Patents by Inventor Recai Sezi

Recai Sezi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040138406
    Abstract: The invention relates to novel polyhydroxyamide compounds that, in the form of their oxazoles, ane suited as a coating material, particularly for electronic components. The invention also relates to a method for producing these novel compounds and to the use thereof.
    Type: Application
    Filed: February 10, 2004
    Publication date: July 15, 2004
    Inventors: Marcus Halik, Klaus Lowack, Recai Sezi, Andreas Walter
  • Publication number: 20040126957
    Abstract: The present invention relates to a process for integrating air as dielectric in semiconductor devices, comprising the steps of:
    Type: Application
    Filed: July 31, 2003
    Publication date: July 1, 2004
    Inventor: Recai Sezi
  • Publication number: 20040082756
    Abstract: A dielectric for aluminum and copper metalizations is stable at high temperatures. Surprisingly, in spite of the elimination of water during the cyclization, the polymeric dielectrics are very suitable for filling narrow trenches. The filled trenches exhibit no defects and bubbles or cracks. The polybenzoxazoles have dielectric constants of k≦2.7 and are suitable as an electrical insulator. Furthermore, these materials adhere very well on all surfaces relevant for microelectronics.
    Type: Application
    Filed: June 27, 2003
    Publication date: April 29, 2004
    Inventors: Recai Sezi, Andreas Walter, Anna Maltenberger, Klaus Lowack, Marcus Halik
  • Publication number: 20040063895
    Abstract: Novel poly-o-hydroxyamides can be cyclized to give polybenzoxazoles which have a good diffusion barrier effect with respect to metals. The poly-o-hydroxyamides can be applied to a semiconductor substrate by customary techniques and converted into the polybenzoxazole in a simple manner by heating. This results in a good barrier layer with respect to diffusion of metals. This allows the diffusion barrier between conductor track and dielectric to be substantially dispensed.
    Type: Application
    Filed: June 27, 2003
    Publication date: April 1, 2004
    Inventors: Recai Sezi, Andreas Walter, Anna Maltenberger, Klaus Lowack
  • Publication number: 20040060635
    Abstract: In a method of bonding components, a poly-o-hydroxyamide is applied to each of the bond areas of the components to be bonded. After the bond areas have been bonded to one another the adhesively bonded assembly is heated in order to convert the poly-o-hydroxyamide to the corresponding polybenzoxazole. The adhesive bonding technology is able to replace conventional joining techniques, such as welding, brazing or shrink fitting. The method is especially suitable for producing X-ray image intensifiers.
    Type: Application
    Filed: September 25, 2003
    Publication date: April 1, 2004
    Inventors: Heinrich Diepers, Recai Sezi
  • Publication number: 20040049081
    Abstract: A bis-o-aminophenol has a formula I 1
    Type: Application
    Filed: June 27, 2003
    Publication date: March 11, 2004
    Inventors: Andreas Walter, Ingo Gnuchtel, Anna Maltenberger, Recai Sezi, Horst Hartmann
  • Publication number: 20040028821
    Abstract: Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.
    Type: Application
    Filed: April 28, 2003
    Publication date: February 12, 2004
    Inventors: Recai Sezi, Andreas Walter, Klaus Lowack, Anna Maltenberger, Robert Banfic
  • Publication number: 20030207095
    Abstract: The invention relates to a component having two adjacent insulating layers and to a production process therefore. The component has an activated insulating layer, which can be converted into an electrically conductive layer by metallization.
    Type: Application
    Filed: March 27, 2001
    Publication date: November 6, 2003
    Inventors: Klaus Lowack, Gunter Schmid, Recai Sezi
  • Patent number: 6635410
    Abstract: A method for metallizing dielectrics includes applying a photosensitive dielectric to a substrate. The dielectric is then exposed to light through a mask, is seeded with a metal and is subjected to a temperature treatment. Afterwards, the dielectric is chemically metallized. Alternatively, the dielectric can be first be seeded with a metal after being applied to the substrate, and can then be exposed to light through a mask. Afterwards, excess seeding material is removed and the dielectric is chemically metallized.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: October 21, 2003
    Assignee: Infineon Technologies AG
    Inventors: Joerg Haussmann, Klaus Lowack, Wolfgang Radlik, Guenter Schmid, Recai Sezi
  • Publication number: 20030176623
    Abstract: Poly-o-hydroxyamides are cyclicized to obtain polybenzoxazoles. The poly-o-hydroxyamides provide effective filling of trenches. In particular, the poly-o-hydroxyamides can fill trenches having a width of less than 100 nm and an aspect ratio of more than 4. Further, the polybenzoxazoles of the invention are very suitable for the damascene process. A dielectric can be made from the polybenzoxazole. In turn, semiconductor devices can include the dieletric. Processes for making the poly-o-hydroxyamides, polybenzoxazoles, and semiconductor devices are included.
    Type: Application
    Filed: September 30, 2002
    Publication date: September 18, 2003
    Inventors: Klaus Lowack, Anna Maltenberger, Recai Sezi, Andreas Walter
  • Publication number: 20030150557
    Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).
