Patents by Inventor Seung-Heon Lee

Seung-Heon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250135130
    Abstract: An inhaler according to an embodiment comprises: a housing provided with one surface, the other surface facing the surface, and a plurality of side surfaces connecting one surface to the other surface; a mouthpiece arranged on one surface of the housing; a storage which is in communication with the mouthpiece and stores an inhalable composition; and a canister which accommodates the inhalable composition which is to be stored in the storage and is connected to the storage to be opened/closed, wherein the canister can be coupled to the storage to be attachable/detachable in the housing.
    Type: Application
    Filed: June 2, 2023
    Publication date: May 1, 2025
    Applicant: KT&G CORPORATION
    Inventors: Tae Heon KIM, Jae Hyun KIM, Mi Jeong LEE, Minseok JEONG, Yongmi JUNG, Eunmi JEOUNG, Tae Young CHUNG, Seung Kyu HAN, Dong Sung KIM
  • Publication number: 20250135129
    Abstract: An inhaler according to an embodiment comprises: a housing provided with one surface, the opposite surface facing the one surface, and a plurality of side surfaces connecting the one surface and the opposite surface; a canister that is mounted inside the housing so as to be replaceable and accommodates an inhalable composition; a reservoir that is connected to the canister and stores the inhalable composition supplied from the canister; a relief valve that is installed in the reservoir and operates to open and close off the reservoir with respect to the outside; and a cover, one side of which is rotatably coupled to the housing and the other side of which is detachably coupled to a location corresponding to the bottom surface of the canister. The cover can be opened to remove the canister from the housing after opening the relief valve.
    Type: Application
    Filed: June 1, 2023
    Publication date: May 1, 2025
    Applicant: KT&G CORPORATION
    Inventors: Tae Heon KIM, Jae Hyun KIM, Mi Jeong LEE, Minseok JEONG, Yongmi JUNG, Eunmi JEOUNG, Tae Young CHUNG, Seung Kyu HAN
  • Publication number: 20250136304
    Abstract: An unmanned aerial vehicle including a housing, a first front arm, a first back arm, a second front arm, and a second back arm. The first front arm has an end at a first elevational plane when in a closed position. The first back arm has an end at a second elevational plane when in the closed position, the second elevational plane higher than the first elevational plane to provide an offset. The second front arm has an end at the first elevational plane when in the closed position. The second back arm has an end at the second elevational plane when in the closed position, the second elevational plane higher than the first elevational plane to provide the offset.
    Type: Application
    Filed: December 19, 2024
    Publication date: May 1, 2025
    Inventors: Nicholas D. Woodman, Pablo German Lema, Seung Heon Lee
  • Publication number: 20250135131
    Abstract: An inhaler according to an embodiment comprises: a housing provided with one surface, the other surface facing the surface, and a plurality of side surfaces connecting one surface to the other surface; a canister which is attached in the housing to be replaceable and accommodates an inhalable composition; a storage to which the canister is connected to be opened/closed and which stores the inhalable composition; a lever which controls the opening/closing operations of the canister; and a counter arranged between the canister and the lever to be rotatable, wherein the counter is rotated by a certain angle according to the operation of the lever so as to provide notification of the remaining amount of the inhalable composition in the canister.
    Type: Application
    Filed: May 31, 2023
    Publication date: May 1, 2025
    Applicant: KT&G CORPORATION
    Inventors: Tae Heon KIM, Jae Hyun Kim, Mi Jeong Lee, Minseok Jeong, Yongmi Jung, Eunmi Jeoung, Tae Young Chung, Seung Kyu Han
  • Patent number: 12276114
    Abstract: Disclosed herein is a method for constructing a joint between thin flexible sheets of electromagnetic shielding material. The method includes adhering first sides of multiple first sheets of shielding material to a wall and adhering first sides of multiple second sheets of shielding material to second sides of the multiple first sheets of shielding material. A conductive adhesive or a conductive double-sided adhesive tape may be applied to the first side of each of the first sheets of shielding material and the second sheets of shielding material, the first sheets of shielding material may be arranged to abut each other along at least one first seam, and the second sheets of shielding material may be arranged to abut each other along at least one second seam.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: April 15, 2025
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Dae-Yeon Kim, Dae-Heon Lee, Seung-Kab Ryu
  • Publication number: 20250116508
    Abstract: The present disclosure relates to a film temperature and thickness measurement apparatus and a measurement method using the same, which can enable manufacturing of a film with a uniform thickness by sequentially measuring the surface temperature and thickness of a film at the same point of the film that is extruded or coating molded in an in-line method, and through control of the temperature and the thickness of the film based on the measured data.
