Patents by Inventor Rahul N. Manepalli

Rahul N. Manepalli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Underfilling process in a molded matrix array package using flow front modifying solder resist
    Publication number: 20040157369
    Abstract: Placing a flow modifier on a package substrate to create two flow fronts on a molded matrix array package. A flow modifier may be laid on a package substrate to a height that blocks off the bottom of other substrates (e.g., dice) coupled to the package substrate. By separating the top flow front and the bottom flow front, this process prevents the top flow front from wrapping around the sides of the substrates and trapping air below each substrate and in front of the bottom flow front.
    Type: Application
    Filed: February 5, 2004
    Publication date: August 12, 2004
    Inventors: Rahul N. Manepalli, Saravanan Krishnan, Choong Kooi Chee
  • Underfilling process in a molded matrix array package using flow front modifying solder resist
    Publication number: 20040084209
    Abstract: Placing a flow modifier on a package substrate to create two flow fronts on a molded matrix array package. A flow modifier may be laid on a package substrate to a height that blocks off the bottom of other substrates (e.g., dice) coupled to the package substrate. By separating the top flow front and the bottom flow front, this process prevents the top flow front from wrapping around the sides of the substrates and trapping air below each substrate and in front of the bottom flow front.
    Type: Application
    Filed: November 4, 2002
    Publication date: May 6, 2004
    Inventors: Rahul N. Manepalli, Saravanan Krishnan, Choong Kooi Chee