Abstract: A fluid dispenser, includes: a fluid dispensation pipe, for receiving a fluid and controlling a dispensation the fluid; a MEMS sensor, for sensing a movement of the fluid dispenser, wherein when the movement is determined to be in an abnormal status, the MEMS sensor generates an alarm signal; and a dispensation stopper, for stopping the dispensation of the fluid according to the alarm signal.

Abstract: A layout method for a printed circuit board (PCB) is provided. The method obtains a memory type of a dynamic random access memory (DRAM) to be mounted on the PCB, obtains a module group from a database according to the memory type of the DRAM, wherein the module group comprises a plurality of routing modules, obtains a plurality of PCB parameters, selects a specific routing module from the module group according to the PCB parameters, and implements the specific routing module into a layout design for PCB fabrication. The specific routing module comprises layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.

Abstract: The invention provides a combo MEMS device. The combo MEMS device includes a substrate, a device layer, a cap, and at least two sensor units. The device layer is on the substrate. The cap is on the device layer. At least two sensor units which are adjacent to each other are both formed by the substrate, the device layer, and the cap. The first sensor unit includes a sealed space, and the second sensor unit includes a membrane and a semi-sealed space. The membrane is formed by reducing a thickness of a portion of the device layer. The semi-sealed space is formed between the substrate and the device layer or between the device layer and the cap, to receive an external pressure through an external pressure communication opening. The external pressure communication opening is formed between the substrate and the device layer, or between the device layer and the cap, or between the substrate and the cap.

Abstract: A method for power management by a rack management controller (RMC) of a server rack includes collecting power consumption data from a first baseboard management controller (BMC) of a first server in the server rack and sending the power consumption data to a management server. The RMC receives power requirements from the management server and determines a power setting based on the power consumption data and the power requirements. The RMC requests the first BMC to limit power consumption of the first server according to the power setting.

Abstract: A display panel includes a substrate, and a pixel array and a gate driving circuit. The gate driving circuit provides gate driving signals to the pixel array, and includes shift registers, wherein each shift register includes a voltage providing unit, a first driving transistor, a voltage transmitting unit and a second driving transistor. The voltage providing unit receives a setting signal and a system high voltage to provide a first terminal voltage. The first driving transistor receives a first clock signal and the first terminal voltage to provide a first gate driving signal. The voltage transmitting unit receives the first gate driving signal to provide a second terminal voltage. The second driving transistor receives a second clock signal and the second terminal voltage to provide a second gate driving signal. Therefore, the influence caused by large difference of driving capabilities of the first and the second driving transistor is avoided.

Abstract: A display panel includes a substrate, and a pixel array and a gate driving circuit. The gate driving circuit provides gate driving signals to the pixel array, and includes shift registers, wherein each shift register includes a voltage providing unit, a first driving transistor, a voltage transmitting unit and a second driving transistor. The voltage providing unit receives a setting signal and a system high voltage to provide a first terminal voltage. The first driving transistor receives a first clock signal and the first terminal voltage to provide a first gate driving signal. The voltage transmitting unit receives the first gate driving signal to provide a second terminal voltage. The second driving transistor receives a second clock signal and the second terminal voltage to provide a second gate driving signal. Therefore, the influence caused by large difference of driving capabilities of the first and the second driving transistor is avoided.

Abstract: The invention provides a MEMS device. The MEMS device includes: a substrate; a proof mass, including at least two slots, each of the slots including an inner space and an opening, the inner space being relatively closer to a center area of the proof mass than the opening; at least two anchors located in the corresponding slots and connected to the substrate; at least two linkages located in the corresponding slots and connected to the corresponding anchors; and a multi-dimensional spring structure for assisting a multi-dimensional movement of the proof mass, the multi-dimensional spring structure surrounding a periphery of the proof mass, and connected to the substrate through the linkages and the anchors. The multi-dimensional spring structure includes first and second springs for assisting an out-of-plane movement and an in-plane movement of the proof mass.

