Abstract: In an implementation, a semiconductor chip device includes a first semiconductor chip that includes a first portion and a second portion. The first portion can be a higher heat producing portion and the second portion can be a lower heat producing portion. A second semiconductor chip is stacked on the first semiconductor chip over the second portion. A dummy component is stacked on the first semiconductor chip over the first portion. The dummy component includes a plurality of thermal pipes providing a thermal path from a first surface of the dummy component to an opposite second surface of the dummy component.

Abstract: A delivery system generates a pick sheet containing a plurality of SKUs based upon an order. A loaded pallet is imaged to identify the SKUs on the loaded pallet, which are compared to the order prior to the loaded pallet leaving the distribution center. The loaded pallet may be imaged while being wrapped with stretch wrap. At the point of delivery, the loaded pallet may be imaged again and analyzed to compare with the pick sheet.

Abstract: A request for a customized reply is received from a requester. One or more templates stored in a selected location are retrieved based, at least in part, on at least one ontology constructed for one or more domains associated with the request for the customized reply. Information relating to the requester is input into the one or more templates to provide one or more populated templates. The customized reply to the request is generated based on the one or more populated templates and provided to the requester.

Abstract: A optical element includes a first dimming panel having a first active layer disposed between first upper and lower transparent electrodes, and a second dimming panel overlying the first dimming panel and having a second active layer disposed between second upper and lower transparent electrodes, where the first active layer is configured to scatter, absorb, or reflect light incident on the first dimming panel, and the second active layer is configured to absorb or reflect light incident on the second dimming panel.

Abstract: An example operation may include one or more of executing queries on one or more external data stores to retrieve domain data of one or more ranked lists of assets and variables corresponding to the domain data, generating a plurality of feature groups based on the retrieved domain data and variables, wherein the plurality of feature groups correspond to a plurality of features used to generate the one or more ranked lists, converting the plurality of features groups into a plurality of values via execution of an optimization engine, transforming the plurality of values into a plurality of sentences describing the plurality of feature groups, and displaying the plurality of sentences via a user interface.

Abstract: The disclosed computer-implemented apparatus for bridge-based packaging with direct power delivery can include an first layer stacked on a second layer. The second layer can include an interposer die and a connection die. The first layer can include a chiplet die positioned above the interposer die and a first-layer bridge die spanning across the interposer die and the connection die. The interposer die can include a set of physical interfaces and a set of routing features configured to route signals from the set of physical interfaces to the first-layer bridge die. Various other apparatuses, systems, and methods of manufacture are also disclosed.

Abstract: A semiconductor device includes a power delivery device die stack including a plurality of vertically arranged power delivery device dies. The plurality of power delivery device dies including at least a first power delivery device die and a second power delivery device die electrically connected to the first power delivery device die. The semiconductor device includes at least one external interconnect for providing a power input to the power delivery device die stack and at least one external interconnect for supplying a power output from the power delivery device die stack.

Abstract: A model management system provides a centralized repository for storing and accessing models. The model management system receives an input to store a model object in a first model state generated based on a first set of known variables. The model management system generates a first file including a first set of functions defining the first model state and associates the first file with a model key identifying the model object. The model management system receives an input to store the model object in a second model state having been generated based on the first model state and a second set of known variables. The model management system generates a second file including a second set of functions defining the second model state and associates the second file with the model key. The model management system identifies available versions of the model object based on the model key.

Abstract: A polymer-stabilized liquid crystal (PSLC) composition includes a liquid crystal component having high dielectric constant, a chiral dopant, a stabilizing polymer, and a photo-initiator. Through the application of an applied voltage, the polymer-stabilized liquid crystal composition may be implemented to induce pixelated dimming in an AR display.

Abstract: A delivery system generates a pick sheet containing a plurality of SKUs based upon an order. A loaded pallet is imaged to identify the SKUs on the loaded pallet, which are compared to the order prior to the loaded pallet leaving the distribution center. The loaded pallet may be imaged while being wrapped with stretch wrap. At the point of delivery, the loaded pallet may be imaged again and analyzed to compare with the pick sheet.

Abstract: Systems and methods for optimizing interactions with a media-streaming application platform are disclosed. One method includes identifying a user of a media-streaming application platform running on an information handling device. Based on this identification, a user profile associated with one or more social media platforms linked to the media-streaming application platform may be accessed. Media-related activity data from at least one other individual on the social media platform(s) may be obtained. Thereafter, a determination may be made whether one or more articles of media content available to the media-streaming application platform are associated with the media-related activity of the other individuals. Responsive to identifying that a positive association exists, one or more recommendation rails may be presented on the media-streaming application platform. Other aspects are described and claimed.