    Type: Application
    Filed: July 30, 2002
    Publication date: August 14, 2003
    Inventors: Recai Sezi, Andreas Walter
  • Publication number: 20030149207
    Abstract: The present invention describes the use of polybenzoxazoles (PBOs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the polybenzoxazoles of the formula (I).
    Type: Application
    Filed: July 30, 2002
    Publication date: August 7, 2003
    Inventors: Andreas Walter, Recai Sezi
  • Patent number: 6599687
    Abstract: A process for producing structured or patterned protective and insulating layers includes applying a solution of a photosensitive polyhydroxyamide or polyhydroxyimide to a substrate and drying. The layer is patterned or structured by irradiation with UV light or X-rays through the use of a mask or by guidance of a UV or electron beam and by subsequent aqueous-alkali development. The patterned or structured layer is irradiated over the whole area with UV light and then tempered or heat-treated.
    Type: Grant
    Filed: September 18, 1998
    Date of Patent: July 29, 2003
    Assignee: Osram Opto Semiconductor GmbH Co. OHG
    Inventors: Ewald Günther, Recai Sezi, Michael Keitmann
  • Publication number: 20030134226
    Abstract: High-temperature-stable polybenzoxazoles are formed from novel poly-o-hydroxyamides. The novel poly-o-hydroxyamides have low dielectric constants, are suitable for exposure at 248 nm or shorter wavelengths, and have hydroxyl groups at least some of which have been protected by tert-butoxycarbonyl protective groups.
    Type: Application
    Filed: September 16, 2002
    Publication date: July 17, 2003
    Inventor: Recai Sezi
  • Publication number: 20030104311
    Abstract: Bis-o-aminophenols, which carry on at least one of their hydroxyl groups a tert-butoxy-carbonyl group, can be reacted with dicarboxylic acids to give the corresponding poly-o-hydroxyamides. Following cyclization to the polybenzoxazole, these polymers have a lower dielectric constant than compounds prepared from corresponding poly-o-hydroxyamides which do not carry any tert-butoxycarbonyl group.
    Type: Application
    Filed: September 16, 2002
    Publication date: June 5, 2003
    Inventor: Recai Sezi
  • Publication number: 20030100698
    Abstract: Materials for dielectrics and/or buffer layers in microelectronics utilize polymers can be based on bis-o-nitrophenols. The bis-o-nitrophenols carry a tert-butoxycarbonyl group on at least one of the hydroxyl groups. The polybenzoxazoles prepared from these compounds have a lower dielectric constant than corresponding polymers which are prepared from bis-o-nitrophenols that do not have a tert-butoxycarbonyl group.
    Type: Application
    Filed: September 16, 2002
    Publication date: May 29, 2003
    Inventor: Recai Sezi
  • Publication number: 20030099904
    Abstract: A photosensitive formulation for high-temperature-resistant photoresists is based on polyhydroxyamides. The photosensitive formulations display a much higher photosensitivity than the comparable formulations based on quinone azide photoactive components. After conversion to the polybenzoxazole, the novel formulations also display a lower dielectric constant than the quinone azide-based formulations. A film can be made by applying the photosensitive formulation to a wafer and then evaporating the solvent. A method for fabricating electronics and micorelectronics structures a wafer by using the film in photolithography.
    Type: Application
    Filed: September 16, 2002
    Publication date: May 29, 2003
    Inventor: Recai Sezi
  • Publication number: 20030087190
    Abstract: A photosensitive formulation for high-temperature-stable photoresists is based on polyhydroxyamides. The photosensitive formulations are suitable for exposures at 248 nm and below, and following conversion into the polybenzoxazole exhibit a much lower dielectric constant than the corresponding formulations whose base polymers do not contain these protective groups. All of the protective groups are eliminated on heat treatment (baking) while the dielectric constant of the formulations remains as low as that of the base polymers used, which is much lower than the prior art.
    Type: Application
    Filed: September 16, 2002
    Publication date: May 8, 2003
    Inventor: Recai Sezi
  • Publication number: 20030060573
    Abstract: The following invention relates to phenyl-linked polybenzoxazoles having terminal, aryl- or heteroaryl-attached cyanate groups which can be used for adhesive bonding and as dielectrics, especially for electronic components, and to a process for preparing them.
    Type: Application
    Filed: July 26, 2002
    Publication date: March 27, 2003
    Inventors: Andreas Walter, Recai Sezi
  • Patent number: 6531632
    Abstract: Bis-o-aminophenols and o-aminophenolcarboxylic acids have the following structures: A1 to A7 are, independently of each other, H, F, CH3, CF3, OCH3 or OCF3. T is an aromatic or heterocyclic residue. A method for preparing bis-o-aminophenols and o-aminophenolcarboxylic acids is also provided.
    Type: Grant
    Filed: March 12, 2001
    Date of Patent: March 11, 2003
    Assignee: Infineon Technologies AG
    Inventors: Jörg Haussmann, Gerhard Maier, Recai Sezi