Patents by Inventor Recai Sezi

Recai Sezi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030027885
    Abstract: The novel photo-cross-linkable polymers are suitable as coating materials. The photo-cross-linkable polymers contain a biphenylene unit, which can be dimerized by exposure. Attached to the biphenyl unit are side chains of a polymer with a high temperature resistance and a high chemical stability. Through exposure, the biphenylene units dimerize, whereby the polymers are spatially cross-linked.
    Type: Application
    Filed: July 1, 2002
    Publication date: February 6, 2003
    Inventors: Marcus Halik, Klaus Lowack, Recai Sezi, Andreas Walter
  • Publication number: 20020198277
    Abstract: Production of a porous layer includes using a composition which includes a first polymer component and a second polymer component, the first polymer component being polyhydroxyamide and/or polybenzoxazole and stable at a temperature at which the second polymer component decomposes and volatilizes. If the composition is heated to the decomposition temperature of the second polymer component, the second component volatilizes and a porous layer that contains the first component remains.
    Type: Application
    Filed: June 26, 2002
    Publication date: December 26, 2002
    Inventor: Recai Sezi
  • Publication number: 20020198294
    Abstract: A layer-forming antireflective composition is proposed which contains as a base polymer poly(hydroxyamide) or polybenzoxazole and as dye component at least one dye from the classes of the methine dyes, methine dye derivatives, azomethine dyes, azomethine dye derivatives, coumarin dyes, coumarin dye derivatives, triphenylmethane dyes, triphenylmethane dye derivatives and/or an azo dye.
    Type: Application
    Filed: May 23, 2002
    Publication date: December 26, 2002
    Inventors: Andreas Walter, Recai Sezi
  • Publication number: 20020184756
    Abstract: The present invention provides a process for wiring electrical contact sites, in particular on the surface of an electronic or microelectronic component, with the following steps: applying and patterning at least one dielectric on the component surface; currentlessly depositing a conductor starting layer for producing metal wiring interconnects and substitute contact sites with short-circuit contacts for interconnecting the individual metal wiring interconnects and the corresponding electrical contact sites; reinforcing the conductor starting layer by a common electrodepositing process; and separating the short-circuit contacts for separating the electrical contact sites or the contact sites of the wiring from one another.
    Type: Application
    Filed: May 14, 2002
    Publication date: December 12, 2002
    Applicant: Infineon Technologies AG
    Inventors: Klaus Lowack, Guenter Schmid, Recai Sezi, Ute Zschieschang
  • Publication number: 20020172892
    Abstract: A method for metallizing dielectrics includes applying a photosensitive dielectric to a substrate. The dielectric is then exposed to light through a mask, is seeded with a metal and is subjected to a temperature treatment. Afterwards, the dielectric is chemically metallized. Alternatively, the dielectric can be first be seeded with a metal after being applied to the substrate, and can then be exposed to light through a mask. Afterwards, excess seeding material is removed and the dielectric is chemically metallized.
    Type: Application
    Filed: May 28, 2002
    Publication date: November 21, 2002
    Inventors: Joerg Haussmann, Klaus Lowack, Wolfgang Radlik, Guenter Schmid, Recai Sezi
  • Publication number: 20020142092
    Abstract: The invention relates to a process for the metallization of an insulator and/or a dielectric, wherein the insulator is firstly activated, it is subsequently coated with another insulator and the latter is patterned, then the first is seeded and lastly metallized.
    Type: Application
    Filed: March 27, 2001
    Publication date: October 3, 2002
    Inventors: Klaus Lowack, Gunter Schmid, Recai Sezi
  • Publication number: 20020132061
    Abstract: The present invention relates to a process for producing a porous layer adhering to a substrate, which comprises the steps:
    Type: Application
    Filed: March 14, 2002
    Publication date: September 19, 2002
    Inventor: Recai Sezi
  • Patent number: 6437178
    Abstract: The invention relates to novel o-aminophenolcarboxylic acids or o-aminothiophenolcarboxylic acids of the following structure in which: A1 to A7 are—independently of one another—H, CH3, OCH3, CH2CH3 or OCH2CH3; T is O or S, and m is 0 or 1; Z is a carbocyclic or heterocyclic aromatic radical.
    Type: Grant
    Filed: July 9, 2001
    Date of Patent: August 20, 2002
    Assignee: Infineon Technologies AG
    Inventors: Recai Sezi, Michael Keitmann
  • Publication number: 20020086968
    Abstract: There are disclosed polybenzoxazole precursors which can be processed by centrifugal techniques, which can be cyclized to polybenzoxazoles on substrates without difficulty, and which after cyclization to polybenzoxazoles exhibit a high temperature stability. In particular, these precursors and the polybenzoxazoles prepared from them possess high resistance against the diffusion of metals.
    Type: Application
    Filed: November 13, 2001
    Publication date: July 4, 2002
    Inventors: Jorg Haussmann, Gerhard Maier, Gunter Schmid, Recai Sezi
  • Publication number: 20020010370
    Abstract: Bis-o-aminophenols and o-aminophenolcarboxylic acids have the following structures: 1
    Type: Application
    Filed: March 12, 2001
    Publication date: January 24, 2002
    Inventors: J?ouml;rg Haussmann, Gerhard Maier, Recai Sezi
  • Publication number: 20010056203
    Abstract: The invention relates to novel o-aminophenolcarboxylic acids or o-aminothiophenolcarboxylic acids of the following structure 1
    Type: Application
    Filed: July 9, 2001
    Publication date: December 27, 2001
    Applicant: Siemens Aktiengesellschaft
    Inventors: Recai Sezi, Michael Keitmann
  • Patent number: 6320081
    Abstract: The invention relates to novel o-nitrophenol derivatives and o-nitrothiophenol derivatives of the following structure: where: A1 to A3 are—independently of one another—H, F, CH3, CF3, OCH3, OCF3, CH2CH3, CF2CF3, OCH2CH3 or OCF2CF3; T is O or S; R is an aliphatic or araliphatic radical; and R* is H or R.
