Abstract: A semiconductor package may include first semiconductor chips disposed in a rotationally symmetrical structure. First bonding pads are arranged over the bottom surfaces of the first semiconductor chips. The semiconductor package may also include a first encapsulation member formed to surround at least side surfaces of the first semiconductor chips. The semiconductor package may also include via patterns formed in the first encapsulation member. The semiconductor package may also include second semiconductor chips stacked over top surfaces of the first semiconductor chips and the first encapsulation member including the via patterns in such a way as to form step shapes with the first semiconductor chips. Second bonding pads electrically connected to the via patterns are arranged over bottom surfaces of the second semiconductor chips.

Abstract: A semiconductor package may include a first semiconductor chip having a plurality of first bonding pads arranged at a first pitch on a first active surface. The semiconductor package may include one or more reconfigurable package units each including a second semiconductor chip having a plurality of second bonding pads arranged at a second pitch on a second active surface; a semiconductor chip connector arranged spaced apart from the second semiconductor chip and having a plurality of through vias arranged at the first pitch; a molding layer surrounding side surfaces of the second semiconductor chip and the semiconductor chip connector; and redistribution lines formed over the second semiconductor chip, the semiconductor chip connector, and the molding layer.

Abstract: A data processing device includes a compression circuit and a padding circuit. The compression circuit is configured to compare pairs of two contiguous bits within data composed of 2n bits (where n is a natural number), and compress the data based on a result of the comparison. The padding circuit is configured to generate transmission data of 2n bits by padding the compressed data with a dummy pad.

Abstract: A semiconductor device may include a bottom package embedded with a first semiconductor chip. The semiconductor device may include a middle package stacked over the bottom package, and embedded with at least two second semiconductor chips in a fan-out structure. The semiconductor device may include a top package stacked over the middle package, and embedded with at least two third semiconductor chips.

Abstract: A data processing apparatus includes a controller configured to provide, using a unified connector, group data processing information for a processing operation of a data group processed based on the same data processing information. The data group comprises a plurality data transmitted or received through a plurality of connectors. An operation unit is configured to decode and/or encode the data group based on the group data processing information.

Abstract: A method for preparing buckwheat noodles capable of preparing noodles using only 100% pure buckwheat includes a soaking step of soaking buckwheat grain in water at room temperature, a heating step of boiling the buckwheat grain undergoing the soaking step, a husk separation step of separating the buckwheat grain undergoing the heating step into endosperm and husks and adding salt water to the endosperm, a kneading and aging step of kneading and aging the endosperm with which the salt water is mixed through the husk separation step to make dough, a noodle making step of making buckwheat noodles by extruding the dough through a noodle-making machine, a reheating step of reheating the buckwheat noodles prepared through the noodle making step by steaming, and a cooling and drying step of cooling and drying the reheated buckwheat noodles.

Abstract: Disclosed herein is a pattern safety device for preventing interference between patterns. In detail, a separately partitioned space is defined in an adhesion portion, which is formed on a plurality of patterns on the surface of a substrate so that a circuit element is placed on the adhesion portion, thus preventing interference between the patterns.

Abstract: A stacked package including: a semiconductor substrate, a circuit layer formed over the semiconductor substrate, a bump formed over the circuit layer, a spare bump formed correspondingly to the bump and over the circuit layer, and configured for replacing the bump with the spare bump, a through electrode configuring to pass through the semiconductor substrate on a same line as the bump and electrically coupled the bump or the spare bump in response to a selection signal, and a spare through electrode configured to pass through the semiconductor substrate on a same line as the spare bump and electrically coupled with the bump or the spare bump in response to a selection signal. When a bump has failed, a vertical input/output line of the semiconductor chips is established by a spare bump corresponding to the failed bump through the selective signal routing.

Abstract: The semiconductor device includes: a first die configured to include a first input pad and a first output pad; and a second die configured to include a second input pad and a second output pad. The second die corrects a level of an output voltage in response to a feedback reference voltage applied from the first output pad to the second input pad.