    Type: Application
    Filed: September 21, 2023
    Publication date: April 10, 2025
    Applicant: LG Chem, Ltd.
    Inventors: Do Hyun Lee, Seung Heon Lee
  • Patent number: 12251905
    Abstract: Disclosed is a glass for vehicles. The glass for vehicles includes a first glass panel, a second glass panel spaced apart from the first glass panel while maintaining a regular distance from the first glass panel, bonding films located between the first glass panel and the second glass panel, and a high refractive film located between the bonding films. The high refractive film is configured to have a wedge angle of 0.0028 rad to 0.0042 rad in the longitudinal section thereof.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: March 18, 2025
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Nak Kyoung Kong, Jin Hee Lee, Gi Heon Jeong, Seung Sik Han, Ki Hong Lee, Jong Min Park
  • Patent number: 12221237
    Abstract: An unmanned aerial vehicle including a housing, a first front arm, a first back arm, a second front arm, and a second back arm. The first front arm has an end at a first elevational plane when in a closed position. The first back arm has an end at a second elevational plane when in the closed position, the second elevational plane higher than the first elevational plane to provide an offset. The second front arm has an end at the first elevational plane when in the closed position. The second back arm has an end at the second elevational plane when in the closed position, the second elevational plane higher than the first elevational plane to provide the offset.
    Type: Grant
    Filed: December 16, 2022
    Date of Patent: February 11, 2025
    Assignee: GoPro, Inc.
    Inventors: Nicholas D. Woodman, Pablo German Lema, Seung Heon Lee
  • Publication number: 20250044647
    Abstract: The present application provides a substrate comprising a spacer pattern. The present application can provide a substrate, which is applied to various optical devices, capable of evenly and stably maintaining a gap between substrates while maximally securing an active region without causing any optical defects, including a diffraction phenomenon, and the like. The present application can also provide an optical device comprising the substrate.
    Type: Application
    Filed: December 7, 2022
    Publication date: February 6, 2025
    Applicant: LG Chem, Ltd.
    Inventors: Han Min Seo, Young Jin Park, Seung Heon Lee
  • Publication number: 20250035990
    Abstract: The present application provides a substrate comprising a spacer pattern. The present application can provide a substrate, which is applied to various optical devices, capable of evenly and stably maintaining a gap between substrates while maximally securing an active region without causing any optical defects, including a diffraction phenomenon, and the like. The present application can also provide an optical device comprising the substrate.
    Type: Application
    Filed: December 7, 2022
    Publication date: January 30, 2025
    Applicant: LG Chem, Ltd.
    Inventors: Han Min Seo, Seung Heon Lee, Jin Hong KIm, Min Jun Gim, Young Jin Park
  • Publication number: 20240344822
    Abstract: Disclosed is a coating thickness measuring apparatus and method. The coating thickness measuring apparatus according to an embodiment of the present disclosure includes a data obtaining unit configured to obtain thickness data indicating a thickness of a coating material applied to a contact portion of a substrate in contact with a coating roll while the substrate coated with the coating material is transported by the coating roll; and a processor configured to create a virtual memory zone having a plurality of storage areas in which correction data is distributed and stored and correct the thickness data based on the correction data pre-stored in a target storage area selected from the plurality of storage areas to generate corrected thickness data.
    Type: Application
    Filed: April 25, 2023
    Publication date: October 17, 2024
    Applicant: LG Chem, Ltd.
