer thermal energy to the phase-change material to change a connection state. The connection is made when the heat source goes above a critical temperature, since the connection enables a heat flux to be established between the heat source and the heat sink.