Patents by Inventor Recai Sezi

Recai Sezi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

Coating material for electronic components

Publication number: 20040138406

Abstract: The invention relates to novel polyhydroxyamide compounds that, in the form of their oxazoles, ane suited as a coating material, particularly for electronic components. The invention also relates to a method for producing these novel compounds and to the use thereof.

Type: Application

Filed: February 10, 2004

Publication date: July 15, 2004

Inventors: Marcus Halik, Klaus Lowack, Recai Sezi, Andreas Walter
Microelectronic process and structure

Publication number: 20040126957

Abstract: The present invention relates to a process for integrating air as dielectric in semiconductor devices, comprising the steps of:

Type: Application

Filed: July 31, 2003

Publication date: July 1, 2004

Inventor: Recai Sezi
Poly-o-hydroxyamide, polybenzoxazole from the poly-o-hydroxyamide, electronic component including a polybenzoxazole, and processes for producing the same

Publication number: 20040082756

Abstract: A dielectric for aluminum and copper metalizations is stable at high temperatures. Surprisingly, in spite of the elimination of water during the cyclization, the polymeric dielectrics are very suitable for filling narrow trenches. The filled trenches exhibit no defects and bubbles or cracks. The polybenzoxazoles have dielectric constants of k≦2.7 and are suitable as an electrical insulator. Furthermore, these materials adhere very well on all surfaces relevant for microelectronics.

Type: Application

Filed: June 27, 2003

Publication date: April 29, 2004

Inventors: Recai Sezi, Andreas Walter, Anna Maltenberger, Klaus Lowack, Marcus Halik
Poly-o-hydroxyamide, polybenzoxazole, and electronic component including a dielectric having a barrier effect against copper diffusion, and processes for preparing poly-o-hydroxyamides, polybenzoxazoles, and electronic components

Publication number: 20040063895

Abstract: Novel poly-o-hydroxyamides can be cyclized to give polybenzoxazoles which have a good diffusion barrier effect with respect to metals. The poly-o-hydroxyamides can be applied to a semiconductor substrate by customary techniques and converted into the polybenzoxazole in a simple manner by heating. This results in a good barrier layer with respect to diffusion of metals. This allows the diffusion barrier between conductor track and dielectric to be substantially dispensed.

Type: Application

Filed: June 27, 2003

Publication date: April 1, 2004

Inventors: Recai Sezi, Andreas Walter, Anna Maltenberger, Klaus Lowack
Method of producing an adhesive bond

Publication number: 20040060635

Abstract: In a method of bonding components, a poly-o-hydroxyamide is applied to each of the bond areas of the components to be bonded. After the bond areas have been bonded to one another the adhesively bonded assembly is heated in order to convert the poly-o-hydroxyamide to the corresponding polybenzoxazole. The adhesive bonding technology is able to replace conventional joining techniques, such as welding, brazing or shrink fitting. The method is especially suitable for producing X-ray image intensifiers.

Type: Application

Filed: September 25, 2003

Publication date: April 1, 2004

Inventors: Heinrich Diepers, Recai Sezi
Bis-o-aminophenols and processes for producing bis-o-aminophenols

Publication number: 20040049081

Abstract: A bis-o-aminophenol has a formula I 1

Type: Application

Filed: June 27, 2003

Publication date: March 11, 2004

Inventors: Andreas Walter, Ingo Gnuchtel, Anna Maltenberger, Recai Sezi, Horst Hartmann
Methods for producing a dielectric, dielectric having self-generating pores, monomer for porous dielectrics, process for preparing poly-o-hydroxyamides, process for preparing polybenzoxazoles, and processes for producing an electronic component

Publication number: 20040028821

Abstract: Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.

Type: Application

Filed: April 28, 2003

Publication date: February 12, 2004

Inventors: Recai Sezi, Andreas Walter, Klaus Lowack, Anna Maltenberger, Robert Banfic
COMPONENT HAVING AT LEAST TWO MUTUALLY ADJACENT INSULATING LAYERS AND CORRESPONDING PRODUCTION METHOD

Publication number: 20030207095

Abstract: The invention relates to a component having two adjacent insulating layers and to a production process therefore. The component has an activated insulating layer, which can be converted into an electrically conductive layer by metallization.

