Abstract: A memory device includes: a set of input pads configured to receive from a source external to the memory device one or more input signals and a chip select signal; an operation circuit electrically coupled to the input pads, operation circuit configured to perform operations corresponding to the one or more input signals when the chip select signal is enabled; and an input management circuit electrically coupled to and between the input pads and the operation circuit, the input management circuit configured to control propagation of the one or more input signals based on the chip select signal.

Abstract: Memory devices, systems including memory devices, and methods of operating memory devices in which redundancy match is disabled to permit activating more word lines in parallel during refresh operations to increase a refresh rate of memory cells in a memory array. In one embodiment, a memory device is provided, comprising a memory array including a plurality of word lines arranged in a plurality of memory banks. The memory device further comprises circuitry configured to (i) store a value indicating one or more addresses corresponding to word lines in the plurality of word lines, (ii) disable redundancy match, (iii) activate one or more first word lines in the memory array corresponding to the one or more addresses indicated by the value to refresh first data stored in the memory array, and (iv) update the value based at least in part on activating the one or more first word lines.

Abstract: Semiconductor devices having through-stack interconnects for facilitating connectivity testing, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor device includes a stack of semiconductor dies and a plurality of through-stack interconnects extending through the stack to electrically couple the semiconductor dies. The interconnects include functional interconnects and at least one test interconnect. The test interconnect is positioned in a portion of the stack more prone to connectivity defects than the functional interconnects. Accordingly, testing the connectivity of the test interconnect can provide an indication of the connectivity of the functional interconnects.

Abstract: Apparatuses and methods for decoding addresses for memory are disclosed. An example apparatus includes a memory cell array and a row decoder. The memory cell array includes a bank of memory including a plurality of groups of memory. Each of the groups of memory includes sections of memory, and each of the sections of memory including memory cells arranged in rows and columns of memory. The row decoder decodes addresses to access a first group of memory to include rows of prime memory from a first block of memory and to include rows of prime memory from a second block of memory. The row decoder decodes the addresses to access a second group of memory to include rows of prime memory from the second block of memory and to include rows of redundant memory. The rows of redundant memory are shared with the first and second blocks of memory.

Abstract: Methods, systems, and devices for mitigating line-to-line capacitive coupling in a memory die are described. A device may include multiple drivers configured to both drive latched data and conduct read and write operations. For example, a memory device may contain two or more memory arrays independently coupled to two drivers via two data lines. One data line may be driven strongly to shield a corresponding memory array from effects associated with data line capacitive coupling. An opposing data line may be driven with data pertaining to an access operation of the memory array to which it is coupled. The opposing data line may be driven concurrently or within a small time difference of the other data line.

Abstract: Semiconductor devices having through-stack interconnects for facilitating connectivity testing, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor device includes a stack of semiconductor dies and a plurality of through-stack interconnects extending through the stack to electrically couple the semiconductor dies. The interconnects include functional interconnects and at least one test interconnect. The test interconnect is positioned in a portion of the stack more prone to connectivity defects than the functional interconnects. Accordingly, testing the connectivity of the test interconnect can provide an indication of the connectivity of the functional interconnects.

Abstract: An electronic device including: a fuse array including: fuse elements organized along a first direction and a second direction, wherein each fuse element is configured to store information, and a selection circuit configured to provide access to the fuse elements according to positions of the fuse elements along the first direction and the second direction; and a fuse read circuit connected to the fuse array, the fuse read circuit configured to generate a fuse-read output based on reading from one or more of the fuse elements.

Abstract: A memory device include one or more sections of memory banks. Each of the one or more sections may include multiple sensing amplifiers and a digit line to supply voltages to the sensing amplifiers during a refresh of the respective section. The memory device may also include transmission circuitry configured to transmit excess charge remaining on a first digit line of a first section to a second digit line of a second section after a refresh of the first section and before a refresh of the second section.

Abstract: A memory device include one or more sections of memory banks. Each of the one or more sections may include multiple sensing amplifiers and a digit line to supply voltages to the sensing amplifiers during a refresh of the respective section. The memory device may also include transmission circuitry configured to transmit excess charge remaining on a first digit line of a first section to a second digit line of a second section after a refresh of the first section and before a refresh of the second section.

Abstract: An electronic device includes a first circuit grouping including a first set of drivers, the first circuit grouping configured to generate a first set of output signals corresponding to a first slew rate; and s second circuit grouping including a second set of drivers, the second circuit grouping configured to generate a second set of output signals corresponding to a second slew rate, wherein the first set of drivers correspond to one or more physical characteristics different than the second set of drivers for introducing different slew rates.

