Patents by Inventor Shigeru Mizuno

Shigeru Mizuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200071118
    Abstract: A sheet processing apparatus that forms a folding line on a sheet includes first and second folding rollers that form a folding line on the sheet by rotating a bent sheet while pinching from sheet surfaces and a first pressing unit that presses the second folding roller against the first folding roller in an arbitrary portion in a rotating shaft direction of the second folding roller.
    Type: Application
    Filed: November 8, 2019
    Publication date: March 5, 2020
    Applicant: Ricoh Company, Ltd.
    Inventors: Ken Sawada, Shigeru Mizuno, Hiroyuki Kuno, Takuya Fukuhara
  • Patent number: 10519000
    Abstract: A sheet processing apparatus that forms a folding line on a sheet includes first and second folding rollers that form a folding line on the sheet by rotating a bent sheet while pinching from sheet surfaces and a first pressing unit that presses the second folding roller against the first folding roller in an arbitrary portion in a rotating shaft direction of the second folding roller.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: December 31, 2019
    Assignee: RICOH COMPANY, LIMITED
    Inventors: Ken Sawada, Shigeru Mizuno, Hiroyuki Kuno, Takuya Fukuhara
  • Patent number: 10510638
    Abstract: There is provided an electronic component-embedded board. The electronic component-embedded board includes: a first insulating layer; a metal layer formed on the first insulating layer; a first electronic component disposed on the metal layer; a second insulating layer formed on the first insulating layer and the metal layer such that the first electronic component is buried in the second insulating layer; a second electronic component disposed above the second insulating layer; and a heat radiating member thermally connected to the metal layer exposed from the second insulating layer and thermally connected to the second electronic component.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: December 17, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Shigeru Mizuno, Tomoya Kubo, Katsuya Fukase
  • Patent number: 10503500
    Abstract: A management system constructs management information indicating that log chunks and issue chunks extracted from a first system managing log information and issue information output by a process related to a first team for a program to be developed are linked. The management system searches, from the management information, a log message group compatible with a designated log message group that is one or more log messages related to the issue by log pattern matching using the designated log message group in a case of receiving an inquiry with which the designated log message group is associated from the second system. The management system displays, on the second system, a response containing a handling method represented by handling method information corresponding to the found log message group.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: December 10, 2019
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Tameshige, Jun Mizuno, Junji Kinoshita, Yuichi Taguchi, Shigeru Tachikawa, Yuji Hirose, Mitsuhiro Nagata
  • Publication number: 20190205129
    Abstract: A management system constructs management information indicating that log chunks and issue chunks extracted from a first system managing log information and issue information output by a process related to a first team for a program to be developed are linked. The management system searches, from the management information, a log message group compatible with a designated log message group that is one or more log messages related to the issue by log pattern matching using the designated log message group in a case of receiving an inquiry with which the designated log message group is associated from the second system. The management system displays, on the second system, a response containing a handling method represented by handling method information corresponding to the found log message group.
    Type: Application
    Filed: September 1, 2016
    Publication date: July 4, 2019
    Inventors: Takashi TAMESHIGE, Jun MIZUNO, Junji KINOSHITA, Yuichi TAGUCHI, Shigeru TACHIKAWA, Yuji HIROSE, Mitsuhiro NAGATA
  • Publication number: 20190103335
    Abstract: There is provided an electronic component-embedded board. The electronic component-embedded board includes: a first insulating layer; a metal layer formed on the first insulating layer; a first electronic component disposed on the metal layer; a second insulating layer formed on the first insulating layer and the metal layer such that the first electronic component is buried in the second insulating layer; a second electronic component disposed above the second insulating layer; and a heat radiating member thermally connected to the metal layer exposed from the second insulating layer and thermally connected to the second electronic component.
    Type: Application
    Filed: September 21, 2018
    Publication date: April 4, 2019
    Inventors: Shigeru Mizuno, Tomoya Kubo, Katsuya Fukase
  • Publication number: 20180370751
    Abstract: A sheet processing apparatus that forms a folding line on a sheet includes first and second folding rollers that form a folding line on the sheet by rotating a bent sheet while pinching from sheet surfaces and a first pressing unit that presses the second folding roller against the first folding roller in an arbitrary portion in a rotating shaft direction of the second folding roller.
    Type: Application
    Filed: August 29, 2018
    Publication date: December 27, 2018
    Applicant: Ricoh Company, Ltd.
