Patents by Inventor Richard A. Johannes
Richard A. Johannes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180299770Abstract: A method including identifying that an area of a first substrate includes a hotspot based on a measurement and/or simulation result pertaining to a patterning device in a patterning system, determining first error information at the hotspot, and creating first modification information for modifying the patterning device (e.g., the information to be transmitted with the patterning device to a patterning modification tool) based on the first error information to obtain a modified patterning device.Type: ApplicationFiled: September 27, 2016Publication date: October 18, 2018Applicant: ASML NETHERLANDS B.V.Inventors: Peter TEN BERGE, Johannes Catharinus Hubertus MULKENS, Bernardo KASTRUP, Richard Johannes Franciscus VAN HAREN
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Publication number: 20180253015Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: ApplicationFiled: March 8, 2018Publication date: September 6, 2018Applicant: ASML Netherlands B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
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Publication number: 20180252998Abstract: A method including: determining first error information based on a first measurement and/or simulation result pertaining to a first patterning device in a patterning system; determining second error information based on a second measurement and/or simulation result pertaining to a second patterning device in the patterning system; determining a difference between the first error information and the second error information; and creating modification information for the first patterning device and/or the second patterning device based on the difference between the first error information and the second error information, wherein the difference between the first error information and the second error information is reduced to within a certain range after the first patterning device and/or the second patterning device is modified according to the modification information.Type: ApplicationFiled: September 27, 2016Publication date: September 6, 2018Applicant: ASML NETHERLANDS B.V.Inventors: Peter TEN BERGE, Daan Maurits SLOTBOOM, Richard Johannes VAN HAREN, Peter Hanzen WARDENIER
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Patent number: 10061212Abstract: Disclosed is a method of measuring a target, associated substrate comprising a target and computer program. The target comprises overlapping first and second periodic structures. The method comprising illuminating the target with measurement radiation and detecting the resultant scattered radiation. The pitch of the second periodic structure is such, relative to a wavelength of the measurement radiation and its angle of incidence on the target, that there is no propagative non-zeroth diffraction at the second periodic structure resultant from said measurement radiation being initially incident on said second periodic structure. There may be propagative non-zeroth diffraction at the second periodic structure which comprises further diffraction of one or more non-zero diffraction orders resultant from diffraction by the first periodic structure.Type: GrantFiled: April 3, 2017Date of Patent: August 28, 2018Assignee: ASML Netherlands B.V.Inventors: Maurits Van Der Schaar, Richard Johannes Franciscus Van Haren, Everhardus Cornelis Mos, Youping Zhang
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Patent number: 10025193Abstract: A lithographic apparatus applies a pattern repeatedly to target portions across a substrate. Prior to applying the pattern an alignment sensor measures positions of marks in the plane of the substrate and a level sensor measures height deviations in a direction normal to the plane of the substrate. The apparatus applies the pattern to the substrate while positioning the applied pattern using the positions measured by the alignment sensor and using the height deviations measured by the level sensor. The apparatus is further arranged to calculate and apply corrections in the positioning of the applied pattern, based on derivatives of the measured height deviations. The corrections may be calculated on an intrafield and/or interfield basis. The corrections may be based on changes between the observed height deviations and height deviations measured previously on the same substrate.Type: GrantFiled: October 23, 2014Date of Patent: July 17, 2018Assignee: ASML NETHERLANDS B.V.Inventors: Hakki Ergün Cekli, Xing Lan Liu, Daan Maurits Slotboom, Wim Tjibbo Tel, Stefan Cornelis Theodorus Van Der Sanden, Richard Johannes Franciscus Van Haren
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Publication number: 20180173099Abstract: A method to form on a substrate a first target comprising a first feature and a second target comprising a second feature, wherein the forming of the targets comprises applying the first feature and the second feature to the substrate by projection of a radiation beam through a production patterning device installed in a lithographic apparatus, the features corresponding to one or more features of the patterning device, and controlling a configuration of the lithographic apparatus to induce an aberration component, such that the first feature is applied to the substrate using a first value of an induced aberration component and the second feature is applied to the substrate using a second, different value of the induced aberration component; measuring a property of the targets; and using the measurements to determine a sensitivity of the property of the targets to changes in value of the induced aberration component.Type: ApplicationFiled: June 7, 2016Publication date: June 21, 2018Applicant: ASML Netherlands B.V.Inventors: Cedric Marc AFFENTAUSCHEGG, Milenko JOVANOVIC, Richard Johannes Franciscus VAN HAREN, Reiner Maria JUNGBLUT, Robertus Wilhelmus VAN DER HEIJDEN
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Patent number: 9946165Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: GrantFiled: September 5, 2014Date of Patent: April 17, 2018Assignee: ASML NETHERLANDS B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