Abstract: The present invention discloses a MEMS device. The MEMS device includes a substrate, a proof mass, a frame spring and an anchor. The proof mass is connected to the substrate through the frame spring and the anchor. The proof mass includes a proof mass body, a proof mass frame surrounding the proof mass body, a linking element connecting the proof mass body to the proof mass frame, and a stopper between the proof mass body and the proof mass frame in a displacement direction to limit the displacement of the proof mass body. The stopper is connected to the proof mass frame as a part of the proof mass and contributes to the mass quantity of the proof mass.

Abstract: A driving circuit in this disclosure includes plural stages of shift register circuits. Every stage in the shift register circuits includes an enabling control circuit, a first output circuit, a second output circuit and a disabling control circuit. The enabling circuit is configured to control the voltage of the first operation node according to enabling signal. The first output unit is configured to generate the first driving signal according to the voltage of the first operation node and the first clock signal. The second output unit is configured to generate the second driving signal according to the voltage of the first operation node and the second clock signal. The disabling control unit is used to pull low the voltage of the first operation node and output terminal of the first and second output unit to the reference voltage according to the first, third, and fourth clock signals.

Abstract: A printed circuit board for mobile platforms includes a core substrate having a first side, a ground plane covering on the first side, a first insulating layer covering the ground plane, and a plurality of first signal traces and a plurality of first ground traces, alternatively arranged on the first insulating layer, a second insulating layer connecting to the first insulating layer, and a plurality of second signal traces separated from each other, disposed on the second insulating layer, wherein the second signal traces are disposed directly on spaces between the first signal traces and the first ground traces adjacent thereto, wherein coverage of the ground plane is corresponding to disposition of the first signal trace, the first ground trace, the second signal trace and the second ground trace.

Abstract: A microelectronic system includes a printed circuit board and a semiconductor package mounted on the printed circuit board. The printed circuit board includes a laminated core having an internal conductive layer and a build-up layer. The build-up layer includes a top conductive layer. Microvias are disposed in the build-up layer to connect the top conductive layer with the internal conductive layer. A power/ground ball pad array is disposed in the top conductive layer. The power/ground ball pad array includes power ball pads and ground ball pads arranged in an array with a fixed ball pad pitch P. The power/ground ball pad array includes a 4-ball pad unit area comprised of only one ground ball pad and three power ball pads, or comprised of only one power ball pad and three ground ball pads. The 4-ball pad unit area has a rectangular shape and a dimension of about 2P×2P.

Abstract: A MEMS device includes: a substrate; a proof mass suspended over the substrate, the proof mass including at least one proof mass body and a proof mass frame connected to and accommodating the proof mass body, the proof mass frame including at least one self-test frame; and at least one self-test electrode inside the self-test frame, and connected to the substrate; wherein when a voltage difference is applied between the self-test electrode and the self-test frame, the proof mass is driven to have an in-plane movement, and wherein the self-test electrode and the self-test frame do not form a sensing capacitor in between.

Abstract: An antenna structure includes a main portion, a first radiating portion connected to the main portion, a second radiating portion connected to the main portion and opposite to the first radiating portion, and a coupling portion spaced from and coplanar with the main portion and opposite to the second radiating portion. The main portion and the first radiating portion excite a low frequency mode, the main portion, the first radiating portion, the second radiating portion, and the coupling portion excite a high frequency mode, and when the antenna structure is interfered by a user's human body when close to the user's human body, the coupling portion transmits the interference to ground. A wireless communication device employing the antenna structure is also disclosed.

Abstract: A printed circuit board includes a laminated core including at least an internal conductive layer, and a build-up layer on the laminated core. The build-up layer includes a top conductive layer. A plurality of microvias is disposed in the build-up layer to electrically connect the top conductive layer with the internal conductive layer. A power/ground ball pad array is disposed in the top conductive layer. The power/ground ball pad array includes power ball pads and ground ball pads arranged in an array with a fixed ball pad pitch P. The power/ground ball pad array includes a 4-ball pad unit area that is comprised of only one ground ball pad and three power ball pads, or comprised of only one power ball pad and three ground ball pads. The 4-ball pad unit area has a rectangular shape and a dimension of about 2P×2P.