Abstract: A nonvolatile memory device includes a substrate, an elongate isolation region including a field insulation film disposed in a trench in the substrate, and a word line crossing the insulation region and including a tunneling insulation layer on an active region of the substrate adjacent the isolation region, a charge storage layer on the tunneling insulation layer and a blocking insulation layer on the charge storage layer. A first plane index of a bottom surface of the trench has a first interface trap density and a second plane index of a sidewall of the trench has a second interface trap density equal to or less than the first interface trap density. In some embodiments, the first plane index may be (100) and the second plane index may be (100) or (310).

Abstract: The semiconductor device includes: a first die configured to include a first input pad and a first output pad; and a second die configured to include a second input pad and a second output pad. The second die corrects a level of an output voltage in response to a feedback reference voltage applied from the first output pad to the second input pad.

Abstract: A display apparatus is provided. The display apparatus includes a liquid crystal display panel configured to display an image; a backlight unit located at the rear of the liquid crystal display panel, and including a plurality of light sources; a bottom chassis in which the backlight unit is positioned; and a reflector located in the bottom chassis, and configured to forwardly reflect light emitted from the plurality of light sources toward the liquid crystal display panel; and a reflection angle adjuster located in each corner of the reflector, and configured to reflect light emitted from the plurality of light sources in order to cause the reflected light to be incident toward corner areas of the liquid crystal display panel.

Abstract: A method and chipset for tracking a global navigation satellite system (GNSS) within the constraints of an indoor facility. The method includes receiving assistance information on the GNSS on a mobile communication system; and sorting orbiting satellites within the GNSS by elevation angles. Additionally, lower elevation satellites are correlated within the GNSS prior to correlating higher elevation satellites.

Abstract: A liquid crystal display apparatus according to an exemplary embodiment of the present inventive concept is provided the liquid crystal display apparatus includes a liquid crystal panel which displays images; backlight unit which provides light to the liquid crystal panel; and an optical sheet unit which is placed between the liquid crystal panel and backlight, wherein the optical sheet unit includes at least one scattering particle optical sheet where scattering particles are provided.

Abstract: A semiconductor package includes a first substrate, a plurality of memory chips horizontally disposed on the first substrate, and having one surfaces which face the first substrate, other surfaces which face away from the one surfaces, and first bumps formed on the other surfaces, a second substrate disposed on the plurality of memory chips and electrically connected, a sub-substrate horizontally disposed on the first substrate together with the plurality of memory chips and electrically connecting the first substrate and the second substrate, and a driving chip having second bumps on one surface thereof and mounted to the second substrate such that the second bumps are electrically connected with the second substrate.

Abstract: A data processing device includes a controller. The controller includes a compression circuit configured to compare a plurality of data groups, each of which has a first burst length and is transmitted in units of an input/output width, with a predetermined pattern, and perform data compression on the data groups based on a result of comparison. The controller further includes a compression data restructuring circuit configured to generate a transmission data group by restructuring the compressed data group to have a second burst length.

Abstract: A data processing device includes a compression circuit and a padding circuit. The compression circuit is configured to compare pairs of two contiguous bits within data composed of 2n bits (where n is a natural number), and compress the data based on a result of the comparison. The padding circuit is configured to generate transmission data of 2n bits by padding the compressed data with a dummy pad.

Abstract: A data processing apparatus includes a controller configured to provide, using a unified connector, group data processing information for a processing operation of a data group processed based on the same data processing information. The data group comprises a plurality data transmitted or received through a plurality of connectors. An operation unit is configured to decode and/or encode the data group based on the group data processing information.

Abstract: Disclosed is a method of saccharifying biomass, such as algae or agricultural by-products by performing a high-pressure extrusion pulverization process for the biomass, such as algae or agricultural by-products, and more particularly to a method of saccharifying biomass, which includes homogenizing and crushing algae or agricultural by-products, and extruding the algae or agricultural by-products through a micro-diameter tube to pulverize the algae or agricultural by-products. Non-biodegradable polymers, such as cellulose, which is a polysaccharide included in biomass, such as algae or agricultural by-products, hemicelluloses, starch, and complex polysaccharide, are hydrolyzed at high glycosylation efficiency through an eco-friendly pretreatment process using water.