Patents by Inventor Satoshi Sakai

Satoshi Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020061968
    Abstract: The present invention relates to an adhesive resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic, the thermoplastic resin (B) having a melting point ranging from 90° C. to 200° C. The present invention also relates to a method for separating a bonded article into adherends, the method comprising detaching by induction heating the bonded portions of adherends bonded together by the thermoplastic resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic substance and has a melting point ranging from 90° C. to 200° C.
    Type: Application
    Filed: September 25, 2001
    Publication date: May 23, 2002
    Applicant: TOYO BOSEKI KABUSHIKI KAISHA
    Inventors: Nori Yoshihara, Kenji Ohama, Satoshi Sakai, Hitoshi Kosugi, Koji Nakanishi
  • Publication number: 20020009898
    Abstract: A method for fabricating a semiconductor integrated circuit device of the invention comprises feeding oxidation species containing a low concentration of water, which is generated from hydrogen and oxygen by the catalytic action, to the main surface of or in the vicinity of a semiconductor wafer, and forming a thin oxide film serving as a gate insulating film of an MOS transistor and having a thickness of 5 nm or below on the main surface of the semiconductor wafer at an oxide film-growing rate sufficient to ensure fidelity in formation of an oxide film and uniformity in thickness of the oxide film.
    Type: Application
    Filed: August 28, 2001
    Publication date: January 24, 2002
    Inventors: Yoshikazu Tanabe, Satoshi Sakai, Nobuyoshi Natsuaki
  • Publication number: 20020004315
    Abstract: A method for fabricating a semiconductor integrated circuit device of the invention comprises feeding oxidation species containing a low concentration of water, which is generated from hydrogen and oxygen by the catalytic action, to the main surface of or in the vicinity of a semiconductor wafer, and forming a thin oxide film serving as a gate insulating film of an MOS transistor and having a thickness of 5 nm or below on the main surface of the semiconductor wafer at an oxide film-growing rate sufficient to ensure fidelity in formation of an oxide film and uniformity in thickness of the oxide film.
    Type: Application
    Filed: August 28, 2001
    Publication date: January 10, 2002
    Inventors: Yoshikazu Tanabe, Satoshi Sakai, Nobuyoshi Natsuaki
  • Patent number: 6327514
    Abstract: A computer program is provided for developing a bend model of a part to be produced at an intelligent production facility. In accordance with an aspect of the disclosed program, faces of the part are detected based on initial part information, and bendlines of the part are identified based on the detected faces of the part. Further, additional part information is generated by performing a predetermined operation (e.g., a folding operation or an unfolding operation) on the detected faces of the part. The disclosed program also includes other capabilities, such as the capability to perform clean-up operations on initial, 2-D part information and to selectively eliminate part thickness representations in order to facilitate the preparation of a 3-D representation of the part from the modified 2-D part information.
    Type: Grant
    Filed: July 26, 1999
    Date of Patent: December 4, 2001
    Assignee: Amadasoft America, Inc.
    Inventors: Kensuke Hazama, Kalev Kask, Satoshi Sakai, Moshe Schwalb
  • Publication number: 20010010975
    Abstract: A method for fabricating a semiconductor integrated circuit device of the invention comprises feeding oxidation species containing a low concentration of water, which is generated from hydrogen and oxygen by the catalytic action, to the main surface of or in the vicinity of a semiconductor wafer, and forming a thin oxide film serving as a gate insulating film of an MOS transistor and having a thickness of 5 nm or below on the main surface of the semiconductor wafer at an oxide film-growing rate sufficient to ensure fidelity in formation of an oxide film and uniformity in thickness of the oxide film.
    Type: Application
    Filed: January 3, 2001
    Publication date: August 2, 2001
    Inventors: Yoshikazu Tanabe, Satoshi Sakai, Nobuyoshi Natsuaki
  • Publication number: 20010009813
    Abstract: A method for fabricating a semiconductor integrated circuit device of the invention comprises feeding oxidation species containing a low concentration of water, which is generated from hydrogen and oxygen by the catalytic action, to the main surface of or in the vicinity of a semiconductor wafer, and forming a thin oxide film serving as a gate insulating film of an MOS transistor and having a thickness of 5 nm or below on the main surface of the semiconductor wafer at an oxide film-growing rate sufficient to ensure fidelity in formation of an oxide film and uniformity in thickness of the oxide film
    Type: Application
    Filed: January 3, 2001
    Publication date: July 26, 2001
    Inventors: Yoshikazu Tanabe, Satoshi Sakai, Nobuyoshi Natsuaki
  • Publication number: 20010006853
    Abstract: A method for fabricating a semiconductor integrated circuit device of the invention comprises feeding oxidation species containing a low concentration of water, which is generated from hydrogen and oxygen by the catalytic action, to the main surface of or in the vicinity of a semiconductor wafer, and forming a thin oxide film serving as a gate insulating film of an MOS transistor and having a thickness of 5 nm or below on the main surface of the semiconductor wafer at an oxide film-growing rate sufficient to ensure fidelity in formation of an oxide film and uniformity in thickness of the oxide film.
