Abstract: A semiconductor device includes a first and second semiconductor chips, a resistive component, and a semiconductor chip including a first circuit coupled to electrodes on both ends of the resistive component. A sealing body has a first long side, a second side, a third short side, and a fourth short side. In a Y-direction, each of the first and second semiconductor chips is disposed at a position closer to the first side than to the second side, while the semiconductor chip is disposed at a position closer to the second side than to the first side. Also, in the Y-direction, the resistive component, the second semiconductor chips, and the first semiconductor chips are arranged in order of increasing distance from the third side toward the fourth side, while the semiconductor chip is disposed at a position closer to the third side than to the fourth side.

Abstract: A method of controlling a power supply to a semiconductor device including a first region having a high-side drive circuit, a second region having a signal processing circuit, a low-side drive circuit and a voltage control circuit, and a separation region formed between the first and second regions and having a rectifying element, includes turning on a first control signal to the voltage control circuit, turning off the first control signal to the voltage control circuit, and repeating the turning on of the first control signal and the turning off the first control signal.

Abstract: A semiconductor device including a first circuit region in which a first circuit whose power supply potential is a first voltage is formed; a second circuit region in which a second circuit whose power supply potential is a second voltage lower than the first voltage is formed a separation region which separates the first circuit region from the second circuit region; and a transistor which is located in the separation region and couples the second circuit to the first circuit and whose source and drain are of a first conductivity type, the separation region including an element separation film; a first field plate which overlaps with the element separation film in plan view; a plurality of conductive films which are provided over the first field plate.

Abstract: Reliability of a semiconductor device is improved. A third semiconductor chip on which a control circuit is formed, and a first semiconductor chip of a plurality of IGBT chips are electrically connected via a high-side relay board. That is, the first semiconductor chip and the third semiconductor chip are electrically connected via a first wire, a high-side relay board and a second wire. Similarly, the third semiconductor chip on which the control circuit is formed and a second semiconductor chip of a plurality of IGBT chips are electrically connected via a low-side relay board. That is, the second semiconductor chip and the third semiconductor chip are electrically connected via the first wire, the low-side relay board and the second wire.

Abstract: To improve the reliability of a semiconductor device. A chip mounting portion TAB5 is arranged to be shifted to the +x direction side. Further, a gate electrode pad of a semiconductor chip CHP1 (LV) and a pad of a semiconductor chip CHP3 are electrically coupled by a wire W1a and a wire W1b through a relay lead RL1. Likewise, a gate electrode pad of a semiconductor chip CHP1 (LW) and the pad of the semiconductor chip CHP3 are electrically coupled by a wire W1c and a wire W1d through a relay lead RL2. At this time, the structures of parts of the relay leads RL1 and RL2, which are exposed from a sealing body MR are different from the structures of respective parts exposed from the sealing body MR, of a plurality of leads LD1 and LD2 which function as external terminals.

Abstract: An air suspension system includes a controller that controls opening/closing of normally-closed electromagnetic switching valves constituting a control valve, a first supply/discharge switching valve, a second supply/discharge switching valve, a first tank switching valve, and a second tank switching valve. The controller controls opening/closing of the electromagnetic switching valves in an order of first control, second control, and third control. In the first control, the control valve is opened. In the second control, the first supply/discharge switching valve and the second supply/discharge switching valve are opened in an opened state of the control valve. In the third control, the control valve, the first supply/discharge switching valve, and the second supply/discharge switching valve are closed.

Abstract: To realize a reduction in the number of parts in a system including a driver IC (semiconductor device). A high potential side power supply voltage is applied to a power supply application area. A high side area is formed with a circuit which includes a driver driving a high side transistor and is operated at a boot power supply voltage with a floating voltage as a reference. A low side area is formed with a circuit operated at a power supply voltage with a low potential side power supply voltage as a reference. A first termination area is disposed in a ring form so as to surround the power supply application area. A second termination area is disposed in a ring form so as to surround the high side area.

