Patents by Inventor Randy Hoffman

Randy Hoffman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11433670
    Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and be coupled to a ground of the fluidic die. A material and size of the conductive element may be selected to engender galvanic effect at an approximately zero potential.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: September 6, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, Chien-Hua Chen, Randy Hoffman
  • Patent number: 11279130
    Abstract: Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of a back surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: March 22, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, David J Benson, Randy Hoffman, Amy Gault
  • Publication number: 20210252858
    Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and be coupled to a ground of the fluidic die. A material and size of the conductive element may be selected to engender galvanic effect at an approximately zero potential.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 19, 2021
    Inventors: Michael W Cumbie, Chien-Hua Chen, Randy Hoffman
  • Publication number: 20210229440
    Abstract: Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of aback surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.
    Type: Application
    Filed: April 29, 2019
    Publication date: July 29, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W CUMBIE, David J BENSON, Randy HOFFMAN, Amy GAULT
  • Patent number: 10328694
    Abstract: A printed circuit board includes a recessed pocket. A fluid droplet ejection die is within recessed pocket.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: June 25, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien Hua Chen, Diane R Hammerstad, Randy Hoffman
  • Publication number: 20180170050
    Abstract: A printed circuit board includes a recessed pocket. A fluid droplet ejection die is within recessed pocket.
    Type: Application
    Filed: July 31, 2015
    Publication date: June 21, 2018
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien Hua Chen, Diane R Hammerstad, Randy Hoffman
  • Patent number: 9965746
    Abstract: Systems and methods are shown which provide processor-based self-service systems for use with respect to controlled environment facilities. Embodiments provide processor-based self-service systems having robust input/output capabilities in order to support a wide range of functionality. Processor-based self-service systems of embodiments are adapted to be deployed within a controlled environment facility, such as within a lobby area, a holding area, and/or a restricted area of a controlled environment facility. According to embodiments, processor-based self-service systems are used with respect to a plurality of functions and a plurality of users, thereby processing a variety of information associated with a controlled environment facility. Embodiments operate to aggregate, compile, correlate, and link information to provide data heretofore unavailable from separate or manual systems used with respect to controlled environment facilities.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: May 8, 2018
    Assignee: Securus Technologies, Inc.
    Inventors: Luke Keiser, Bruce Cooper, John J. Viola, Randy Hoffman
  • Patent number: 9636902
    Abstract: An example provides an apparatus including a substrate, a metal layer, and an adhesive layer adhered between the substrate and the metal layer, the adhesive layer comprising indium oxide, tin oxide, gallium oxide, indium-tin oxide, indium-gallium oxide, tin-gallium oxide, or indium-tin-gallium oxide.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: May 2, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: James Elmer Abbott, Jr., Peter Mardilovich, Randy Hoffman
  • Patent number: 9352532
    Abstract: An example provides an apparatus including a substrate, a metal layer, and an adhesive layer adhered between the substrate and the metal layer, the adhesive layer comprising zinc-gallium oxide, zinc-indium oxide, zinc-gallium-tin oxide, or zinc-indium-tin oxide.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: May 31, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Elmer Abbott, Jr., Peter Mardilovich, Randy Hoffman
  • Publication number: 20150332637
    Abstract: A method of driving a display, the method comprising applying a switching voltage to the display, the switching voltage causing an amount of electrically charged pigment particles to be compacted into a number of wells defined in a dielectric layer in the display, applying a transition waveform to the display, and applying a holding voltage to the display.
    Type: Application
    Filed: December 14, 2012
    Publication date: November 19, 2015
    Inventors: GREGG COMBS, DEVIN ALEXANDER MOUREY, RANDY HOFFMAN
  • Patent number: 8969865
    Abstract: A semiconductor film composition includes an oxide semiconductor material. At least one polyatomic ion is incorporated into the oxide semiconductor material.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: March 3, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Gregory Herman, David Punsalan, Randy Hoffman, Jeremy Anderson, Douglas Keszler, David Blessing
  • Publication number: 20140322523
    Abstract: An example provides an apparatus including a substrate, a metal layer, and an adhesive layer adhered between the substrate and the metal layer, the adhesive layer comprising indium oxide, tin oxide, gallium oxide, indium-tin oxide, indium-gallium oxide, tin-gallium oxide, or indium-tin-gallium oxide.