    Type: Application
    Filed: January 3, 2001
    Publication date: July 5, 2001
    Inventors: Yoshikazu Tanabe, Satoshi Sakai, Nobuyoshi Natsuaki
  • Patent number: 6239041
    Abstract: A method for fabricating a semiconductor integrated circuit device of the invention comprises feeding oxidation species containing a low concentration of water, which is generated from hydrogen and oxygen by the catalytic action, to the main surface of or in the vicinity of a semiconductor wafer, and forming a thin oxide film serving as a gate insulating film of an MOS transistor and having a thickness of 5 nm or below on the main surface of the semiconductor wafer at an oxide film-growing rate sufficient to ensure fidelity in formation of an oxide film and uniformity in thickness of the oxide film.
    Type: Grant
    Filed: September 7, 1999
    Date of Patent: May 29, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Yoshikazu Tanabe, Satoshi Sakai, Nobuyoshi Natsuaki
  • Patent number: 6224051
    Abstract: It is an object of the present invention to prevent a sheet of continuous-form paper from slackening when it is fed back in a printer capable of feeding both sheets of continuous-form paper and cut-form paper.
    Type: Grant
    Filed: April 14, 2000
    Date of Patent: May 1, 2001
    Assignee: PFU Limited
    Inventors: Takumi Nakayama, Hironaga Hongawa, Masashi Matsumoto, Hirohito Mukaiyama, Hitoshi Asai, Mitsuru Shimono, Satoshi Sakai, Yasuhiro Matsue
  • Patent number: 6219586
    Abstract: An apparatus and method is provided for managing and distributing design and manufacturing information throughout a factory in order to facilitate the production of components, such as bent sheet metal components. In accordance with an aspect of the present invention, the management and distribution of critical design and manufacturing information is achieved by storing and distributing the design and manufacturing information associated with each job. By replacing the traditional paper job set-up or work sheet with, for example, an electronically stored job sheet that can be accessed instantaneously from any location in the factory, the present invention improves the overall efficiency of the factory. In addition, through the various aspects and features of the invention, the organization and accessibility of part information and stored expert knowledge is improved.
    Type: Grant
    Filed: August 20, 1999
    Date of Patent: April 17, 2001
    Assignee: Amadasoft America, Inc.
    Inventor: Satoshi Sakai
  • Patent number: 6212441
    Abstract: An apparatus and method is provided for managing and distributing design and manufacturing information throughout a factory in order to facilitate the production of components, such as bent sheet metal components. In accordance with an aspect of the present invention, the management and distribution of critical design and manufacturing information is achieved by storing and distributing the design and manufacturing information associated with each job. By replacing the traditional paper job set-up or work sheet with, an electronically stored job sheet that can be accessed instantaneously from any location in the factory, the present invention improves the overall efficiency of the factory. In addition, through the various aspects and features of the invention, the organization and accessibility of part information and stored expert knowledge is improved.
    Type: Grant
    Filed: January 14, 1998
    Date of Patent: April 3, 2001
    Assignee: Amadasoft America, Inc.
    Inventors: Kensuke Hazama, Kalev Kask, Satoshi Sakai, Anand Heriharan Subbaraman
  • Patent number: 6185476
    Abstract: An apparatus and method is provided for managing and distributing design and manufacturing information throughout a factory in order to facilitate the production of components, such as bent sheet metal components. In accordance with an aspect of the present invention, the management and distribution of critical design and manufacturing information is achieved by storing and distributing the design and manufacturing information associated with each job. By replacing the traditional paper job set-up or work sheet with, for example, an electronically stored job sheet that can be accessed instantaneously from any location in the factory, the present invention improves the overall efficiency of the factory. In addition, through the various aspects and features of the invention, the organization and accessibility of part information and stored expert knowledge is improved.
    Type: Grant
    Filed: June 8, 1998
    Date of Patent: February 6, 2001
    Assignee: Amada Soft America, Inc.
    Inventor: Satoshi Sakai
  • Patent number: 6065857
    Abstract: An apparatus and method is provided for managing and distributing design and manufacturing information throughout a factory in order to facilitate the production of components, such as bent sheet metal components. In accordance with an aspect of the present invention, the management and distribution of critical design and manufacturing information is achieved by storing and distributing the design and manufacturing information associated with each job. By replacing the traditional paper job set-up or work sheet with, for example, an electronically stored job sheet that can be accessed instantaneously from any location in the factory, the present invention improves the overall efficiency of the factory. In addition, through the various aspects and features of the invention, the organization and accessibility of part information and stored expert knowledge is improved.
    Type: Grant
    Filed: September 25, 1998
    Date of Patent: May 23, 2000
    Assignee: Amadasoft America, Inc.
    Inventors: Kensuke Hazama, Yearn-Tzuo Hwang, Satoshi Sakai
  • Patent number: 6040110
    Abstract: The present invention provides a process for the removal of a resist layer formed on a semiconductor substrate, which enables easy removal of a resist layer without causing any damage on a gate oxide layer, and an apparatus therefor. The process comprises the steps of forming a gate oxide layer on the semiconductor substrate; forming a resist layer as a resist pattern on the gate oxide layer; removing the gate oxide layer at unnecessary area utilizing the resist layer as a mask; applying a pressure-sensitive adhesive sheet to the semiconductor substrate such that the gate oxide layer left on the semiconductor substrate and the resist layer are masked, and peeling the pressure-sensitive adhesive sheet together with the resist layer off the semiconductor substrate to separate and remove the resist layer from the semiconductor substrate.