Abstract: Reliability of a semiconductor device is improved. A third semiconductor chip on which a control circuit is formed, and a first semiconductor chip of a plurality of IGBT chips are electrically connected via a high-side relay board. That is, the first semiconductor chip and the third semiconductor chip are electrically connected via a first wire, a high-side relay board and a second wire. Similarly, the third semiconductor chip on which the control circuit is formed and a second semiconductor chip of a plurality of IGBT chips are electrically connected via a low-side relay board. That is, the second semiconductor chip and the third semiconductor chip are electrically connected via the first wire, the low-side relay board and the second wire.

Abstract: To improve the reliability of a semiconductor device. A chip mounting portion TAB5 is arranged to be shifted to the +x direction side. Further, a gate electrode pad of a semiconductor chip CHP1 (LV) and a pad of a semiconductor chip CHP3 are electrically coupled by a wire W1a and a wire W1b through a relay lead RL1. Likewise, a gate electrode pad of a semiconductor chip CHP1 (LW) and the pad of the semiconductor chip CHP3 are electrically coupled by a wire W1c and a wire W1d through a relay lead RL2. At this time, the structures of parts of the relay leads RL1 and RL2, which are exposed from a sealing body MR are different from the structures of respective parts exposed from the sealing body MR, of a plurality of leads LD1 and LD2 which function as external terminals.

Abstract: A driver integrated circuit includes a bootstrap circuit (BSC) configured to output a boot power supply voltage (VB) based on a first power supply voltage, the boot power supply voltage being higher than the first power supply voltage; a level shift circuit (LSC) configured to output an output pulse signal based on an input pulse signal and the boot power supply voltage; a high side driving circuit (HSU) configured to output a high side driving voltage based on the boot power supply voltage and the output pulse signal, wherein the bootstrap circuit includes a sense metal oxide semiconductor (MOS) transistor and a boot MOS transistor, wherein the sense MOS transistor includes a depression-type transistor.

Abstract: An air suspension system includes a controller that controls opening/closing of normally-closed electromagnetic switching valves constituting a control valve, a first supply/discharge switching valve, a second supply/discharge switching valve, a first tank switching valve, and a second tank switching valve. The controller controls opening/closing of the electromagnetic switching valves in an order of first control, second control, and third control. In the first control, the control valve is opened. In the second control, the first supply/discharge switching valve and the second supply/discharge switching valve are opened in an opened state of the control valve. In the third control, the control valve, the first supply/discharge switching valve, and the second supply/discharge switching valve are closed.

Abstract: A vehicle-height adjusting system includes: vehicle-height adjusting actuators each for adjusting a vehicle height for a corresponding one of wheels; a pressure medium supplier for supplying a pressure medium from a tank to each of the vehicle-height adjusting actuators; and a vehicle height adjuster for adjusting the vehicle height for each wheel. The vehicle-height adjusting actuators include a left vehicle-height adjusting actuator and a right vehicle-height adjusting actuator. The vehicle height adjuster includes a supply amount controller configured to control the pressure medium supplier such that substantially the same amount of the pressure medium is to be supplied from the tank to the left vehicle-height adjusting actuator and the right vehicle-height adjusting actuator, when at least one of the wheels is in contact with an uneven road surface.

Abstract: A vehicle-height control system includes: a fluid supply and discharge device including a compressor configured to suck fluid, and a tank configured to supply the fluid; an actuator-side passage connected to the fluid supply and discharge device; a vehicle-height control actuator provided for a wheel and connected to the actuator-side passage via a vehicle-height control valve; and a vehicle height controller configured to control a vehicle height for the wheel by controlling the fluid supply and discharge device and the vehicle-height control valve to control supply and discharge of the fluid in the vehicle-height control actuator. The vehicle height controller includes a start controller configured to open the vehicle-height control valve after establishing communication between the actuator-side passage and at least one of the tank and the compressor in a state in which the vehicle-height control valve is closed at a start of control of the vehicle height.