Abstract: Semiconductor devices having through-stack interconnects for facilitating connectivity testing, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor device includes a stack of semiconductor dies and a plurality of through-stack interconnects extending through the stack to electrically couple the semiconductor dies. The interconnects include functional interconnects and at least one test interconnect. The test interconnect is positioned in a portion of the stack more prone to connectivity defects than the functional interconnects. Accordingly, testing the connectivity of the test interconnect can provide an indication of the connectivity of the functional interconnects.

Abstract: Memory devices, systems including memory devices, and methods of operating memory devices in which redundancy match is disabled to permit activating more word lines in parallel during refresh operations to increase a refresh rate of memory cells in a memory array. In one embodiment, a memory device is provided, comprising a memory array including a plurality of word lines arranged in a plurality of memory banks. The memory device further comprises circuitry configured to (i) store a value indicating one or more addresses corresponding to word lines in the plurality of word lines, (ii) disable redundancy match, (iii) activate one or more first word lines in the memory array corresponding to the one or more addresses indicated by the value to refresh first data stored in the memory array, and (iv) update the value based at least in part on activating the one or more first word lines.

Abstract: A memory device includes: a set of input pads configured to receive from a source external to the memory device one or more input signals and a chip select signal; an operation circuit electrically coupled to the input pads, operation circuit configured to perform operations corresponding to the one or more input signals when the chip select signal is enabled; and an input management circuit electrically coupled to and between the input pads and the operation circuit, the input management circuit configured to control propagation of the one or more input signals based on the chip select signal.

Abstract: An electronic device includes a first circuit grouping including a first set of drivers, the first circuit grouping configured to generate a first set of output signals corresponding to a first slew rate; and s second circuit grouping including a second set of drivers, the second circuit grouping configured to generate a second set of output signals corresponding to a second slew rate, wherein the first set of drivers correspond to one or more physical characteristics different than the second set of drivers for introducing different slew rates.

Abstract: A memory device includes: a set of input pads configured to receive from a source external to the memory device one or more input signals and a chip select signal; an operation circuit electrically coupled to the input pads, operation circuit configured to perform operations corresponding to the one or more input signals when the chip select signal is enabled; and an input management circuit electrically coupled to and between the input pads and the operation circuit, the input management circuit configured to control propagation of the one or more input signals based on the chip select signal.

Abstract: Systems and methods are described, in which a parity error alert timing interlock is provided by first waiting for a timer to count a configured parity error pulse width value and then waiting for any in-progress memory operations to complete before deasserting a parity error alert signal that was asserted in response to the detection of a parity error in a command or address.

Abstract: Memory devices, systems including memory devices, and methods of operating memory devices in which redundancy match is disabled to permit activating more word lines in parallel during refresh operations to increase a refresh rate of memory cells in a memory array. In one embodiment, a memory device is provided, comprising a memory array including a plurality of word lines arranged in a plurality of memory banks. The memory device further comprises circuitry configured to (i) store a value indicating one or more addresses corresponding to word lines in the plurality of word lines, (ii) disable redundancy match, (iii) activate one or more first word lines in the memory array corresponding to the one or more addresses indicated by the value to refresh first data stored in the memory array, and (iv) update the value based at least in part on activating the one or more first word lines.

Abstract: Memory devices, systems including memory devices, and methods of operating memory devices in which redundancy match is disabled to permit activating more word lines in parallel during refresh operations to increase a refresh rate of memory cells in a memory array. In one embodiment, a memory device is provided, comprising a memory array including a plurality of word lines arranged in a plurality of memory banks. The memory device further comprises circuitry configured to (i) store a value indicating one or more addresses corresponding to word lines in the plurality of word lines, (ii) disable redundancy match, (iii) activate one or more first word lines in the memory array corresponding to the one or more addresses indicated by the value to refresh first data stored in the memory array, and (iv) update the value based at least in part on activating the one or more first word lines.

Abstract: In a particular embodiment, a method of operating a memory device includes assigning a plurality of signals to a group and multiplexing the group of assigned signals onto a data transmission line. Each of the multiplexed signals can be individually demultiplexed by locally latching individual signals at corresponding target destinations. Demultiplexing each of the signals can be based on a phase signal received at the target destination and that includes the group which the corresponding individual signal was assigned to.

Abstract: A memory device includes: a set of input pads configured to receive from a source external to the memory device one or more input signals and a chip select signal; an operation circuit electrically coupled to the input pads, operation circuit configured to perform operations corresponding to the one or more input signals when the chip select signal is enabled; and an input management circuit electrically coupled to and between the input pads and the operation circuit, the input management circuit configured to control propagation of the one or more input signals based on the chip select signal.