    Type: Grant
    Filed: August 6, 1998
    Date of Patent: March 21, 2000
    Assignee: Nitto Denko Corporation
    Inventors: Seiichirou Shirai, Toshihiko Onozuka, Takayuki Noishiki, Satoshi Sakai, Katsuhiro Sasajima, Eiji Toyoda, Makoto Namikawa
  • Patent number: 5971589
    Abstract: A system and method are provided for developing a bend model of a part to be produced at an intelligent production facility. In accordance with an aspect of the disclosed system and method, faces of the part are detected based on initial part information, and bendlines of the part are identified based on the detected faces of the part. Further, additional part information is generated by performing a predetermined operation (e.g., a folding operation or an unfolding operation) on the detected faces of the part. The disclosed system and method also include other capabilities, such as the capability to perform clean-up operations on initial, 2-D part information and to selectively eliminate part thickness representations in order to facilitate the preparation of a 3-D representation of the part from the modified 2-D part information.
    Type: Grant
    Filed: July 31, 1996
    Date of Patent: October 26, 1999
    Assignee: Amadasoft America, Inc.
    Inventors: Kensuke Hazama, Kalev Kask, Satoshi Sakai, Moshe Schwalb
  • Patent number: 5915862
    Abstract: It is an object of the present invention to prevent a sheet of continuous-form paper from slackening when it is fed back in a printer capable of feeding both sheets of continuous-form paper and cut-form paper.
    Type: Grant
    Filed: January 30, 1998
    Date of Patent: June 29, 1999
    Assignee: PFU Limited
    Inventors: Mitsuru Shimono, Satoshi Sakai, Yasuhiro Matsue
  • Patent number: 5886897
    Abstract: An apparatus and method is provided for managing and distributing design and manufacturing information throughout a factory in order to facilitate the production of components, such as bent sheet metal components. In accordance with an aspect of the present invention, the management and distribution of critical design and manufacturing information is achieved by storing and distributing the design and manufacturing information associated with each job. By replacing the traditional paper job set-up or work sheet with, for example, an electronically stored job sheet that can be accessed instantaneously from any location in the factory, the present invention improves the overall efficiency of the factory. In addition, through the various aspects and features of the invention, the organization and accessibility of part information and stored expert knowledge is improved.
    Type: Grant
    Filed: July 31, 1996
    Date of Patent: March 23, 1999
    Assignee: Amada Soft America Inc.
    Inventors: Kensuke Hazama, Kalev Kask, Satoshi Sakai, Anand Subbaraman
  • Patent number: 5864482
    Abstract: An apparatus and method is provided for managing and distributing design and manufacturing information throughout a factory in order to facilitate the production of components, such as bent sheet metal components. In accordance with an aspect of the present invention, the management and distribution of critical design and manufacturing information is achieved by storing and distributing the design and manufacturing information associated with each job. By replacing the traditional paper job set-up or work sheet with, for example, an electronically stored job sheet that can be accessed instantaneously from any location in the factory, the present invention improves the overall efficiency of the factory. In addition, through the various aspects and features of the invention, the organization and accessibility of part information and stored expert knowledge is improved.
    Type: Grant
    Filed: July 31, 1996
    Date of Patent: January 26, 1999
    Assignee: Amadasoft America, Inc.
    Inventors: Kensuke Hazama, Yearn-Tzuo Hwang, Satoshi Sakai
  • Patent number: 5848847
    Abstract: It is an object of the present invention to prevent a sheet of continuous-form paper from slackening when it is fed back in a printer capable of feeding both sheets of continuous-form paper and cut-form paper.
    Type: Grant
    Filed: January 30, 1998
    Date of Patent: December 15, 1998
    Assignee: PFU Limited
    Inventors: Takumi Nakayama, Hironaga Hongawa, Masashi Matsumoto, Hirohito Mukaiyama, Hitoshi Asai, Mitsuru Shimono, Satoshi Sakai, Yasuhiro Matsue
  • Patent number: 5828575
    Abstract: An apparatus and method is provided for managing and distributing design and manufacturing information throughout a factory in order to facilitate the production of components, such as bent sheet metal components. In accordance with an aspect of the present invention, the management and distribution of critical design and manufacturing information is achieved by storing and distributing the design and manufacturing information associated with each job. By replacing the traditional paper job set-up or work sheet with, for example, an electronically stored job sheet that can be accessed instantaneously from any location in the factory, the present invention improves the overall efficiency of the factory. In addition, through the various aspects and features of the invention, the organization and accessibility of part information and stored expert knowledge is improved.
    Type: Grant
    Filed: July 31, 1996
    Date of Patent: October 27, 1998
    Assignee: Amadasoft America, Inc.
    Inventor: Satoshi Sakai