Abstract: A vehicle-height control system includes: a fluid supply and discharge device including a compressor configured to suck fluid, and a tank configured to supply the fluid; an actuator-side passage connected to the fluid supply and discharge device; a vehicle-height control actuator provided for a wheel and connected to the actuator-side passage via a vehicle-height control valve; and a vehicle height controller configured to control a vehicle height for the wheel by controlling the fluid supply and discharge device and the vehicle-height control valve to control supply and discharge of the fluid in the vehicle-height control actuator. The vehicle height controller includes a start controller configured to open the vehicle-height control valve after establishing communication between the actuator-side passage and at least one of the tank and the compressor in a state in which the vehicle-height control valve is closed at a start of control of the vehicle height.

Abstract: A vehicle-height control system includes: a vehicle-height control actuator; a pressure-medium supply and discharge device configured to supply and discharge a pressure medium; and a vehicle height controller configured to control a vehicle height by controlling the pressure-medium supply and discharge device. The pressure-medium supply and discharge device includes a compressor and a tank configured to contain a pressure medium supplied from the compressor. The vehicle height controller includes a down controller configured to operate the compressor to discharge and supply the pressure medium from the vehicle-height control actuator to the tank to lower the vehicle height when a tank pressure is less than a set pressure. The down controller is configured to discharge the pressure medium from the vehicle-height control actuator to an outside to lower the vehicle height when the tank pressure is greater than or equal to the set pressure.

Abstract: A vehicle-height adjustment system includes: a vehicle-height adjustment actuator provided so as to correspond to a wheel; and a pressure-medium supply and discharge device configured to supply and discharge a pressure medium to and from the vehicle-height adjustment actuator. The pressure-medium supply and discharge device includes a tank configured to store the pressure medium. The vehicle-height adjustment system includes a tank-pressure controller configured to control a tank pressure based on at least one of a vehicle height for the wheel and an inside temperature. The tank pressure is a pressure of the pressure medium stored in the tank, and the inside temperature is a temperature in the vehicle-height adjustment system.

Abstract: A vehicle-height control system is configured to control a vehicle height for a wheel. The vehicle-height control system includes: a vehicle-height control actuator provided so as to correspond to the wheel; a pressure-medium supply and discharge device configured to supply and discharge a pressure medium to and from the vehicle-height control actuator; and a vehicle height controller configured to control the vehicle height for the wheel by controlling the pressure-medium supply and discharge device based on an inside temperature and an outside-air temperature to control at least one of supply and discharge of the pressure medium to and from the vehicle-height control actuator. The inside temperature is a temperature in the vehicle-height control system.

Abstract: A vehicle-height adjusting system includes: vehicle-height adjusting actuators each for adjusting a vehicle height for a corresponding one of wheels; a pressure medium supplier for supplying a pressure medium from a tank to each of the vehicle-height adjusting actuators; and a vehicle height adjuster for adjusting the vehicle height for each wheel. The vehicle-height adjusting actuators include a left vehicle-height adjusting actuator and a right vehicle-height adjusting actuator. The vehicle height adjuster includes a supply amount controller configured to control the pressure medium supplier such that substantially the same amount of the pressure medium is to be supplied from the tank to the left vehicle-height adjusting actuator and the right vehicle-height adjusting actuator, when at least one of the wheels is in contact with an uneven road surface.

Abstract: A driver IC includes a ring-shaped termination area, and a first area and a second area that are respectively arranged outside and inside the termination area on a layout. A sense MOS that is arranged between a floating terminal and a first sense node and is driven at a power supply voltage is formed in the termination area. A fault detection circuit that detects presence of a fault when a voltage of the first sense node is higher than a decision voltage that has been determined in advance in a period of time that a low side driver is driving a low side transistor into an ON state is formed in the first area.

Abstract: An air source device includes: a tank; a compressor; an intake valve; and an ECU configured to acquire an intake amount, which is an amount of air sucked from an outside and supplied to the tank by the compressor, based on an increasing amount of a tank pressure, which is a pressure of the air accommodated in the tank, the increasing amount being an increasing amount from a time point when the intake valve is estimated to be changed from a closed state to an opened state.

Abstract: A suspension system includes: suspensions that respectively include vehicle height control actuators; a pressure medium supply-discharge device; and a vehicle height controller configured to control the pressure medium supply-discharge device to control vehicle height, wherein a magnitude of resistance that is generated during a change in the vehicle height at one or more of the suspensions is larger than a magnitude of resistance at another one or more of the suspensions, and the vehicle height controller is configured to execute vehicle height control for the wheel that corresponds to the one or more of the suspensions with the large magnitude of the resistance prior to vehicle height control for the wheel that corresponds to the other one or more of the suspensions with the small magnitude of the resistance.

Abstract: A vehicle height adjustment system includes: a vehicle height adjustment actuator provided for each wheel of a vehicle; a pressure medium intake and exhaust device configured to supply and exhaust a pressure medium to and from the vehicle height adjustment actuator; and a vehicle height adjustment unit including a computer, the vehicle height adjustment unit configured to: adjust a vehicle height by controlling the pressure medium intake and exhaust device, the vehicle height being a distance between the wheel and a vehicle body; adjust the vehicle height when a get-in estimation condition is satisfied; and limit a number of times the vehicle height is adjusted within a set period to a number of times smaller than a set number of times.

Abstract: A driver integrated circuit includes a bootstrap circuit (BSC) configured to output a boot power supply voltage (VB) based on a first power supply voltage, the boot power supply voltage being higher than the first power supply voltage; a level shift circuit (LSC) configured to output an output pulse signal based on an input pulse signal and the boot power supply voltage; a high side driving circuit (HSU) configured to output a high side driving voltage based on the boot power supply voltage and the output pulse signal, wherein the bootstrap circuit includes a sense metal oxide semiconductor (MOS) transistor and a boot MOS transistor, wherein the sense MOS transistor includes a depression-type transistor.

Abstract: A driver IC includes a ring-shaped termination area, and a first area and a second area that are respectively arranged outside and inside the termination area on a layout. A sense MOS that is arranged between floating terminal and a first sense node and is driven at a power supply voltage is formed in the termination area. A fault detection circuit that detects presence of a fault when a voltage of the first sense node is higher than a decision voltage that has been deteLutined in advance in a period of time that a low side driver is driving a low side transistor into an ON state is formed in the first area.

Abstract: Reliability of a semiconductor device is improved. A third semiconductor chip on which a control circuit is formed, and a first semiconductor chip of a plurality of IGBT chips are electrically connected via a high-side relay board. That is, the first semiconductor chip and the third semiconductor chip are electrically connected via a first wire, a high-side relay board and a second wire. Similarly, the third semiconductor chip on which the control circuit is formed and a second semiconductor chip of a plurality of IGBT chips are electrically connected via a low-side relay board. That is, the second semiconductor chip and the third semiconductor chip are electrically connected via the first wire, the low-side relay board and the second wire.

Abstract: To improve the reliability of a semiconductor device. A chip mounting portion TAB5 is arranged to be shifted to the +x direction side. Further, a gate electrode pad of a semiconductor chip CHP1 (LV) and a pad of a semiconductor chip CHP3 are electrically coupled by a wire W1a and a wire W1b through a relay lead RL1. Likewise, a gate electrode pad of a semiconductor chip CHP1 (LW) and the pad of the semiconductor chip CHP3 are electrically coupled by a wire W1c and a wire W1d through a relay lead RL2. At this time, the structures of parts of the relay leads RL1 and RL2, which are exposed from a sealing body MR are different from the structures of respective parts exposed from the sealing body MR, of a plurality of leads LD1 and LD2 which function as external terminals.

Abstract: In order to reduce the cost and the like of a power control device including a semiconductor device such as a driver IC, as well as an electronic system, the driver IC includes a high side driver, a level shift circuit, first and second transistors, and a comparator circuit. The first transistor is formed in a termination area. The second transistor is formed in the termination region and is driven by a first power supply voltage. The comparator circuit is formed in a first region to drive the first transistor to be ON when the voltage of a sense node is lower than the first power supply voltage, while driving the first transistor to be OFF when the voltage of the sense node is higher than the first power supply voltage. The second transistor is a depression type transistor.

Abstract: A driver IC includes a ring-shaped termination area, and a first area and a second area that are respectively arranged outside and inside the termination area on a layout. A sense MOS that is arranged between a floating terminal and a first sense node and is driven at a power supply voltage is formed in the termination area. A fault detection circuit that detects presence of a fault when a voltage of the first sense node is higher than a decision voltage that has been determined in advance in a period of time that a low side driver is driving a low side transistor into an ON state is formed in the first area.

Abstract: A method of controlling a power supply to a semiconductor device including a first region having a high-side drive circuit, a second region having a signal processing circuit, a low-side drive circuit and a voltage control circuit, and a separation region formed between the first and second regions and having a rectifying element, includes turning on a first control signal to the voltage control circuit, turning off the first control signal to the voltage control circuit, and repeating the turning on of the first control signal and the turning off the first control signal.

Abstract: A semiconductor device including a first circuit region in which a first circuit whose power supply potential is a first voltage is formed; a second circuit region in which a second circuit whose power supply potential is a second voltage lower than the first voltage is formed a separation region which separates the first circuit region from the second circuit region; and a transistor which is located in the separation region and couples the second circuit to the first circuit and whose source and drain are of a first conductivity type, the separation region including an element separation film; a first field plate which overlaps with the element separation film in plan view; a plurality of conductive films which are provided over the first field plate.

Abstract: A field plate electrode is repetitively disposed in a folded manner or a spiral shape in a direction along an edge of a first circuit region. A coupling transistor couples a first circuit to a second circuit lower in supply voltage than the first circuit. A second conductivity type region is disposed around the coupling transistor. A part of the field plate electrode partially overlaps with the second conductivity type region. The field plate electrode is electrically coupled to a drain electrode of the coupling transistor at a portion located on the first circuit region side from a center thereof in a width direction of the separation region. A ground potential or a power potential of the second circuit is applied to the field plate electrode at a portion located on the second conductivity type region side from the center.

Abstract: To prevent a current leak in an impurity region surrounding a transistor, in a region where a portion, of a second conductivity type region, extending from a first circuit region side toward a second circuit region side and an element separation film overlap each other in plan view, a field plate and conductive films are provided alternately from the first circuit region side toward the second circuit region side in plan view. Further, in this region, there is a decrease in the potential of the field plate and the potentials of the conductive films from the first circuit region toward the second circuit region. Further, at least one of the conductive films has a potential lower than the potential of the field plate adjacent to the conductive film on the second circuit region side in plan view. Further, this conductive film covers at least a part of the second conductivity type region without space in the extension direction of the second conductivity type region.

Abstract: Provided is a semiconductor device including a substrate of a first conductivity type, a first circuit region, a separation region, a second circuit region, and a rectifying element. The rectifying element has a second conductivity type layer, a first high concentration second conductivity type region, a second high concentration second conductivity type region, an element isolation film, a first insulation layer, and a first conductive film. A first contact is coupled to the first high concentration second conductivity type region, and a second contact is coupled to the second high concentration second conductivity type region. A third contact is coupled to the first conductive film. The first contact, the second contact and the third contact are separated from each other.