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Patent number: 9879988Abstract: Disclosed is a method of measuring a parameter of a lithographic process, and associated computer program and apparatuses. The method comprises providing a plurality of target structures on a substrate, each target structure comprising a first structure and a second structure on different layers of the substrate. Each target structure is measured with measurement radiation to obtain a measurement of target asymmetry in the target structure, the target asymmetry comprising an overlay contribution due to misalignment of the first and second structures, and a structural contribution due to structural asymmetry in at least the first structure. A structural asymmetry characteristic relating to the structural asymmetry in at least the first structure of each target structure is obtained, the structural asymmetry characteristic being independent of at least one selected characteristic of the measurement radiation.Type: GrantFiled: February 2, 2016Date of Patent: January 30, 2018Assignee: ASML Netherlands B.V.Inventors: Xing Lan Liu, Hendrik Jan Hidde Smilde, Yue-Lin Peng, Hakki Ergün Cekli, Josselin Pello, Richard Johannes Franciscus Van Haren
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Patent number: 9863204Abstract: A connector assembly for insertion into a hollow portion of a tool, fixture, or housing. The connector assembly may have a connector having two terminated end portions for reducing assembly time and cost with on-site termination. The connector assembly may include a first outer body having a hollow portion for insertion of at least a portion of a first insert-assembly sleeve portion. The connector assembly may have at least one retaining portion extruding radially inward and configured to be positioned into at least one radially inward groove of the first insert-assembly sleeve portion for securing at least a portion of the first terminated end portion in the first outer body. With this assembly, one of the terminated end portions without an outer body may be passed through the hollow portion and then assembled to the corresponding outer body and reinserted into an end of the hollow portion.Type: GrantFiled: March 16, 2015Date of Patent: January 9, 2018Assignee: SABRITECInventors: James Chungyu Chan, Richard Johannes, Christopher Wade Nesselroad
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Publication number: 20170293233Abstract: Disclosed is a method of measuring a target, associated substrate comprising a target and computer program. The target comprises overlapping first and second periodic structures. The method comprising illuminating the target with measurement radiation and detecting the resultant scattered radiation. The pitch of the second periodic structure is such, relative to a wavelength of the measurement radiation and its angle of incidence on the target, that there is no propagative non-zeroth diffraction at the second periodic structure resultant from said measurement radiation being initially incident on said second periodic structure. There may be propagative non-zeroth diffraction at the second periodic structure which comprises further diffraction of one or more non-zero diffraction orders resultant from diffraction by the first periodic structure.Type: ApplicationFiled: April 3, 2017Publication date: October 12, 2017Applicant: ASML Netherlands B.V.Inventors: Maurits VAN DER SCHAAR, Richard Johannes Franciscus VAN HAREN, Everhardus Cornelis MOS, Youping ZHANG
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Patent number: 9753377Abstract: A deformation pattern recognition method including providing one or more deformation patterns, each deformation pattern being associated with a deformation of a substrate that may be caused by a processing device; transferring a first pattern to a substrate, the first pattern including at least N alignment marks, wherein each alignment mark is positioned at a respective predefined nominal position; processing the substrate; measuring a position of N alignment marks and determining an alignment mark displacement for the N alignment marks by comparing the respective nominal position with the respective measured position; fitting at least one deformation pattern to the measured alignment mark displacements; determining an accuracy value for each fitted deformation pattern, the accuracy value being representative of the accuracy of the corresponding fit; using the determined accuracy value, determining whether an associated deformation pattern is present.Type: GrantFiled: June 27, 2013Date of Patent: September 5, 2017Assignee: ASML NETHERLANDS B.V.Inventors: Hakki Ergun Cekli, Irina Lyulina, Manfred Gawein Tenner, Richard Johannes Franciscus Van Haren, Stefan Cornelis Theodorus Van Der Sanden
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Publication number: 20170176871Abstract: A method of devising a target arrangement, and associated target and reticle. The target includes a plurality of gratings, each grating having a plurality of substructures. The method includes: defining a target area; locating the substructures within the target area so as to form the gratings; and locating assist features at the periphery of the gratings, the assist features being configured to reduce measured intensity peaks at the periphery of the gratings. The method may include an optimization process including modelling a resultant image obtained by inspection of the target using a metrology process; and evaluating whether the target arrangement is optimized for detection using a metrology process.Type: ApplicationFiled: January 29, 2015Publication date: June 22, 2017Applicant: ASML Netherlands B.V.Inventors: Henricus Wilhelmus Maria VAN BUEL, Johannes Marcus Maria BELTMAN, Xing Lan LIU, Hendrik Jan Hidde SMILDE, Richard Johannes Franciscus VAN HAREN
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Patent number: 9650848Abstract: Electrical contacts for use in oil and gas applications that include at least one elongate contact element defining a cavity for receiving a male electrical contact. The at least one elongate contact element may be configured to flex away from the cavity. Such electrical contacts may be used in electrical connectors, including contact blocks and electrical contact kits.Type: GrantFiled: June 4, 2015Date of Patent: May 16, 2017Assignee: SABRITECInventors: Ronald Taylor, Richard Johannes, Michael Carlson
