Abstract: A semiconductor device includes a first device region including a plurality of source regions and a plurality of drain regions of first conductivity type transistors, a plurality of loop-shaped gate electrode regions of the first conductivity type transistors, a second device region including a plurality of source regions and a plurality of drain regions of a second conductivity type transistors, a plurality of loop-shaped gate electrode regions of the second conductivity type transistors, a first wiring configured to supply a first voltage to at least one of the source regions of the first device region, a second wiring configured to supply a second voltage to at least one of the source regions of the second device region, and a third wiring electrically coupled to the drain regions of the first and second device regions and to the gate electrode regions of the first and the second conductivity type transistors.

Abstract: A semiconductor device comprising a multi Fin-FET structure capable of suppressing short channel effects, controlling a threshold voltage, driving a high current, and operating in a high-speed comprises a source region and a drain region disposed on a semiconductor substrate, a plurality of fins interconnecting the source region and drain region, a first gate electrode disposed on the semiconductor substrate and to one side face of each fin, a second gate electrode disposed on the semiconductor substrate and to the other side face of the fin to face the first gate electrode, and separated from the first gate electrode, a plurality of first pad electrodes connected to respective first gate electrode, a first wiring interconnecting the plurality of first pad electrodes, a plurality of second pad electrodes connected to respective second gate electrode, and a second wiring interconnecting the plurality of second pad electrodes.

Abstract: A semiconductor device includes a semiconductor substrate, a channel region formed above the semiconductor substrate, a first gate electrode formed above the channel region via a first gate insulating film, a second gate electrode formed below the channel region via a second gate insulating film to face the first gate electrode, a first insulating film covering side surfaces of the second gate electrode, a second insulating film covering a bottom surface of the second gate electrode, and a semiconductor layer which has an upper surface positioned above an upper surface of the first gate insulating film and side surfaces facing side surfaces of the first gate electrode, and in which a source region and drain region are formed. The side surfaces of the second gate electrode are aligned with or positioned inside the side surfaces of the semiconductor layer.

Abstract: In one aspect of the present invention, a semiconductor device A semiconductor device may include a SRAM cell having a first inverter, a second inverter, a first transfer transistor and a second transistor, the first inverter having a first load transistor and a first driver transistor connected to the first load transistor, the second inverter having a second load transistor and a second driver transistor connected to the second load transistor, a voltage supplying circuit configured to supply a voltage to one of the terminals of the first driver transistor and one of the terminals of the second driver transistor, the voltage which is one of more than a GND voltage and less than a GND voltage.

Abstract: In one aspect of the present invention, a semiconductor device may include a Si substrate, a gate electrode provided on the semiconductor via a gate dielectric layer, a first epitaxially grown layer provided on the Si substrate, a channel region provided in the Si substrate below the gate electrode, a source/drain region provided in the first epitaxially grown layer sandwiching the channel region, and having a first conductivity type impurity, a second epitaxially grown layer provided between the channel region and the first epitaxially grown layer, and provided below the gate electrode, and having a second conductivity type impurity opposite to the first conductivity type.

Abstract: In a semiconductor device, source/drain layers have a low resistivity region and an extension region extending from the low resistivity region toward the channel region. The extension regions are lower in impurity concentration and shallower in depth than the low resistivity regions. The device also has a first impurity-doped layer formed in the channel region between the source/drain layers, a second impurity-doped layer formed under the first impurity-doped layer, and a third impurity-doped layer formed under the second impurity-doped layer. The first impurity-doped layer is equal or less in junction depth than the extension regions. The second impurity doped layer has impurity concentration and thickness to be fully depleted due to a built-in potential as created between the first and third impurity-doped layers.

Abstract: A semiconductor device according to one embodiment of the present invention includes: a fin including a buffer layer made of SiGe and formed on a Si layer, and a SiGe layer formed on the buffer layer, the SiGe layer having a Ge concentration corresponding to a Ge concentration of the buffer layer in an interface between the buffer layer and the SiGe layer; a gate electrode formed on a side face of the fin through a gate insulating film; a channel region formed in a region within the fin facing the gate electrode through the gate insulating film, the channel region being selectively provided within the SiGe layer of the buffer layer and the SiGe layer included in the fin; and a source region and a drain region formed within the fin, the channel region being formed between the source region and the drain region.

Abstract: A semiconductor device includes a support substrate, a buried insulation film, provided on the support substrate, having a thickness of 5 to 10 nm, a silicon layer provided on the buried insulation film, a MOSFET provided in the silicon layer, and a triple-well region provided in the support substrate under the MOSFET.

Abstract: A semiconductor integrated circuit device comprises a first transistor formed on a bulk substrate region in a semiconductor substrate and having a source or drain layer connected to a first reference voltage; and a second transistor including an impurity layer region formed on the bulk substrate region and being of a conductivity type different from that of the bulk substrate region, a semiconductor region formed on the impurity layer region and being of a conductivity type the same as that of the bulk substrate region, a source layer and a drain layer formed in the semiconductor region and being of a conductivity type different from that of the bulk substrate region, a gate insulating film provided between the source layer and the drain layer and formed on the semiconductor region, a gate electrode formed on the gate insulating film, and a body region surrounded by the source layer, the drain layer, the impurity layer region, and the gate insulating film on a section along a source-drain direction and being

Abstract: The disclosure concerns a method of manufacturing a semiconductor device including forming a plurality of fins made of a semiconductor material on an insulating layer; forming a gate insulating film on side surfaces of the plurality of fins; and forming a gate electrode on the gate insulating film in such a manner that a compressive stress is applied to a side surface of a first fin which is used in an NMOSFET among the plurality of fins in a direction perpendicular to the side surface and a tensile stress is applied to a side surface of a second fin which is used in a PMOSFET among the plurality of fins in a direction perpendicular to the side surface.

