Abstract: A measurement apparatus (10) for interferometrically determining a surface shape of a test object (14). A radiation source provides an input wave (42), a multiply-encoded diffractive optical element (60), which is configured to produce by diffraction from the input wave a test wave (66) that is directed at the test object and has a wavefront in the form of a free-form surface and at least one calibration wave (70), and a capture device (46). The calibration wave has a wavefront with a non-rotationally symmetric shape (68f), wherein cross sections through the wavefront of the calibration wave along cross-sectional surfaces each aligned transversely to one another have a curved shape. The curved shapes in the different cross-sectional surfaces differ in terms of an opening parameter. The capture device (46) captures a calibration interferogram formed by superimposing a reference wave (40) with the calibration wave after interaction with a calibration object (74).

Abstract: A method for analyzing the wavefront effect of an optical system includes: illuminating a measurement mask (110, 310) with illumination light, producing an interferogram in a specified plane using a diffraction grating (150) from a wavefront from the illuminated measurement mask and traveling through the optical system; and capturing the interferogram with a detector (170). Different angular distributions of the illumination light incident on the measurement mask are produced via a mirror arrangement of independently settable mirror elements. A plurality of interferograms are captured in a plurality of measurement steps, wherein these measurement steps differ respectively in angular distribution of the illumination light that is incident on the measurement mask.

Abstract: The disclosure provides an optical system, having a first optical control loop, which is set up to regulate a position and/or spatial orientation of a first optical element relative to a first module sensor frame, and a first module control loop, which is set up to regulate a position and/or spatial orientation of the first module sensor frame relative to a base sensor frame.

Abstract: A measurement apparatus (10) for interferometrically determining a surface shape of a test object (14). A radiation source provides an input wave (42), a multiply-encoded diffractive optical element (60), which is configured to produce by diffraction from the input wave a test wave (66) that is directed at the test object and has a wavefront in the form of a free-form surface and at least one calibration wave (70), and a capture device (46). The calibration wave has a wavefront with a non-rotationally symmetric shape (68f), wherein cross sections through the wavefront of the calibration wave along cross-sectional surfaces each aligned transversely to one another have a curved shape. The curved shapes in the different cross-sectional surfaces differ in terms of an opening parameter. The capture device (46) captures a calibration interferogram formed by superimposing a reference wave (40) with the calibration wave after interaction with a calibration object (74).

Abstract: A projection exposure apparatus includes a light source, an illumination system, and a projection lens. A method for producing or setting the projection exposure apparatus includes determining a first imaging property to be optimized. Optimizing the first imaging property includes optimizing the setting of the illumination system and/or the structure of the mask and/or at least one first adjustable optical element of the projection lens with respect to the shape of one of its at least one optically effective surfaces or with respect to the optical effect for the purposes of setting an optimized wavefront of the working light. Optimizing the illumination system, mask and/or optical element of the projection lens is implemented so that a further manipulator of the projection exposure apparatus for manipulating the wavefront is set in the central position of its manipulation range during the optimization of the first imaging property.

Abstract: A wafer holding device (200, 415) is configured to hold a wafer (205, 416) during operation of a microlithographic projection exposure apparatus and includes at least one sensor that is positionable in different rotational positions.

Abstract: A method for analyzing the wavefront effect of an optical system includes: illuminating a measurement mask (110, 310) with illumination light, producing an interferogram in a specified plane using a diffraction grating (150) from a wavefront from the illuminated measurement mask and traveling through the optical system; and capturing the interferogram with a detector (170). Different angular distributions of the illumination light incident on the measurement mask are produced via a mirror arrangement of independently settable mirror elements. A plurality of interferograms are captured in a plurality of measurement steps, wherein these measurement steps differ respectively in angular distribution of the illumination light that is incident on the measurement mask.

Abstract: An imaging optical system, in particular a projection objective, for microlithography, includes optical elements to guide electromagnetic radiation with a wavelength in a path to image an object field into an image plane. The imaging optical system includes a pupil, having coordinates (p, q), which, together with the image field, having coordinates (x, y) of the optical system, spans an extended 4-dimensional pupil space, having coordinates (x, y, p, q), as a function of which a wavefront W(x, y, p, q) of the radiation passing through the optical system is defined. The wavefront W can therefore be defined in the pupil plane as a function of an extended 4-dimensional pupil space spanned by the image field (x, y) and the pupil (p, q) as W(x, y, p, q)=W(t), with t=(x, y, p, q).

Abstract: AA wafer holding device (200, 415) is configured to hold a wafer (205, 416) during operation of a microlithographic projection exposure apparatus includes at least one sensor that is positionable in different rotational positions.

Abstract: The disclosure provides an optical system, having a first optical control loop, which is set up to regulate a position and/or spatial orientation of a first optical element relative to a first module sensor frame, and a first module control loop, which is set up to regulate a position and/or spatial orientation of the first module sensor frame relative to a base sensor frame.