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Publication number: 20170109494Abstract: Systems for use with a medical device for reducing medical facility readmission risks are provided. In one aspect, a system includes a medical device that is configurable with operating limit parameters for providing testing or treatment to a patient, and a limiting system. The limiting system includes a memory that includes patient-specific information for the patient and a database that includes readmission risk information, and a processor. The processor is configured to compare readmission risk parameters with the patient-specific information, and provide a readmission risk score for integration with medical devices and processes corresponding to the patient. Methods and machine-readable media are also provided.Type: ApplicationFiled: October 17, 2016Publication date: April 20, 2017Inventors: Carlos Nunez, Ying Tabak, Xiaowu Sun, Vikas Gupta, Richard Johannes
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Publication number: 20170052454Abstract: A substrate has a plurality of overlay gratings formed thereon by a lithographic process. Each overlay grating has a known overlay bias. The values of overlay bias include for example two values in a region centered on zero and two values in a region centered on P/2, where P is the pitch of the gratings. Overlay is calculated from asymmetry measurements for the gratings using knowledge of the different overlay bias values, each of the overall asymmetry measurements being weighted by a corresponding weight factor. Each one of the weight factors represents a measure of feature asymmetry within the respective overlay grating. The calculation is used to improve subsequent performance of the measurement process, and/or the lithographic process. Some of the asymmetry measurements may additionally be weighted by a second weight factor in order to eliminate or reduce the contribution of phase asymmetry to the overlay.Type: ApplicationFiled: August 18, 2016Publication date: February 23, 2017Applicant: ASML NETHERLANDS B.V.Inventors: Martin Jacobus Johan JAK, Hendrik Jan Hidde SMILDE, Te-Chih HUANG, Victor Emanuel CALADO, Henricus Wilhelmus Maria VAN BUEL, Richard Johannes Franciscus VAN HAREN
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Patent number: 9564717Abstract: A connector system including a sensing mechanism that can be used to control signal distribution through the connector system is disclosed. The connector system may include a first connector and a second connector configured to be operatively engaged in both a mated condition and an interlocked condition. The connectors of the connector system include conductive contacts that complete a conductive connection when the connectors are in the mated condition. The connector system includes a fastening mechanism that provides an interlocked condition following mating of the connectors, and may further include a sensor and a sensor trigger that may be used to sense the connection status of the system. The sensor may connected to a controller, with the controller controlling signal distribution through the connector system dependent on the connection status determined by the sensing mechanism. A method for controlling signal distribution through a connector system is also provided.Type: GrantFiled: March 17, 2014Date of Patent: February 7, 2017Assignee: SabritecInventors: Gene Whetstone, Richard Johannes
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Patent number: 9506743Abstract: An apparatus to measure the position of a mark, the apparatus including an objective lens to direct radiation on a mark using radiation supplied by an illumination arrangement; an optical arrangement to receive radiation diffracted and specularly reflected by the mark, wherein the optical arrangement is configured to provide a first image and a second image, the first image being formed by coherently adding specularly reflected radiation and positive diffraction order radiation and the second image being formed by coherently adding specularly reflected radiation and negative diffraction order radiation; and a detection arrangement to detect variation in an intensity of radiation of the first and second images and to calculate a position of the mark in a direction of measurement therefrom.Type: GrantFiled: September 20, 2013Date of Patent: November 29, 2016Assignees: ASML NETHERLANDS B.V., ASML HOLDING N.V.Inventors: Arie Jeffrey Den Boef, Justin Lloyd Kreuzer, Simon Gijsbert Josephus Mathijssen, Gerrit Johannes Nijmeijer, J. Christian Swindal, Patricius Aloysius Jacobus Tinnemans, Richard Johannes Franciscus Van Haren
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Publication number: 20160334712Abstract: A lithographic apparatus applies a pattern repeatedly to target portions across a substrate. Prior to applying the pattern an alignment sensor measures positions of marks in the plane of the substrate and a level sensor measures height deviations in a direction normal to the plane of the substrate. The apparatus applies the pattern to the substrate while positioning the applied pattern using the positions measured by the alignment sensor and using the height deviations measured by the level sensor. The apparatus is further arranged to calculate and apply corrections in the positioning of the applied pattern, based on derivatives of the measured height deviations. The corrections may be calculated on an intrafield and/or interfield basis. The corrections may be based on changes between the observed height deviations and height deviations measured previously on the same substrate.Type: ApplicationFiled: October 23, 2014Publication date: November 17, 2016Applicant: ASML Netherlands B.V.Inventors: Hakki Ergün CEKLI, Daan Maurits SLOTBOOM, Wim Tjibbo TEL, Stefan Cornelis Theodorus VAN DER SANDEN, Richard Johannes Franciscu VAN HAREN
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Publication number: 20160322739Abstract: Electrical contacts for use in oil and gas applications that include at least one elongate contact element defining a cavity for receiving a male electrical contact. The at least one elongate contact element may be configured to flex away from the cavity. Such electrical contacts may be used in electrical connectors, including contact blocks and electrical contact kits.Type: ApplicationFiled: June 4, 2015Publication date: November 3, 2016Inventors: Ronald Taylor, Richard Johannes, Michael Carlson
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Publication number: 20160246185Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: ApplicationFiled: September 5, 2014Publication date: August 25, 2016Applicant: ASML Netherlands B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg