Abstract: A method for fabricating a semiconductor-mounting body having at least one semiconductor device mounted on a substrate and a sealing resin set in the gap between the substrate and the semiconductor device, has a first step of setting a flexibly deformable sheet on a face of the semiconductor device not facing the substrate; and a second step of generating an air-pressure difference between the side where the semiconductor device is not present and the side where the semiconductor device is present on the basis of the sheet so that the air pressure at the side where the semiconductor device is not present becomes higher than the side where the semiconductor device is present and pressurizing the semiconductor device by the sheet after the first step.

Abstract: Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This composite material comprises a metal and an inorganic compound formed to have a dendritic shape or a bar shape. In particular, this composite material is a copper composite material, which comprises 10 to 55 vol. % cuprous oxide (Cu2O) and the balance of copper (Cu) and incidental impurities and has a coefficient of thermal expansion in a temperature range from a room temperature to 300° C. of from 5×10−6 to 17×10−6/° C. and a thermal conductivity of 100 to 380 W/m·k. This composite material can be produced by a process comprising the steps of melting, casting and working and is applied to a heat-radiating board of a semiconductor article.

Abstract: A production process for a vinyl-based polymer is provided. The production process comprises a step for polymerizing a vinyl-based monomer by a radical reaction within an aqueous medium in a polymerization vessel, and a step for supplying a reaction inhibitor with a melting point of no more than 40° C. from a reaction inhibitor supply tank to the polymerization vessel via a reaction inhibitor supply pipe. The reaction inhibitor supply tank and the reaction inhibitor supply pipe are heated, and the reaction inhibitor is added to the polymerization vessel in a liquid state with a viscosity of no more than 200 mPa·s. The reaction inhibitor can be added to the polymerization mixture without the use of an organic solvent even at low temperatures, and problems such as the solidification of the reaction inhibitor inside the supply tank or piping, and subsequent blocking of the piping do not occur.

Abstract: It is an object of the present invention to provide a composite material having low thermal expansivity, high thermal conductivity, and good plastic workability, which is applied to semiconductor devices and many other uses.

Abstract: It is an object of the present invention to provide a composite material having low thermal expansivity, high thermal conductivity, and good plastic workability, which is applied to semiconductor devices and many other uses.

Abstract: A method of manufacturing a separator for a polymer electrolyte fuel cell in which the specific resistance is small, and the coefficient of thermal conductivity and the gas shielding property are high and have high strength. The sintering material comprises a phenol resin coated to the surface of a powder of carbon, and the plate is a metallic plate having plating on both surfaces. After the metallic plate is arranged in a mold provided with grooves, the sintering material is filled to both sides of the metallic plate, and then they are heated and sintered. The separator for a fuel cell becomes homogeneous, and, as a result, the gas shielding property rises with high strength, because phenol resin has been uniformly distributed in the sintering material. Moreover, because oxides are not generated on the surfaces of the separator by sintering, the specific resistance will be relatively small.

Abstract: A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.

Abstract: A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.

Abstract: A multilayer ceramic substrate includes a glass ceramic body, a conductive pattern, and a via conductor. The conductive pattern is formed in the glass ceramic body and on at least one principal surface of the glass ceramic body. The via conductor makes a connection between the predetermined conductive patterns. The via conductor includes a conductive material and a Mo compound or a Mo metal. The conductive material includes at least one selected from the group consisting of Ag, Au, Pt and Pd as a main component. The amount of Mo compound or Mo metal is in the range of 0.05 to 10 parts by weight in terms of Mo metal with respect to 100 parts by weight of the conductive material. This multilayer ceramic substrate can achieve sufficient flatness and high dimensional accuracy, while preventing defects that occurs in the vicinity of electrodes after firing.

Abstract: A power converter includes a shunt resistor constituted by a shunt resistance and a plurality of main electrodes made of a sheet-like resistive material. In the shunt resistor, plates lower in volume electric resistivity than the resistive material, higher in thermal conductivity than the resistive material and thicker in thickness than the resistive material are fixedly attached by solder, to the side surfaces of the main electrodes opposite to the side surfaces with which the main electrodes are fixedly attached to an insulating layer. At least one plate main electrode for electrically connecting with main circuit wiring is provided in each of the plates. At least one constricted portion is formed between each of the plate main electrodes and the shunt resistance. Plate detection electrodes for detecting a voltage between the opposite ends of the shunt resistance is provided on the plates near the shunt resistance portion.

Abstract: A fault detection system detecting malfunctions or deteriorations, which may result in an inverter fault, is provided. The system has a temperature sensor installed on a semiconductor module to monitor a temperature rise rate. It is judged that an abnormal condition has occurred if the thermal resistance is increased by the deterioration of a soldering layer of the semiconductor module or by drive circuit malfunctions and, as a result, the relation between an operation mode and the temperature rise rate falls outside a predetermined range.

Abstract: A fault detection system detecting malfunctions or deteriorations, which may result in an inverter fault, is provided. The system has a temperature sensor installed on a semiconductor module to monitor a temperature rise rate. It is judged that an abnormal condition had occurred if the thermal resistance is increased by the deterioration of a soldering layer of the semiconductor module or by drive circuit malfunctions and, as a result, the relation between an operation mode and the temperature rise rate falls outside a predetermined range.

Abstract: According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water channel and directly cooling the power semiconductor modules using this shallow water channel. Since cooling water flows fast in the shallow water channel, it is possible to improve a cooling efficiency and also reduce pressure loss using a deep water channel with deep cavities. Furthermore, providing a plurality of cavities makes it possible to reduce a size of the power semiconductor modules and provide a plurality of power semiconductor modules, thus improving reliability. It is possible to place a control board below the water channel to thermally cut off the control board from the power semiconductor modules, which makes it possible to reduce temperature of a control circuit.

Abstract: According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water channel and directly cooling the power semiconductor modules using this shallow water channel. Since cooling water flows fast in the shallow water channel, it is possible to improve a cooling efficiency and also reduce pressure loss using a deep water channel with deep cavities. Furthermore, providing a plurality of cavities makes it possible to reduce a size of the power semiconductor modules and provide a plurality of power semiconductor modules, thus improving reliability. It is possible to place a control board below the water channel to thermally cut off the control board from the power semiconductor modules, which makes it possible to reduce temperature of a control circuit.

Abstract: A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.

Abstract: A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.

Abstract: A power converter includes a shunt resistor constituted by a shunt resistance and a plurality of main electrodes made of a sheet-like resistive material. In the shunt resistor, plates lower in volume electric resistivity than the resistive material, higher in thermal conductivity than the resistive material and thicker in thickness than the resistive material are fixedly attached by solder, to the side surfaces of the main electrodes opposite to the side surfaces with which the main electrodes are fixedly attached to an insulating layer. At least one plate main electrode for electrically connecting with main circuit wiring is provided in each of the plates. At least one constricted portion is formed between each of the plate main electrodes and the shunt resistance. Plate detection electrodes for detecting a voltage between the opposite ends of the shunt resistance is provided on the plates near the shunt resistance portion.

Abstract: The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said electric insulating material is a bismuth glass layer.

Abstract: The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said electric insulating material is a bismuth glass layer.

Abstract: A method for fabricating a semiconductor-mounting body having at least one semiconductor device mounted on a substrate and a sealing resin set in the gap between the substrate and the semiconductor device, has