    Inventors: Ken SAWADA, Shigeru Mizuno, Hiroyuki Kuno, Takuya Fukuhara
  • Patent number: 10124981
    Abstract: A sheet processing apparatus that forms a folding line on a sheet includes first and second folding rollers that form a folding line on the sheet by rotating a bent sheet while pinching from sheet surfaces and a first pressing unit that presses the second folding roller against the first folding roller in an arbitrary portion in a rotating shaft direction of the second folding roller.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: November 13, 2018
    Assignee: RICOH COMPANY, LIMITED
    Inventors: Ken Sawada, Shigeru Mizuno, Hiroyuki Kuno, Takuya Fukuhara
  • Publication number: 20170267483
    Abstract: A sheet processing apparatus that forms a folding line on a sheet includes first and second folding rollers that form a folding line on the sheet by rotating a bent sheet while pinching from sheet surfaces and a first pressing unit that presses the second folding roller against the first folding roller in an arbitrary portion in a rotating shaft direction of the second folding roller.
    Type: Application
    Filed: June 5, 2017
    Publication date: September 21, 2017
    Applicant: Ricoh Company, Ltd.
    Inventors: Ken SAWADA, Shigeru MIZUNO, Hiroyuki KUNO, Takuya FUKUHARA
  • Patent number: 9688502
    Abstract: A sheet processing apparatus that forms a folding line on a sheet includes first and second folding rollers that form a folding line on the sheet by rotating a bent sheet while pinching from sheet surfaces and a first pressing unit that presses the second folding roller against the first folding roller in an arbitrary portion in a rotating shaft direction of the second folding roller.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: June 27, 2017
    Assignee: RICOH COMPANY, LIMITED
    Inventors: Ken Sawada, Shigeru Mizuno, Hiroyuki Kuno, Takuya Fukuhara
  • Publication number: 20150336765
    Abstract: A sheet processing apparatus that forms a folding line on a sheet includes first and second folding rollers that form a folding line on the sheet by rotating a bent sheet while pinching from sheet surfaces and a first pressing unit that presses the second folding roller against the first folding roller in an arbitrary portion in a rotating shaft direction of the second folding roller.
    Type: Application
    Filed: May 7, 2015
    Publication date: November 26, 2015
    Applicant: Ricoh Company, Limited
    Inventors: Ken SAWADA, Shigeru MIZUNO, Hiroyuki KUNO, Takuya FUKUHARA
  • Patent number: 8956512
    Abstract: A target is provided opposite to a wafer mounted on in a vacuum chamber, and a magnet array body is disposed above the target. In the magnet array body, ring-shaped magnet arrays are arranged to generate annular magnetic fields in the circumferential direction of the wafer, and a sputtering film formation is performed by switching between the magnetic fields.
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: February 17, 2015
    Assignee: Tokyo Electron Limited
    Inventor: Shigeru Mizuno
  • Publication number: 20140346037
    Abstract: There is provided a sputter device in which a conductive target having a planar and circular shape is disposed so as to face a workpiece substrate mounted on a mounting part located within a vacuum chamber, includes: a direct current power supply configured to apply a negative direct current voltage to the target; an opposing electrode installed at the opposite side of the workpiece substrate from the target so as to face the target; and a target high-frequency power supply connected to the target and configured to supply high-frequency power to the target in order to generate a high-frequency electric field between the opposing electrode and the target, wherein the distance between the target and the workpiece substrate during a sputtering process being 30 mm or less.
