Abstract: A measurement apparatus used to measure an object is disclosed. The measurement apparatus includes at least one sensing unit, a first optical module, a second optical module, a data processing unit and at least one prompting unit. The at least one sensing unit is disposed near the object to perform a contact or proximity sensing on the object. The first optical module is disposed near the object and adjacent to the at least one sensing unit. The first optical module includes at least one lens unit. The second optical module and the object are disposed at opposite sides of the first optical module. The second optical module includes a light source and at least one optical component. The data processing unit is coupled to at least one sensing unit. The at least one prompting unit is coupled to the data processing unit.

Abstract: A light source module of an optical apparatus is disclosed. The light source module includes a laser pump unit, a lens unit, and a fiber unit. The laser pump unit generates a laser source. The lens unit converts the laser source into a condensed beam. The fiber unit receives the condensed beam and emits an optical signal. The light source module can achieve effects of low cost, large bandwidth, high resolution, and high stability with well-designed pump power of the laser pump unit, and length, doping material, and core size of the fiber unit.

Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a fin structure over a semiconductor substrate. The semiconductor device structure also includes a gate stack covering a portion of the fin structure, and the gate stack includes a work function layer and a metal filling over the work function layer. The semiconductor device structure further includes an isolation element over the semiconductor substrate and adjacent to the gate stack. The isolation element is in direct contact with the work function layer and the metal filling.

Abstract: A temperature sensing apparatus configured to measure a temperature distribution of a surface to be measured is provided. The temperature sensing apparatus includes a lens set, a filtering module, a plurality of sensor arrays, and a processing unit. The lens set is configured to receive radiation from the surface to be measured. The filtering module is configured to filter the radiation from the lens set into a plurality of radiation portions respectively having different wavelengths. The sensor arrays are configured to respectively sense the radiation portions. The processing unit is configured to calculate an intensity ratio distribution of the radiation between the different wavelengths according to the radiation portions respectively sensed by the sensor arrays and determine the temperature distribution according to the intensity ratio distribution. A laser processing system and a temperature measuring method are also provided.

Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a fin structure over a semiconductor substrate and a gate stack covering a portion of the fin structure. The gate stack includes a work function layer and a gate dielectric layer. The semiconductor device structure also includes an isolation element over the semiconductor substrate and adjacent to the gate stack. The isolation element is in direct contact with the work function layer and the gate dielectric layer, and a lower width of the isolation element is greater than an upper width of the isolation element.

Abstract: A method for a wireless device is disclosed. The wireless device includes a plurality of antennas. The method includes the steps of transmitting a first packet to a first client and receiving a response from the first client. The wireless device then determines a first set of the plurality of antennas for the first client according to a statistic obtained from the response. Then, the wireless device transmits a packet to a first client using the first set of the plurality of antennas.

Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a fin structure over a semiconductor substrate. The semiconductor device structure also includes a gate stack covering a portion of the fin structure, and the gate stack includes a work function layer and a metal filling over the work function layer. The semiconductor device structure further includes an isolation element over the semiconductor substrate and adjacent to the gate stack. The isolation element is in direct contact with the work function layer and the metal filling.

Abstract: A method for forming a semiconductor device structure is provided. The method includes performing a first process over a surface of a semiconductor substrate. The method includes forming a protective layer over the surface of the semiconductor substrate in a first chamber after the first process. The method includes performing a first transferring process to transfer the semiconductor substrate from the first chamber into a substrate carrier. The method includes performing a second transferring process to transfer the semiconductor substrate from the substrate carrier into a second chamber. The semiconductor substrate is located in the substrate carrier during a substantially entire first time interval between the first transferring process and the second transferring process. The method includes removing the substantially entire protective layer in the second chamber. The method includes performing a second process over the surface of the semiconductor substrate.

Abstract: A method for processing a semiconductor wafer is provided. The method includes performing a discharging process over the semiconductor wafer in a discharging chamber which is enclosed. The method further includes processing the semiconductor wafer by use of a first processing module after the discharging process. During the discharging process, charged particles applied on the semiconductor wafer are tuned based on the characteristics of the surface of the semiconductor wafer.

Abstract: An optical apparatus applied to ophthalmology detection is disclosed. The optical apparatus includes an image capturing unit, a data comparing unit, a detection unit, a location determining unit, and a data output unit. The image capturing unit captures images of different portions of a face of a person to be tested to obtain a plurality of face images. The data comparing unit compares the plurality of face images with a built-in database. The detection unit detects on an eye of the person to be tested. The location determining unit automatically determines whether the eye detected by the detection unit is left-eye or right-eye. The data output unit selectively outputs a detection result of the detection unit, a comparing result of the data comparing unit, and/or a determining result of the location determining unit.

