Patents by Inventor Shin Hashimoto

Shin Hashimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050067707
    Abstract: A semiconductor device comprises a first insulating film formed on a semiconductor substrate, a first metal pattern formed on the first insulating film, a second insulating film formed on the first metal pattern, a second metal pattern formed on the second insulating film, and a third metal pattern formed in the second insulating film and connecting between the first metal pattern and the second metal pattern. The third metal pattern is a single continuous structure, and the principal orientation axes of crystals of a metal constituting the third metal pattern are parallel to the principal surface of the semiconductor substrate.
    Type: Application
    Filed: September 22, 2004
    Publication date: March 31, 2005
    Inventors: Shin Hashimoto, Tadaaki Mimura
  • Publication number: 20050003745
    Abstract: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.
    Type: Application
    Filed: June 14, 2004
    Publication date: January 6, 2005
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akihiro Tanoue, Yoshiharu Hidaka, Shin Hashimoto
  • Publication number: 20040253783
    Abstract: A semiconductor device is composed of: an interconnect made of a first conductive film and a second conductive film that are stacked in sequence from the interconnect underside on an insulating film formed on a substrate; and a capacitor composed of a lower capacitor electrode made of the first conductive film, a dielectric film formed on the lower capacitor electrode, and an upper capacitor electrode made of the second conductive film and formed on the dielectric film.
    Type: Application
    Filed: March 31, 2004
    Publication date: December 16, 2004
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kyoko Egashira, Shin Hashimoto
  • Publication number: 20040242127
    Abstract: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.
    Type: Application
    Filed: June 14, 2004
    Publication date: December 2, 2004
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akihiro Tanoue, Yoshiharu Hidaka, Shin Hashimoto
  • Patent number: 6790127
    Abstract: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.
    Type: Grant
    Filed: October 19, 2001
    Date of Patent: September 14, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akihiro Tanoue, Yoshiharu Hidaka, Shin Hashimoto
  • Publication number: 20040137667
    Abstract: A memory cell transistor and a planar capacitor are provided in a memory region, and both transistors of a CMOS device are provided in a logic circuit region. A capacitance dielectric 15 and a plate electrode 16b of the planar capacitor are provided over a trench shared with a shallow trench isolation 12a, and the upper part of the trench is filled with the capacitance dielectric 15 and the plate electrode 16b. An n-type diffusion layer 19 that is a storage node is formed, with an end region thereof extending along one side of the upper part of the trench, to a region of the substrate overlapping with the shallow trench isolation 12a. The area of a part of the substrate functioning as a capacitor can be increased without increasing the substrate area.
    Type: Application
    Filed: October 17, 2003
    Publication date: July 15, 2004
    Inventors: Hisashi Ogawa, Hiroaki Nakaoka, Atsuhiro Kajiya, Shin Hashimoto, Kyoko Egashira
  • Publication number: 20040132386
    Abstract: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.
    Type: Application
    Filed: December 18, 2003
    Publication date: July 8, 2004
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akihiro Tanoue, Yoshiharu Hidaka, Shin Hashimoto
  • Patent number: 6585560
    Abstract: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: July 1, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akihiro Tanoue, Yoshiharu Hidaka, Shin Hashimoto
  • Patent number: 6562716
    Abstract: After a cobalt film is deposited on a silicon-containing film formed on a semiconductor substrate, a first heat treatment at a relatively low temperature is performed with respect to the semiconductor substrate to cause a reaction between the cobalt film and the silicon layer and thereby form a Co2Si layer or CoSi layer in at least a surface portion of the silicon layer. Then, a silicon-containing film is deposited on the Co2Si layer or CoSi layer and a second heat treatment at a relatively high temperature is performed with respect to the semiconductor substrate to cause a reaction between the silicon-containing film and the Co2Si layer or CoSi layer and thereby form a CoSi2 layer in at least a surface portion of the silicon layer.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: May 13, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shin Hashimoto, Kyoko Egashira
  • Patent number: 6428398
    Abstract: It is arranged such that the least common multiple of two numbers m and n of which one is prime to the other, is made as large as possible where the number m is the rotational speed (rpm) of a platen with a polishing pad affixed thereto and the number n is the rotational speed (rpm) of a carrier with a wafer mounted thereon. As a result of such arrangement, it is not until the platen completes m revolutions that a point on the polishing pad that comes into contact with a fixed point on the wafer returns to the original contact point with the fixed point at the start of polishing, and the resulting trajectory is therefore spread uniformly over the polishing pad.
    Type: Grant
    Filed: December 18, 2000
    Date of Patent: August 6, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shin Hashimoto, Yoshiharu Hidaka
  • Publication number: 20020039878
    Abstract: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.
    Type: Application
    Filed: October 19, 2001
    Publication date: April 4, 2002
    Inventors: Akihiro Tanoue, Yoshiharu Hidaka, Shin Hashimoto
  • Patent number: 6323663
    Abstract: A retainer board, holding a semiconductor wafer having a plurality of integrated circuit terminals for testing a semiconductor chip, is provided in confronting relation to a probe sheet having a plurality of probe terminals electrically connected to their corresponding integrated circuit terminals. An insulating substrate, having wiring electrically connected to the plural probe terminals, is provided on the probe sheet in opposed relation to the retainer board. An elastic member is interposed between the probe sheet and the insulating substrate. The retainer board and the probe sheet are brought into so closer relationship that each integrated circuit terminal of the semiconductor wafer held by the retainer board is electrically connected to its corresponding probe terminal of the probe sheet.