    Inventors: Do-Hyun Lee, Seung-Heon Lee
  • Patent number: 12074268
    Abstract: A transparent light emitting device display comprising: a transparent substrate; a conductive metal pattern provided on the transparent substrate; a light emitting device provided on at least a part of the conductive metal pattern; a first transparent adhesive layer provided on the transparent substrate, the conductive metal pattern, and the light emitting device; a UV-cut film provided on the first transparent adhesive layer; and a second transparent adhesive layer provided on the UV-cut film.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: August 27, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Kiseok Lee, Kun Seok Lee, Seung Heon Lee
  • Patent number: 12068652
    Abstract: Disclosed are a coil assembly of a slotless motor, a housing, and a slotless motor including the same. According to the present invention, there is provided a coil assembly of a slotless motor which includes a plurality of first coil structures which have two first coil sides facing each other with a first space interposed therebetween and having a fan-shaped cross section in a width direction and have a first end turn bent in a first direction on at least one end in a longitudinal direction of the two first coil sides and a plurality of second coil structures which have two second coil sides facing each other with a second space interposed therebetween and having a fan-shaped cross section in a width direction and have a second end turn bent in a second direction on at least one end in a longitudinal direction of the two second coil sides, wherein the plurality of first coil structures and the plurality of second coil structures are coupled to each other to form a circular stator winding structure.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: August 20, 2024
    Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Ju Lee, Seung Heon Lee, Sung Hong Won
  • Publication number: 20240172423
    Abstract: A method of fabricating a semiconductor device includes forming a device isolation layer in a substrate to define active regions, forming a conductive layer on the active regions, forming first mask patterns intersecting the active regions on the conductive layer, etching the conductive layer using the first mask patterns as etch masks to form bit lines, growing second mask patterns from top surfaces of the first mask patterns, and performing a patterning process using the second mask patterns as etch masks to form contact holes exposing the active regions between the bit lines.
    Type: Application
    Filed: January 22, 2024
    Publication date: May 23, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seung-Heon LEE, Munjun KIM, ByeongJu BAE
  • Patent number: 11966163
    Abstract: An imprinting photomask including: a transparent substrate; a light blocking pattern provided on the transparent substrate; and a dry film resist (DFR) pattern provided on the light blocking pattern.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: April 23, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Yong Goo Son, Seung Heon Lee, Nam Seok Bae
  • Patent number: 11926558
    Abstract: The present specification relates to a conductive structure body, a method for manufacturing the same, and an electrode and an electronic device including the conductive structure body.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: March 12, 2024
    Assignee: LG CHEM LTD.
    Inventors: Ilha Lee, Seung Heon Lee, Song Ho Jang, Dong Hyun Oh, Ji Young Hwang, Ki-Hwan Kim, Han Min Seo, Chan Hyoung Park, Sun Young Park
  • Patent number: 11882691
    Abstract: A method of fabricating a semiconductor device includes forming a device isolation layer in a substrate to define active regions, forming a conductive layer on the active regions, forming first mask patterns intersecting the active regions on the conductive layer, etching the conductive layer using the first mask patterns as etch masks to form bit lines, growing second mask patterns from top surfaces of the first mask patterns, and performing a patterning process using the second mask patterns as etch masks to form contact holes exposing the active regions between the bit lines.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: January 23, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-Heon Lee, Munjun Kim, ByeongJu Bae
  • Patent number: 11849570
    Abstract: A semiconductor memory device and associated methods, the device including first and second lower conductive lines extending in a first direction; a first middle conductive line on the first and second lower conductive lines and extending in a second direction; first and second memory cells between the first and second lower conductive lines and the first middle conductive line; an air gap support layer between the first and second memory cells; and a first air gap between the first and second memory cells and under the air gap support layer, wherein an upper surface of the air gap support layer lies in a same plane as the first and second memory cells, the first and second memory cells include first and second OTS layers and first and second phase-change layers, and the first air gap overlaps the first and second phase-change layers.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: December 19, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byeong Ju Bae, Seung-Heon Lee, Ik Soo Kim, Byoung Deog Choi
  • Patent number: 11812524
    Abstract: The heating film including: a transparent substrate; a coating layer provided on the transparent substrate and having a refractive index of 1.450 to 1.485; and a metal foil pattern provided on the coating layer, in which a ten-point average roughness (Rz) of a surface of the metal foil pattern is more than 0.9 ?m.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: November 7, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Jiehyun Seong, Jung Il Yoon, Sang Hoon Son, Kiseok Lee, Yong Goo Son, Jooyeon Kim, Jong Sung Park, Seung Heon Lee
  • Patent number: 11791209
    Abstract: Provided are a method of manufacturing a semiconductor device using a thermally decomposable layer, a semiconductor manufacturing apparatus, and the semiconductor device. The method includes forming an etch target layer on a substrate, forming thermally decomposable patterns spaced apart from each other on the etch target layer, forming a first mask pattern covering at least sidewalls of the thermally decomposable patterns, and removing the thermally decomposable patterns by a heating method to expose a sidewall of the first mask pattern.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: October 17, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-Heon Lee, Munjun Kim, Jaekang Koh, Tae-Jong Han