Abstract: The present invention provides an intraocular pressure detecting device, which includes: a sampling device, a comparison device and a detecting device. The sampling device includes an opening window, an imaging unit and a puffing unit. The opening window has a through hole. The imaging unit forms an imaging optical path directly with the eyeball, via a through hole of the opening window. In addition, the puffing device forms a puffing path together with the through hole of the opening window towards the eyeball. Moreover, the comparison device includes a reflecting mirror and a driving device, and the driving device drives the reflecting mirror to generate a displacement. The detecting device is in connection with the sampling device and the comparison device. The detecting device forms a detecting optical path with the eyeball by means of a through hole of the opening window. Also, the detecting device forms a comparison optical path with the reflection mirror of the comparison device.

Abstract: The optical apparatus includes an optical measurement module, a central processing module, and an air-puff module. The air-puff module is used for generating an air pressure to a surface of the cornea according a blow pattern to cause a deformation of the cornea. The optical measurement module includes a first unit and a second unit. The first unit is used for measuring an intraocular pressure (IOP) of the eye according to the deformation of the cornea. The second unit is used for measuring properties of the cornea in an optical interference way. The central processing module is coupled to the first unit and the second unit and used for receiving and processing the intraocular pressure and the properties of the cornea to provide a result.

Abstract: An optical device for corneal measuring includes a light source module, a first optical module, a second optical module including a reference mirror, a light splitter and an image analysis unit. The light of the light source module is transmitted to the first and second optical modules through the light splitter. The light is transmitted to a cornea through the light splitter and the first optical module and reflected by the cornea to form a first light, the light is transmitted to the reference mirror through the light splitter and reflected by the reference mirror to form a second light. The first and second lights are transmitted to the light splitter and the image analysis unit. The reference mirror moves along a first direction, and when the first light and the second light interfere with each other, a relative optical path length is obtained.

Abstract: An optical device for corneal measuring includes a light source module, a first optical module, a second optical module including a reference mirror, a light splitter and an image analysis unit. The light of the light source module is transmitted to the first and second optical modules through the light splitter. The light is transmitted to a cornea through the light splitter and the first optical module and reflected by the cornea to form a first light, the light is transmitted to the reference mirror through the light splitter and reflected by the reference mirror to form a second light. The first and second lights are transmitted to the light splitter and the image analysis unit. The reference mirror moves along a first direction, and when the first light and the second light interfere with each other, a relative optical path length is obtained.

Abstract: A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.

Abstract: A temperature sensing apparatus configured to measure a temperature distribution of a surface to be measured is provided. The temperature sensing apparatus includes a lens set, a filtering module, a plurality of sensor arrays, and a processing unit. The lens set is configured to receive radiation from the surface to be measured. The filtering module is configured to filter the radiation from the lens set into a plurality of radiation portions respectively having different wavelengths. The sensor arrays are configured to respectively sense the radiation portions. The processing unit is configured to calculate an intensity ratio distribution of the radiation between the different wavelengths according to the radiation portions respectively sensed by the sensor arrays and determine the temperature distribution according to the intensity ratio distribution. A laser processing system and a temperature measuring method are also provided.

Abstract: A microphone system includes an acoustic control unit and a microphone unit. The acoustic control unit transmits a clock signal and receives an acoustic audio signal and determines whether or not the acoustic audio signal is a valid audio data. The microphone unit receives the clock signal from the acoustic control unit and transmits the acoustic audio signal captured by the microphone unit to the acoustic control unit. Before the acoustic audio signal is determined as the valid audio data, the acoustic control unit transmits the clock signal which is turned on and off repeatedly with an ON duration and an OFF duration.

Abstract: An optical blood glucose detecting apparatus and an operating method thereof are disclosed. The optical blood glucose detecting apparatus includes a detecting module, an assisting and strengthening module, and a data processing module. The detecting module provides an incident optical signal passing through a detected portion of skin surface into a skin interstitial fluid, captures a blood glucose optical reflection message of the skin interstitial fluid, and it interferes the blood glucose optical reflection message and the incident optical signal to generate a detected data. The assisting and strengthening module provides a physical or chemical effect on a tissue region under the detected portion to strengthen the blood glucose optical reflection message. The data processing module processes the detected data to determine a blood glucose concentration.

Abstract: Systems and methods are provided for edge bead removal. A laser beam of approximately a wavelength is received. The laser beam is delivered along a predetermined beam path. The laser beam is projected on an edge portion of a wafer for edge bead removal.

Abstract: A layout configuration for a memory cell array includes at least a comb-like doped region having a first conductivity type and a fishbone-shaped doped region having a second conductivity type. The second conductivity type and the first conductivity type are complementary. Furthermore, the comb-like doped region and the fishbone-shaped doped region are interdigitated.