Abstract: A series fan includes a first fan and a second fan. The first fan has a first frame, a second frame and a first flow passage. The second fan has a third frame, a fourth frame and a second flow passage. A first static blade is disposed at the first frame, while a second static blade is disposed at the fourth frame. A first dynamic blade assembly is disposed in the first flow passage, while a second dynamic blade assembly is disposed in the second flow passage. The second frame is assembled with the third frame. The first and second static blades serve to enhance the support strength and protection effect for the series fan. In addition, the first and second dynamic blade assemblies can be designed with an increased aerodynamic volume.

Abstract: A micro-electro mechanical apparatus with interdigitated spring including a substrate, at least one first mass, a movable electrode, a stationary electrode, an anchor and an interdigitated spring is provided. The movable electrode is disposed on the mass along an axial direction. The stationary electrode is disposed on the substrate along the axial direction, and the movable electrode and the stationary electrode have a critical gap there between. The interdigitated springs connects the mass and the anchor along the axial direction. The interdigitated spring includes first folded portions, first connecting portions, second folded portions, and second connecting portions. Each first folded portion includes two first spans and a first head portion. Each second folded portion includes two second spans and a second head portion. A width of the first span and a width of the second span are greater than the critical gap respectively.

Abstract: The present invention discloses a MEMS device. The MEMS device includes a substrate, a proof mass, a frame spring and an anchor. The proof mass is connected to the substrate through the frame spring and the anchor. The proof mass includes a proof mass body, a proof mass frame surrounding the proof mass body, a linking element connecting the proof mass body to the proof mass frame, and a stopper between the proof mass body and the proof mass frame in a displacement direction to limit the displacement of the proof mass body. The stopper is connected to the proof mass frame as a part of the proof mass and contributes to the mass quantity of the proof mass.

Abstract: A printed circuit board includes a laminated core including at least an internal conductive layer, and a build-up layer on the laminated core. The build-up layer includes a top conductive layer. A plurality of microvias is disposed in the build-up layer to electrically connect the top conductive layer with the internal conductive layer. A power/ground ball pad array is disposed in the top conductive layer. The power/ground ball pad array includes power ball pads and ground ball pads arranged in an array with a fixed ball pad pitch P. The power/ground ball pad array includes a 4-ball pad unit area that is comprised of only one ground ball pad and three power ball pads, or comprised of only one power ball pad and three ground ball pads. The 4-ball pad unit area has a rectangular shape and a dimension of about 2P×2P.

Abstract: The invention provides a MEMS device. The MEMS device includes: a substrate; a proof mass, including at least two slots, each of the slots including an inner space and an opening, the inner space being relatively closer to a center area of the proof mass than the opening; at least two anchors located in the corresponding slots and connected to the substrate; at least two linkages located in the corresponding slots and connected to the corresponding anchors; and a multi-dimensional spring structure for assisting a multi-dimensional movement of the proof mass, the multi-dimensional spring structure surrounding a periphery of the proof mass, and connected to the substrate through the linkages and the anchors. The multi-dimensional spring structure includes first and second springs for assisting an out-of-plane movement and an in-plane movement of the proof mass.

Abstract: A printed circuit board (PCB) is provided. The PCB has a specific routing module, having a first chip, a memory chip, and a plurality of traces designed for interconnection between the first chip and the memory chip according to a routing configuration between the first chip and the memory chip. The memory chip is a dynamic random access memory (DRAM) with a memory type, the specific routing module is obtained from a module group comprising a plurality of routing modules according to a plurality of PCB parameters, and module group is obtained from a database according to the memory type of the DRAM.