    Type: Application
    Filed: August 7, 2014
    Publication date: November 27, 2014
    Inventors: Shigeru MIZUNO, Atsushi GOMI, Tetsuya MIYASHITA, Tatsuo HATANO, Yasushi MIZUSAWA
  • Patent number: 8716132
    Abstract: A method for integrating metal-containing cap layers into copper (Cu) metallization of semiconductor devices to improve electromigration and stress migration in bulk Cu metal. In one embodiment, the method includes providing a patterned substrate containing Cu metal surfaces and dielectric layer surfaces, exposing the patterned substrate to a process gas comprising a metal-containing precursor, and irradiating the patterned substrate with electromagnetic radiation, where selective metal-containing cap layer formation on the Cu metal surfaces is facilitated by the electromagnetic radiation. In some embodiments, the method further includes pre-treating the patterned substrate with additional electromagnetic radiation and optionally a cleaning gas prior to forming the metal-containing cap layer.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: May 6, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Tadahiro Ishizaka, Shigeru Mizuno
  • Patent number: 8617363
    Abstract: A magnetron sputtering apparatus where a target is disposed to face a substrate installed in a vacuum chamber and magnets are disposed on a rear surface of the target, including a power supply unit configured to apply a voltage to the target; and a magnet array body including a magnet group arranged on a base body provided at the rear surface of the target. In the magnet array body, rod-shaped magnets each having different polarities at opposite ends thereof are disposed in a mesh shape on a surface of the base body facing the target; the mesh has a 2n polygonal shape (n being an integer greater than or equal to 2); permeable core members are disposed at intersection points of the mesh surrounded by the ends of the rod-shaped magnets; and end portions of the rod-shaped magnets which surround each of the core members have a same polarity.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: December 31, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Shigeru Mizuno, Hiroyuki Toshima
  • Publication number: 20130081938
    Abstract: A magnetron sputtering apparatus in which a target is disposed to face a substrate includes a magnet array body including a magnet group arranged on a base body, and a rotating mechanism for rotating the magnet array body around an axis perpendicular to the substrate. In the magnet array body, N poles and S poles constituting the magnet group are arranged to be spaced from each other along a surface facing the target such that a plasma is generated based on a drift of electrons by a cusp magnetic field. Magnets located on the outermost periphery of the magnet group are arranged in a line to prevent the electrons from being released from constraint of the cusp magnetic field and jumping out of the cusp magnetic field. A distance between the target and the substrate during sputtering is equal to or less than 30 mm.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 4, 2013
    Inventors: Shigeru MIZUNO, Hiroyuki TOSHIMA, Atsushi GOMI, Tetsuya MIYASHITA, Tatsuo HATANO, Yasushi MIZUSAWA
  • Patent number: 8372739
    Abstract: An interconnect structure for an integrated circuit and method of forming the interconnect structure. The method includes depositing a metallic layer containing a reactive metal in an interconnect opening formed within a dielectric material containing a dielectric reactant element, thermally reacting at least a portion of the metallic layer with at least a portion of the dielectric material to form a diffusion barrier primarily containing a compound of the reactive metal from the metallic layer and the dielectric reactant element from the dielectric material, and filling the interconnect opening with Cu metal, where the diffusion barrier surrounds the Cu metal within the opening. The reactive metal can be Co, Ru, Mo, W, or Ir, or a combination thereof. The interconnect opening can be a trench, a via, or a dual damascene opening.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: February 12, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Tadahiro Ishizaka, Satohiko Hoshino, Kuzuhiro Hamamoto, Shigeru Mizuno, Yasushi Mizusawa
  • Patent number: 8242019
    Abstract: A method for integrating metal-containing cap layers into copper (Cu) metallization of semiconductor devices. In one embodiment, the method includes providing a patterned substrate containing metal surfaces and dielectric layer surfaces, and modifying the dielectric layer surfaces by exposure to a reactant gas containing a hydrophobic functional group, where the modifying substitutes a hydrophilic functional group in the dielectric layer surfaces with a hydrophobic functional group. The method further includes depositing metal-containing cap layers selectively on the metal surfaces by exposing the modified dielectric layer surfaces and the metal surfaces to a deposition gas containing metal-containing precursor vapor.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: August 14, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Tadahiro Ishizaka, Shigeru Mizuno, Satohiko Hoshino, Hiroyuki Nagai, Yuki Chiba, Frank M. Cerio, Jr.
  • Patent number: 8076241
    Abstract: Methods are provided for multi-step Cu metal plating on a continuous Ru metal film in recessed features found in advanced integrated circuits. The use of a continuous Ru metal film prevents formation of undesirable micro-voids during Cu metal filling of high-aspect-ratio recessed features, such as trenches and vias, and enables formation of large Cu metal grains that include a continuous Cu metal layer plated onto the continuous Ru metal film. The large Cu grains lower the electrical resistivity of the Cu filled recessed features and increase the reliability of the integrated circuit.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: December 13, 2011
    Assignees: Tokyo Electron Limited, Novellus Systems, Inc.
    Inventors: Frank M. Cerio, Jr., Shigeru Mizuno, Jonathan Reid, Thomas Ponnuswamy
  • Patent number: 8058728
    Abstract: An interconnect structure is provided. The interconnect structure includes an interconnect opening formed within a dielectric material, a diffusion barrier on the dielectric material, where the diffusion barrier contains a compound from a thermal reaction between cobalt (Co) metal from at least a portion of a cobalt metal layer formed on the dielectric material and a dielectric reactant element from the dielectric material. The interconnect structure further includes a cobalt nitride adhesion layer in the interconnect opening, and a Cu metal fill in the interconnect opening, wherein the diffusion barrier and the cobalt nitride adhesion layer surround the Cu metal fill within the interconnect opening.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: November 15, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Tadahiro Ishizaka, Shigeru Mizuno