    Type: Application
    Filed: April 30, 2013
    Publication date: October 30, 2014
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP
    Inventors: James Elmer Abbott, JR., Peter Mardilovich, Randy Hoffman
  • Patent number: 8828570
    Abstract: A battery temperature sensor may include a substrate and a thin film resistive temperature device (RTD). The substrate can be layered on a battery cell element. The battery cell element can be an anode, a cathode, and a separator between the anode and cathode used in a battery cell. The thin film resistive temperature device (RTD) on the flexible substrate can change resistance with a change in temperature. A battery cell housing can enclose the thin film RTD.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: September 9, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Neel Banerjee, Andrew L. Van Brocklin, Randy Hoffman
  • Patent number: 8823100
    Abstract: In one method of forming a semiconductor device, a first electrode is formed electrically coupled with a semiconductor material. After the first electrode is formed, an insulator is formed over the semiconductor material adjoining the first electrode and extending a selected distance from the first electrode. After the insulator is formed, a second electrode is formed electrically coupled with the semiconductor material adjoining the insulator.
    Type: Grant
    Filed: September 14, 2007
    Date of Patent: September 2, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Gregory Herman, Peter Mardllovich, Randy Hoffman
  • Patent number: 8822988
    Abstract: In at least some embodiments, a thin-film transistor (TFT) includes a gate electrode and a gate dielectric covering the gate dielectric. The TFT also includes a source electrode and a drain electrode adjacent the gate dielectric. The TFT also includes a bi-layer channel between the source electrode and the drain electrode, the bi-layer channel having a zinc indium oxide (ZIO) layer positioned adjacent the gate dielectric and a zinc tin oxide (ZTO) layer that covers the ZIO layer.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: September 2, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Vincent C. Korthuis, Randy Hoffman
  • Patent number: 8669553
    Abstract: A thin-film transistor includes a gate electrode, a gate dielectric disposed on the gate electrode, a channel layer, and a passivation layer. The channel layer has a first surface and an opposed second surface, where the first surface is disposed over at least a portion of the gate dielectric. The channel layer also has a first oxide composition including at least one predetermined cation. The passivation layer is disposed adjacent to at least a portion of the opposed second surface of the channel layer. The passivation layer has a second oxide composition including the at least one predetermined cation of the first oxide composition and at least one additional cation that increases a bandgap of the passivation layer relative to the channel layer.
    Type: Grant
    Filed: July 2, 2010
    Date of Patent: March 11, 2014
    Assignees: Hewlett-Packard Development Company, L.P., Oregon State University
    Inventors: Chris Knutson, Rick Presley, John F. Wager, Douglas Keszler, Randy Hoffman
  • Patent number: 8587093
    Abstract: Embodiments of methods, apparatuses, devices, and/or systems for forming a solution processed device are described.
    Type: Grant
    Filed: September 14, 2007
    Date of Patent: November 19, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Peter Mardilovich, Randy Hoffman, Gregory Herman
  • Publication number: 20130092931
    Abstract: A thin-film transistor includes a gate electrode, a gate dielectric disposed on the gate electrode, a channel layer, and a passivation layer. The channel layer has a first surface and an opposed second surface, where the first surface is disposed over at least a portion of the gate dielectric. The channel layer also has a first oxide composition including at least one predetermined cation. The passivation layer is disposed adjacent to at least a portion of the opposed second surface of the channel layer. The passivation layer has a second oxide composition including the at least one predetermined cation of the first oxide composition and at least one additional cation that increases a bandgap of the passivation layer relative to the channel layer.
    Type: Application
    Filed: July 2, 2010
    Publication date: April 18, 2013
    Applicants: OREGON STATE UNIVERSITY, HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chris Knutson, Rick Presley, John F. Wager, Douglas Keszler, Randy Hoffman
  • Patent number: 8355492
    Abstract: Systems and methods in which call intelligence, such as may be deployed in communication with signaling systems utilized in controlling calls and telecommunication databases, is used to analyze information about a call in order to make a determination as to the likelihood or risk that call redirecting, such as call forwarding or remote call forwarding, will be invoked with respect to a call are shown. The call intelligence, upon a determination that an unacceptable risk that call redirecting will be invoked, preferably institutes appropriate call treatment or handling procedures, such as to block the call or to allow the call while invoking additional call treatment action.
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: January 15, 2013
    Assignee: Securus Technologies, Inc.
    Inventors: Michelle L. Polozola, Stuart Rosenfield, Randy Hoffman
  • Publication number: 20130004811
    Abstract: A battery temperature sensor may include a substrate and a thin film resistive temperature device (RTD). The substrate can be layered on a battery cell element. The battery cell element can be an anode, a cathode, and a separator between the anode and cathode used in a battery cell. The thin film resistive temperature device (RTD) on the flexible substrate can change resistance with a change in temperature. A battery cell housing can enclose the thin film RTD.
    Type: Application
    Filed: June 29, 2011
    Publication date: January 3, 2013
    Inventors: Neel Banerjee, Andrew L. Van Brocklin, Randy Hoffman