    Type: Grant
    Filed: September 16, 1999
    Date of Patent: November 27, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshirou Nakata, Toshio Yamada, Atsushi Fujiwara, Isao Miyanaga, Shin Hashimoto, Yukiharu Uraoka, Yasushi Okuda, Kenzou Hatada
  • Patent number: 6319099
    Abstract: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.
    Type: Grant
    Filed: November 23, 1999
    Date of Patent: November 20, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akihiro Tanoue, Yoshiharu Hidaka, Shin Hashimoto
  • Patent number: 6308316
    Abstract: An apparatus analyzes the operations of a parallel processing system. The parallel processing system has a serial processing state, a redundant parallel processing state, and a parallel processing state. The apparatus carries out an interrupt process to provide information about the program executing conditions of the parallel processing system. This apparatus efficiently provides information about parallel processing carried out in a multiprocessor system.
    Type: Grant
    Filed: January 8, 1998
    Date of Patent: October 23, 2001
    Assignee: Fujitsu Limited
    Inventors: Shin Hashimoto, Reiji Masaki
  • Patent number: 6291350
    Abstract: An ultrasonic transmitting unit transmits an ultrasonic wave to a slurry supply pipe. A polishing slurry is conveyed under pressure from a slurry supply tank to a slurry outlet via the slurry supply pipe and supplied from the slurry outlet to a surface of a polishing cloth. A wafer carrier holding a semiconductor wafer presses a surface of the semiconductor wafer against the surface of the polishing cloth coated with the polishing slurry and moves the semiconductor wafer relative to the polishing cloth to polish the surface of the semiconductor wafer. A discharged slurry flown out of the surface of the polishing cloth is discharged via a discharged slurry pipe. The application of the ultrasonic wave allows abrasive particles agglomerated in the polishing slurry in the slurry supply pipe to be re-dispersed into individual forms in the polishing slurry.
    Type: Grant
    Filed: August 3, 1998
    Date of Patent: September 18, 2001
    Assignee: Matsushita Electronics Corporation
    Inventors: Shin Hashimoto, Yuichi Miyoshi
  • Publication number: 20010003056
    Abstract: After a cobalt film is deposited on a silicon-containing film formed on a semiconductor substrate, a first heat treatment at a relatively low temperature is performed with respect to the semiconductor substrate to cause a reaction between the cobalt film and the silicon layer and thereby form a Co2Si layer or CoSi layer in at least a surface portion of the silicon layer. Then, a silicon-containing film is deposited on the Co2Si layer or CoSi layer and a second heat treatment at a relatively high temperature is performed with respect to the semiconductor substrate to cause a reaction between the silicon-containing film and the Co2Si layer or CoSi layer and thereby form a CoSi2 layer in at least a surface portion of the silicon layer.
    Type: Application
    Filed: December 1, 2000
    Publication date: June 7, 2001
    Inventors: Shin Hashimoto, Kyoko Egashira
  • Publication number: 20010000490
    Abstract: It is arranged such that the least common multiple of two numbers m and n of which one is prime to the other, is made as large as possible where the number m is the rotational speed (rpm) of a platen with a polishing pad affixed thereto and the number n is the rotational speed (rpm) of a carrier with a wafer mounted thereon. As a result of such arrangement, it is not until the platen completes m revolutions that a point on the polishing pad that comes into contact with a fixed point on the wafer returns to the original contact point with the fixed point at the start of polishing, and the resulting trajectory is therefore spread uniformly over the polishing pad.
    Type: Application
    Filed: December 18, 2000
    Publication date: April 26, 2001
    Applicant: Matsushita Electronics Corporation
    Inventors: Shin Hashimoto, Yoshiharu Hidaka
  • Publication number: 20010000166
    Abstract: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.
    Type: Application
    Filed: December 7, 2000
    Publication date: April 5, 2001
    Inventors: Akihiro Tanoue, Yoshiharu Hidaka, Shin Hashimoto
  • Patent number: 6180423
    Abstract: It is arranged such that the least common multiple of two numbers m and n of which one is prime to the other, is made as large as possible where the number m is the rotational speed (rpm) of a platen with a polishing pad affixed thereto and the number n is the rotational speed (rpm) of a carrier with a wafer mounted thereon. As a result of such arrangement, it is not until the platen completes m revolutions that a point on the polishing pad that comes into contact with a fixed point on the wafer returns to the original contact point with the fixed point at the start of polishing, and the resulting trajectory is therefore spread uniformly over the polishing pad.
    Type: Grant
    Filed: July 1, 1998
    Date of Patent: January 30, 2001
    Assignee: Matsushita Electronics Corporation
    Inventors: Shin Hashimoto, Yoshiharu Hidaka
  • Patent number: 6005401
    Abstract: A retainer board, holding a semiconductor wafer having a plurality of integrated circuit terminals for testing a semiconductor chip, is provided in confronting relation to a probe sheet having a plurality of probe terminals electrically connected to their corresponding integrated circuit terminals. An insulating substrate, having wiring electrically connected to the plural probe terminals, is provided on the probe sheet in opposed relation to the retainer board. An elastic member is interposed between the probe sheet and the insulating substrate. The retainer board and the probe sheet are brought into so closer relationship that each integrated circuit terminal of the semiconductor wafer held by the retainer board is electrically connected to its corresponding probe terminal of the probe sheet.
    Type: Grant
    Filed: April 14, 1997
    Date of Patent: December 21, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshirou Nakata, Toshio Yamada, Atsushi Fujiwara, Isao Miyanaga, Shin Hashimoto, Yukiharu Uraoka, Yasushi Okuda, Kenzou Hatada