Abstract: The disclosure provides an optical system, having a first optical control loop, which is set up to regulate a position and/or spatial orientation of a first optical element relative to a first module sensor frame, and a first module control loop, which is set up to regulate a position and/or spatial orientation of the first module sensor frame relative to a base sensor frame. Related components and methods are also provided.

Abstract: A method for aligning a mirror of a microlithographic projection exposure apparatus, according to one formulation, involves: recording a first partial interferogram between a wave reflected at a first mirror segment (101) and a reference wave reflected at a reference surface (110, 310, 510), recording a second partial interferogram between a wave reflected at a second mirror segment (102) and a reference wave reflected at the reference surface, determining a phase offset between the first partial interferogram and the second partial interferogram, and aligning the first mirror segment and the second mirror segment in relation to one another in accordance with the determined phase offset, so that the distance of the relevant mirror segments (101, 102) from a respective predetermined, hypothetical surface in the direction of the respective surface normal is less than ?/10 at each point on the mirror segments, where ? denotes the operating wavelength of the mirror.

Abstract: A method for producing a lens for a lithography apparatus is disclosed. A measurement system for ascertaining an optical characteristic of a partial lens for a lithography apparatus is also disclosed.

Abstract: A projection exposure system (10) includes: a mask holding device (14), a substrate holding device (36), projection optics (26) imaging the mask structures (20) onto the substrate (30) during an exposure process, and a measurement structure (48) disposed in a defined position with respect to a reference element (16) of the projection exposure system, which defined position is mechanically uncoupled from the position of the mask holding device. The projection exposure system also includes a detector (52) arranged to record an image of the measurement structure imaged by the projection optics. During operation of the system, the imaging of the mask structures and of the measurement structure takes place at the same time by the projection optics. An evaluation device (54) establishes a lateral position of the image of the measurement structure in the area of the detector during the exposure process.

Abstract: A method for aligning a mirror of a microlithographic projection exposure apparatus, according to one formulation, involves: recording a first partial interferogram between a wave reflected at a first mirror segment (101) and a reference wave reflected at a reference surface (110, 310, 510), recording a second partial interferogram between a wave reflected at a second mirror segment (102) and a reference wave reflected at the reference surface, determining a phase offset between the first partial interferogram and the second partial interferogram, and aligning the first mirror segment and the second mirror segment in relation to one another in accordance with the determined phase offset, so that the distance of the relevant mirror segments (101, 102) from a respective predetermined, hypothetical surface in the direction of the respective surface normal is less than ?/10 at each point on the mirror segments, where ? denotes the operating wavelength of the mirror.

Abstract: A method for aligning a mirror of a microlithographic projection exposure apparatus, according to one formulation, involves: recording a first partial interferogram between a wave reflected at a first mirror segment (101) and a reference wave reflected at a reference surface (110, 310, 510), recording a second partial interferogram between a wave reflected at a second mirror segment (102) and a reference wave reflected at the reference surface, determining a phase offset between the first partial interferogram and the second partial interferogram, and aligning the first mirror segment and the second mirror segment in relation to one another in accordance with the determined phase offset, so that the distance of the relevant mirror segments (101, 102) from a respective predetermined, hypothetical surface in the direction of the respective surface normal is less than ?/10 at each point on the mirror segments, where ? denotes the operating wavelength of the mirror.

Abstract: A projection exposure system (10) for microlithography which includes: a mask holding device (14) holding a mask (18) with mask structures (20) disposed on the mask, a substrate holding device (36) holding a substrate (30), projection optics (26) imaging the mask structures (20) onto the substrate (30) during an exposure process, and a measurement structure (48) disposed in a defined position with respect to a reference element (16) of the projection exposure system (10), which defined position is mechanically uncoupled from the position of the mask holding to device (14). The projection exposure system (10) also includes a detector (52) arranged to record an image of the measurement structure (48) imaged by the projection optics (26). The projection exposure system (10) is configured such that during operation of the projection exposure system (10) the imaging of the mask structures (20) and the imaging of the measurement structure (48) take place at the same time by the projection optics (26.

Abstract: An optical imaging device, including an imaging unit and a measuring device. The imaging unit includes a first optical element group having at least one first optical element, which contributes to the imaging. The measuring device determines an imaging error, which occurs during the imaging, using a capturing signal. The measuring device includes a measurement light source, a second optical element group and a capturing unit. The measurement light source emits at least one measurement light bundle, The second optical element group includes an optical reference element and a second optical element, which guide the measurement light bundle onto the capturing unit, to generate the capturing signal. Each second optical element has a defined spatial relationship with a respective one of the first optical elements, The second optical elements differ from the first optical elements. The measuring device determines the imaging error with the capturing signal.

Abstract: The disclosure provides an optical system, having a first optical control loop, which is set up to regulate a position and/or spatial orientation of a first optical element relative to a first module sensor frame, and a first module control loop, which is set up to regulate a position and/or spatial orientation of the first module sensor frame relative to a base sensor frame.

Abstract: A method for producing a lens for a lithography apparatus is disclosed. A measurement system for ascertaining an optical characteristic of a partial lens for a lithography apparatus is also disclosed.