Type: Application

Filed: March 27, 2001

Publication date: November 6, 2003

Inventors: Klaus Lowack, Gunter Schmid, Recai Sezi
Metallizing method for dielectrics

Patent number: 6635410

Abstract: A method for metallizing dielectrics includes applying a photosensitive dielectric to a substrate. The dielectric is then exposed to light through a mask, is seeded with a metal and is subjected to a temperature treatment. Afterwards, the dielectric is chemically metallized. Alternatively, the dielectric can be first be seeded with a metal after being applied to the substrate, and can then be exposed to light through a mask. Afterwards, excess seeding material is removed and the dielectric is chemically metallized.

Type: Grant

Filed: May 28, 2002

Date of Patent: October 21, 2003

Assignee: Infineon Technologies AG

Inventors: Joerg Haussmann, Klaus Lowack, Wolfgang Radlik, Guenter Schmid, Recai Sezi
Poly-o-hydroxyamides, polybenzoxazoles, processes for producing poly-o-hydroxyamides, processes for producing polybenzoxazoles, dielectrics including a polybenzoxazole, electronic components including the dielectrics, and processes for manufacturing the electronic components

Publication number: 20030176623

Abstract: Poly-o-hydroxyamides are cyclicized to obtain polybenzoxazoles. The poly-o-hydroxyamides provide effective filling of trenches. In particular, the poly-o-hydroxyamides can fill trenches having a width of less than 100 nm and an aspect ratio of more than 4. Further, the polybenzoxazoles of the invention are very suitable for the damascene process. A dielectric can be made from the polybenzoxazole. In turn, semiconductor devices can include the dieletric. Processes for making the poly-o-hydroxyamides, polybenzoxazoles, and semiconductor devices are included.

Type: Application

Filed: September 30, 2002

Publication date: September 18, 2003

Inventors: Klaus Lowack, Anna Maltenberger, Recai Sezi, Andreas Walter
Adhesively bonded chip-and wafer stacks

Publication number: 20030150557

Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).

Type: Application

Filed: July 30, 2002

Publication date: August 14, 2003

Inventors: Recai Sezi, Andreas Walter
Use of polybenzoxazoles (PBOS) for adhesion

Publication number: 20030149207

Abstract: The present invention describes the use of polybenzoxazoles (PBOs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the polybenzoxazoles of the formula (I).

Type: Application

Filed: July 30, 2002

Publication date: August 7, 2003

Inventors: Andreas Walter, Recai Sezi
Process for producing structured protective and insulating layers

Patent number: 6599687

Abstract: A process for producing structured or patterned protective and insulating layers includes applying a solution of a photosensitive polyhydroxyamide or polyhydroxyimide to a substrate and drying. The layer is patterned or structured by irradiation with UV light or X-rays through the use of a mask or by guidance of a UV or electron beam and by subsequent aqueous-alkali development. The patterned or structured layer is irradiated over the whole area with UV light and then tempered or heat-treated.

Type: Grant

Filed: September 18, 1998

Date of Patent: July 29, 2003

Assignee: Osram Opto Semiconductor GmbH Co. OHG

Inventors: Ewald Günther, Recai Sezi, Michael Keitmann
Polybenzoxazoles from poly-o-hydroxyamide, novel poly-o-hydroxyamides, preparation processes therefor, and their application in microelectronics

Publication number: 20030134226

Abstract: High-temperature-stable polybenzoxazoles are formed from novel poly-o-hydroxyamides. The novel poly-o-hydroxyamides have low dielectric constants, are suitable for exposure at 248 nm or shorter wavelengths, and have hydroxyl groups at least some of which have been protected by tert-butoxycarbonyl protective groups.

Type: Application

Filed: September 16, 2002

Publication date: July 17, 2003

Inventor: Recai Sezi
Bis-o-aminophenol derivatives, poly-o-hydroxyamides, and polybenzoxazoles, usable in photosensitive compositions, dielectrics, buffer coatings, and microelectronics

Publication number: 20030104311

Abstract: Bis-o-aminophenols, which carry on at least one of their hydroxyl groups a tert-butoxy-carbonyl group, can be reacted with dicarboxylic acids to give the corresponding poly-o-hydroxyamides. Following cyclization to the polybenzoxazole, these polymers have a lower dielectric constant than compounds prepared from corresponding poly-o-hydroxyamides which do not carry any tert-butoxycarbonyl group.

Type: Application

Filed: September 16, 2002

Publication date: June 5, 2003

Inventor: Recai Sezi
Photosensitive formulation for buffer coatings, film containing the photosensitive formulation, and method for fabricating electronics with the photosensitive formulation

Publication number: 20030099904

Abstract: A photosensitive formulation for high-temperature-resistant photoresists is based on polyhydroxyamides. The photosensitive formulations display a much higher photosensitivity than the comparable formulations based on quinone azide photoactive components. After conversion to the polybenzoxazole, the novel formulations also display a lower dielectric constant than the quinone azide-based formulations. A film can be made by applying the photosensitive formulation to a wafer and then evaporating the solvent. A method for fabricating electronics and micorelectronics structures a wafer by using the film in photolithography.

Type: Application

Filed: September 16, 2002

Publication date: May 29, 2003

Inventor: Recai Sezi
Bis-o-nitrophenols derivatives and poly-o-hydroxyamides, polybenzoxazoles, materials, and microelectronic devices made therefrom

Publication number: 20030100698

Abstract: Materials for dielectrics and/or buffer layers in microelectronics utilize polymers can be based on bis-o-nitrophenols. The bis-o-nitrophenols carry a tert-butoxycarbonyl group on at least one of the hydroxyl groups. The polybenzoxazoles prepared from these compounds have a lower dielectric constant than corresponding polymers which are prepared from bis-o-nitrophenols that do not have a tert-butoxycarbonyl group.

Type: Application

Filed: September 16, 2002

Publication date: May 29, 2003

Inventor: Recai Sezi
Photosensitive formulation for buffer coatings, film including the formulation, and method for manufacturing electronics using the formulation

Publication number: 20030087190

Abstract: A photosensitive formulation for high-temperature-stable photoresists is based on polyhydroxyamides. The photosensitive formulations are suitable for exposures at 248 nm and below, and following conversion into the polybenzoxazole exhibit a much lower dielectric constant than the corresponding formulations whose base polymers do not contain these protective groups. All of the protective groups are eliminated on heat treatment (baking) while the dielectric constant of the formulations remains as low as that of the base polymers used, which is much lower than the prior art.

Type: Application

Filed: September 16, 2002

Publication date: May 8, 2003

Inventor: Recai Sezi
Phenyl-linked oxazole cyanates as dielectrics having good adhesive and filling properties

Publication number: 20030060573

Abstract: The following invention relates to phenyl-linked polybenzoxazoles having terminal, aryl- or heteroaryl-attached cyanate groups which can be used for adhesive bonding and as dielectrics, especially for electronic components, and to a process for preparing them.

Type: Application

Filed: July 26, 2002

Publication date: March 27, 2003

Inventors: Andreas Walter, Recai Sezi
Bis-o-aminophenols and o-aminophenolcarboxylic acids and process for preparing the same

Patent number: 6531632

Abstract: Bis-o-aminophenols and o-aminophenolcarboxylic acids have the following structures: A1 to A7 are, independently of each other, H, F, CH3, CF3, OCH3 or OCF3. T is an aromatic or heterocyclic residue. A method for preparing bis-o-aminophenols and o-aminophenolcarboxylic acids is also provided.

Type: Grant

Filed: March 12, 2001

Date of Patent: March 11, 2003

Assignee: Infineon Technologies AG

Inventors: Jörg Haussmann, Gerhard Maier, Recai Sezi

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