Abstract: A vehicle-height control system includes: a fluid supply and discharge device including a compressor device and a tank storing fluid pressurized by the compressor device; a vehicle-height control actuator corresponding to a wheel and connected to the fluid supply and discharge device; a vehicle height controller that controls a vehicle height for the wheel by controlling the fluid supply and discharge device to control supply and discharge of fluid to and from the vehicle-height control actuator; a tank pressure controller that controls a tank pressure; and a fluid supply controller that supplies the fluid to a low pressure portion by controlling the fluid supply and discharge device at start and/or termination of at least one of control executed by the vehicle height controller and control executed by the tank pressure controller. The low pressure portion is at least a portion of the fluid supply and discharge device.

Abstract: A vehicle-height control system is configured to control a vehicle height for a wheel. The vehicle-height control system includes: a vehicle-height control actuator provided so as to correspond to the wheel; a pressure-medium supply and discharge device configured to supply and discharge a pressure medium to and from the vehicle-height control actuator; and a vehicle height controller configured to control the vehicle height for the wheel by controlling the pressure-medium supply and discharge device based on an inside temperature and an outside-air temperature to control at least one of supply and discharge of the pressure medium to and from the vehicle-height control actuator. The inside temperature is a temperature in the vehicle-height control system.

Abstract: A vehicle-height control system includes: a vehicle-height control actuator; a pressure-medium supply and discharge device configured to supply and discharge a pressure medium; and a vehicle height controller configured to control a vehicle height by controlling the pressure-medium supply and discharge device. The pressure-medium supply and discharge device includes a compressor and a tank configured to contain a pressure medium supplied from the compressor. The vehicle height controller includes a down controller configured to operate the compressor to discharge and supply the pressure medium from the vehicle-height control actuator to the tank to lower the vehicle height when a tank pressure is less than a set pressure. The down controller is configured to discharge the pressure medium from the vehicle-height control actuator to an outside to lower the vehicle height when the tank pressure is greater than or equal to the set pressure.

Abstract: A vehicle-height adjustment system includes: a vehicle-height adjustment actuator provided so as to correspond to a wheel; and a pressure-medium supply and discharge device configured to supply and discharge a pressure medium to and from the vehicle-height adjustment actuator. The pressure-medium supply and discharge device includes a tank configured to store the pressure medium. The vehicle-height adjustment system includes a tank-pressure controller configured to control a tank pressure based on at least one of a vehicle height for the wheel and an inside temperature. The tank pressure is a pressure of the pressure medium stored in the tank, and the inside temperature is a temperature in the vehicle-height adjustment system.

Abstract: A vehicle-height adjusting system includes: vehicle-height adjusting actuators each for adjusting a vehicle height for a corresponding one of wheels; a pressure medium supplier for supplying a pressure medium from a tank to each of the vehicle-height adjusting actuators; and a vehicle height adjuster for adjusting the vehicle height for each wheel. The vehicle-height adjusting actuators include a left vehicle-height adjusting actuator and a right vehicle-height adjusting actuator. The vehicle height adjuster includes a supply amount controller configured to control the pressure medium supplier such that substantially the same amount of the pressure medium is to be supplied from the tank to the left vehicle-height adjusting actuator and the right vehicle-height adjusting actuator, when at least one of the wheels is in contact with an uneven road surface.

Abstract: A driver IC includes a ring-shaped termination area, and a first area and a second area that are respectively arranged outside and inside the termination area on a layout. A sense MOS that is arranged between a floating terminal and a first sense node and is driven at a power supply voltage is formed in the termination area. A fault detection circuit that detects presence of a fault when a voltage of the first sense node is higher than a decision voltage that has been determined in advance in a period of time that a low side driver is driving a low side transistor into an ON state is formed in the first area.

Abstract: An air source device includes: a tank; a compressor; an intake valve; and an ECU configured to acquire an intake amount, which is an amount of air sucked from an outside and supplied to the tank by the compressor, based on an increasing amount of a tank pressure, which is a pressure of the air accommodated in the tank, the increasing amount being an increasing amount from a time point when the intake valve is estimated to be changed from a closed state to an opened state.