Abstract: A semiconductor memory having a plurality of static random access memory cells, word lines, first and second bit lines orthogonal to the word lines, and threshold voltage control lines parallel to the word lines and each of the static random access memory cell includes the first and the second driver transistors, the first and the second load transistors, and the first and the second transfer transistors configured by Fin field effect transistors, and at least one of the Fin field effect transistors is configured by a separated-gate type double-gate field effect transistor comprising a first gate electrode and a second gate electrode and controlling a voltage for the first gate electrode to form a channel, and controlling a voltage for the second gate electrode to decrease a threshold voltage at the time of writing data.

Abstract: A semiconductor device includes a semiconductor substrate, a channel region formed above the semiconductor substrate, a first gate electrode formed above the channel region via a first gate insulating film, a second gate electrode formed below the channel region via a second gate insulating film to face the first gate electrode, a first insulating film covering side surfaces of the second gate electrode, a second insulating film covering a bottom surface of the second gate electrode, and a semiconductor layer which has an upper surface positioned above an upper surface of the first gate insulating film and side surfaces facing side surfaces of the first gate electrode, and in which a source region and drain region are formed. The side surfaces of the second gate electrode are aligned with or positioned inside the side surfaces of the semiconductor layer.

Abstract: A semiconductor integrated circuit device comprises a first transistor formed on a bulk substrate region in a semiconductor substrate and having a source or drain layer connected to a first reference voltage; and a second transistor including an impurity layer region formed on the bulk substrate region and being of a conductivity type different from that of the bulk substrate region, a semiconductor region formed on the impurity layer region and being of a conductivity type the same as that of the bulk substrate region, a source layer and a drain layer formed in the semiconductor region and being of a conductivity type different from that of the bulk substrate region, a gate insulating film provided between the source layer and the drain layer and formed on the semiconductor region, a gate electrode formed on the gate insulating film, and a body region surrounded by the source layer, the drain layer, the impurity layer region, and the gate insulating film on a section along a source-drain direction and being

Abstract: A first electrode is formed on a semiconductor substrate. A second electrode is formed separately at a predetermined interval from the first electrode, and has at least one opening. An actuator layer is connected to the second electrode, and drives the second electrode.

Abstract: A semiconductor device includes a first device region including a plurality of source regions and a plurality of drain regions of first conductivity type transistors, a plurality of loop-shaped gate electrode regions of the first conductivity type transistors, a second device region including a plurality of source regions and a plurality of drain regions of a second conductivity type transistors, a plurality of loop-shaped gate electrode regions of the second conductivity type transistors, a first wiring configured to supply a first voltage to at least one of the source regions of the first device region, a second wiring configured to supply a second voltage to at least one of the source regions of the second device region, and a third wiring electrically coupled to the drain regions of the first and second device regions and to the gate electrode regions of the first and the second conductivity type transistors.

Abstract: There is provided a MISFET which suppresses a short-channel effect in a deep submicron region and has a low parasitic resistance, a low parasitic capacitance, and a small drain junction leakage current. A shallow concave is formed in a channel forming portion and an extension region forming portion of a MISFET, shallow ion implantation for forming an extension region is performed to a bottom surface of the shallow concave. Deep ion implantation for forming a source/drain region is performed to a silicon substrate adjacent to the concave, and the position of a peak concentration of the shallow ion implantation is caused to coincide with the position of a peak concentration of the deep ion implantation, so that a MISFET which suppresses a short-channel effect and has a low source/drain parasitic resistance, a low source/drain parasitic capacitance, and a small drain junction leakage current generated by SALICIDE steps can be provided.

Abstract: An aspect of the present invention provides a semiconductor device that includes a first transistor including a source region, a drain region provided in the same device region as the source region, and a loop-shaped gate electrode region, and a second transistor sharing, with the first transistor, the loop-shaped gate electrode region and the source region or the drain region.

Abstract: A semiconductor integrated circuit device comprises a first transistor formed on a bulk substrate region in a semiconductor substrate and having a source or drain layer connected to a first reference voltage; and a second transistor including an impurity layer region formed on the bulk substrate region and being of a conductivity type different from that of the bulk substrate region, a semiconductor region formed on the impurity layer region and being of a conductivity type the same as that of the bulk substrate region, a source layer and a drain layer formed in the semiconductor region and being of a conductivity type different from that of the bulk substrate region, a gate insulating film provided between the source layer and the drain layer and formed on the semiconductor region, a gate electrode formed on the gate insulating film, and a body region surrounded by the source layer, the drain layer, the impurity layer region, and the gate insulating film on a section along a source-drain direction and being

Abstract: A semiconductor device comprising a multi Fin-FET structure capable of suppressing short channel effects, controlling a threshold voltage, driving a high current, and operating in a high-speed comprises a source region and a drain region disposed on a semiconductor substrate, a plurality of fins interconnecting the source region and drain region, a first gate electrode disposed on the semiconductor substrate and to one side face of each fin, a second gate electrode disposed on the semiconductor substrate and to the other side face of the fin to face the first gate electrode, and separated from the first gate electrode, a plurality of first pad electrodes connected to respective first gate electrode, a first wiring interconnecting the plurality of first pad electrodes, a plurality of second pad electrodes connected to respective second gate electrode, and a second wiring interconnecting the plurality of second pad electrodes.

Abstract: A Fin-FET includes a support substrate, a buried insulation film provided on the support substrate, a fin part provided on the buried insulation film, the fin part being formed of a silicon layer and having mutually opposed side surfaces, and a gate electrode provided via an insulation film so as to cover at least a part of the side surfaces, wherein the gate electrode is provided to cover the part of the side surfaces of the fin part from a position lower than an interface between the support substrate and the buried oxide film.