Abstract: Creating movement in a physical environment includes extracting, by computer hardware, digital features from interactions of a user with a digital environment that models a physical environment. Physical features are extracted by the computer hardware from sensor data generated from detected interactions of the user with the physical environment. A recommendation is generated by the computer hardware for the user within the physical environment based on a correlation of the digital features with the physical features. The recommendation is provided to the user. Providing the recommendation may include generating haptic signals by decoding, using a decoder stage executed by the computer hardware, the physical features and the recommendation, wherein the haptic signals specify a movement of the user within the physical environment in furtherance of the recommendation.

Abstract: A computer-implemented method to generate training data with increased fairness. The method includes identifying a set of training data comprising at least one independent variable and dependent variable. The method includes analyzing the set of training data to identify correlations between the independent and the dependent variables. The method further includes identifying at least one correlation between the one or more independent variable and the dependent variable. The method includes calculating a fairness score for each first independent variable against the dependent variable. The method further includes creating, based on the analyzing, a fairness profile for the set of training data. The method also includes generating, by a generative adversarial network (GAN) and based on the set of training data and the fairness profile, a set of synthetic training, where the GAN is configured to increases the fairness score for each variable with a disparate effect score above a threshold.

Abstract: An example embodiment provides a method that includes one or more of executing a sequence of job steps for a job by a sequence of job step executors within a data processing pipeline, recording current job execution data generated by the sequence of job step executors during the executing of the sequence of job steps, determining whether the executing of the sequence of job steps includes a deviation based on comparing the current job execution data to historical job execution data of the data processing pipeline stored in a data store, wherein the deviation is determined by comparing a current step execution dataset to a recorded step execution dataset in the data store, and generating a failure alert when the deviation is included.

Abstract: A semiconductor package includes a first mold layer at least partially encasing at least one photonic integrated circuit. A redistribution layer structure is fabricated on the first mold layer, the redistribution layer structure including dielectric material and conductive structures. A second mold layer at least partially encasing at least one semiconductor chip is fabricated on the redistribution layer structure. The redistribution layer structure provides electrical pathways between the at least one semiconductor chip and the at least one photonic integrated circuit. One or more voids are defined in the second mold layer in an area above an optical interface of the at least one photonic integrated circuit such that light is transmittable through dielectric material above the optical interface.

Abstract: Traditionally, version numbers for application programming interfaces are determined manually and do not convey semantic meaning. Accordingly, disclosed embodiments automatically generate a version number for an application programming interface based on the changes, if any, from a past deployment to a current deployment of the application programming interface. The version number may comprise a major version number that is incremented when a change is to the interface and affects the operation of clients that utilize the application programming interface. The version number may also comprise a minor version number that is incremented when a change is to the interface, but does not affect the operation of clients. The version number may also comprise a patch version number that is incremented when a change is only to the implementation of the application programming interface.

Abstract: A semiconductor module includes two or more semiconductor dies and an interconnect structure coupled to the two or more semiconductor dies. The interconnect structure implements a plurality of die-to-die connection pathways having a first density and a plurality of fan-out redistribution pathways having a second density that is different from the first density.

Abstract: Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a package substrate that has a first side and a second side opposite to the first side. A semiconductor chip is mounted on the first side. Plural metal anchor structures are coupled to the package substrate and project away from the first side. A molding layer is on the package substrate and at least partially encapsulates the semiconductor chip and the anchor structures. The anchor structures terminate in the molding layer and anchor the molding layer to the package substrate.

Abstract: Methods for enabling micro-bump architectures without the use of sacrificial pads for probing a wafer are described. A method includes forming: (1) a first bump in accordance with a specified first diameter, and (2) a first set of bumps in accordance with a specified second diameter, smaller than the specified first diameter. The first bump is used for probing a portion of the wafer associated with the first set of bumps. Both the first bump and the first set of bumps are then removed. The method includes forming: (1) a second set of bumps, in place of the first bump, where each of the second set of bumps is formed in accordance with the specified second diameter, and (2) a third set of bumps, in place of the first set of bumps, where each of the third set of bumps is formed in accordance with the specified second diameter.

Abstract: A semiconductor package includes a package substrate having a first surface and an opposing second surface, and further includes an integrated circuit (IC) die disposed at the second surface and having a third surface facing the second surface and an opposing fourth surface. The IC die has a first region comprising one or more metal layers and circuit components for one or more functions of the IC die and a second region offset from the first region in a direction parallel with the third and fourth surfaces. The semiconductor package further includes a voltage regulator disposed at the fourth surface in the second region and having an input configured to receive a supply voltage and an output configured to provide a regulated voltage, and also includes a conductive path coupling the output of the voltage regulator to a voltage input of circuitry of the IC die.