    Type: Grant
    Filed: September 24, 1998
    Date of Patent: November 20, 2001
    Assignee: Infineon Technologies AG
    Inventors: Michael Keitmann, Recai Sezi, Andreas Weber
  • Publication number: 20010036721
    Abstract: The invention relates to a process for metallizing at least one insulating layer of a component. A plurality of levels are exposed for metallization by patterning and forming connections between the insulating layers.
    Type: Application
    Filed: March 27, 2001
    Publication date: November 1, 2001
    Inventors: Claus Dallner, Klaus Lowack, Gunter Schmid, Recai Sezi
  • Patent number: 6310238
    Abstract: The invention relates to novel o-aminophenolcarboxylic acids or o-aminothiophenolcarboxylic acids of the following structure in which: A1 to A7 are—independently of one another—H, CH3, OCH3, CH2CH3 or OCH2CH3; T is O or S, and m is 0 or 1; Z is a carbocyclic or heterocyclic aromatic radical.
    Type: Grant
    Filed: September 24, 1998
    Date of Patent: October 30, 2001
    Assignee: Siemens Aktiengesellschaft
    Inventors: Recai Sezi, Michael Keitmann
  • Patent number: 6194482
    Abstract: UV-hardenable and thermally hardenable epoxy resins for the underfilling process in electrical and electronic components are provided. A new casting resin component has an increased storage stability at room temperature of at least 6 months and improved characteristics for the underfilling process including faster hardening and lower viscosity. Filler material with a maximum grain size of 20 &mgr;m and a siloxane component are provided in addition to the casting resin formulation.
    Type: Grant
    Filed: November 22, 1999
    Date of Patent: February 27, 2001
    Assignee: Siemens Aktiengesellschaft
    Inventors: Barbara Lehner, Recai Sezi
  • Patent number: 6156902
    Abstract: The invention relates to novel bis-o-aminophenols, and bis-o-aminothiophenols of the following structure: ##STR1## where A.sup.1 to A.sup.3 are--independently of one another--H, CH.sub.3, OCH.sub.3, CH.sub.2 CH.sub.3, or OCH.sub.2 CH.sub.3T is O or S, andZ is a carbocyclic or heterocyclic aromatic radical.
    Type: Grant
    Filed: September 24, 1998
    Date of Patent: December 5, 2000
    Assignee: Infineon Technologies AG
    Inventors: Recai Sezi, Michael Keitmann, Andreas Weber
  • Patent number: 6153350
    Abstract: The polybenzoxazole and polybenzothiazole precursors of the invention have the following partial structure: ##STR1## where: A.sup.1 to A.sup.6 are--independently of one another--H, F, CH.sub.3, CF.sub.3, OCH.sub.3, OCF.sub.3, CH.sub.2 CH.sub.3, CF.sub.2 CF.sub.3, OCH.sub.2 CH.sub.3 or OCF.sub.3 CF.sub.3 ;T is O or S, and m is 1;Z is a carbocyclic or heterocyclic aromatic radical.
    Type: Grant
    Filed: September 25, 1998
    Date of Patent: November 28, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Recai Sezi, Michael Keitmann, Gunther Schmid
  • Patent number: 6150558
    Abstract: The invention relates to novel bis-o-aminophenols, and bis-o-aminothiophenols of the following structure: ##STR1## where A.sup.1 to A.sup.6 are--independently of one another--H, F, CH.sub.3, CF.sub.3, OCH.sub.3, OCF.sub.3, CH.sub.2 CH.sub.3, CF.sub.2 CF.sub.3, OCH.sub.2 CH.sub.3 or OCF.sub.2 CF.sub.3, where at least one of the radicals A.sup.1 to A.sup.6 must be F or an F-containing group; T is O or S, and m is 0 or 1; and Z is a carbocyclic or heterocyclic aromatic radical.
    Type: Grant
    Filed: September 24, 1998
    Date of Patent: November 21, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Recai Sezi, Michael Keitmann
  • Patent number: 6120970
    Abstract: The polybenzoxazole and polybenzothiazole precursors of the invention have the following partial structure: ##STR1## where: A.sup.1 to A.sup.7 are--independently of one another--H, F, CH.sub.3, CF.sub.3, OCH.sub.3, OCF.sub.3, CH.sub.2 CH.sub.3, CF.sub.2 CF.sub.3, OCH.sub.2 CH.sub.3 or OCF.sub.2 CF.sub.3 ;T is O or S, and m is 1;Z is a carbocyclic or heterocyclic aromatic radical.
    Type: Grant
    Filed: September 25, 1998
    Date of Patent: September 19, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Recai Sezi, Michael Keitmann
  • Patent number: 6110637
    Abstract: A photoresist suitable for the production of structures in the submicron range contains the following components:a polymer component with carboxylic acid anhydride functions and carboxylic acid tert. butyl ester groupsa photoinitiator which releases an acid when exposed anda suitable solvent.
    Type: Grant
    Filed: February 9, 1995
    Date of Patent: August 29, 2000
    Assignee: Siemens Aktinegesellschaft
    Inventors: Recai Sezi, Rainer Leuschner, Horst Borndoerfer, Michael Sebald, Siegfried Birkle, Hellmut Ahne