Patents by Inventor Shinichi Kurita

Shinichi Kurita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150002019
    Abstract: A bellows which forms a flexible coupling between the lid of a processing chamber and an antenna feed through. One embodiment provides an apparatus comprising a chamber body having a chamber lid, a feed through extending through the chamber lid, an antenna coupled to and extending through the feed through to an internal volume of the chamber body, and a bellows comprising a first flange, the first flange coupled to the feed through, a second flange, the second flange coupled to the chamber lid, and a center portion extending between the first flange and the second flange.
    Type: Application
    Filed: January 11, 2013
    Publication date: January 1, 2015
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Benjamin M. Johnston, Shinichi Kurita
  • Patent number: 8915389
    Abstract: Embodiments disclosed herein relate to a large vacuum chamber body that has been welded together. The chamber body may have a high emissivity coating on at least one surface therein. Due to the large size of the chamber body, the chamber body may be formed by welding several pieces together rather than forging the body from a single piece of metal. The pieces may be welded together at a location spaced from the corner of the body, which may be under the greatest stress during evacuation, to ensure that the weld, which may be the weakest point in the body, does not fail. At least one surface of the chamber body may be coated with a high emissivity coating to aid in heat transfer from incoming, heated substrates. The high emissivity coating may increase substrate throughput by lowering the time that may be needed to reduce the substrate temperature.
    Type: Grant
    Filed: August 14, 2013
    Date of Patent: December 23, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Shinichi Kurita, Mehran Behdjat, Makoto Inagawa
  • Patent number: 8877553
    Abstract: The present invention generally comprises a floating slit valve for interfacing with a chamber. A floating slit valve moves or “floats” relative to another object such as a chamber. The slit valve may be coupled between two chambers. When a chamber coupled with the slit valve is heated, the slit valve may also be heated by conduction. As the slit valve is heated, it may thermally expand. When a vacuum is drawn in a chamber, the slit valve may deform due to vacuum deflection. By disposing a low friction material spacer between the chamber and the slit valve, the slit valve may not rub against the chamber during thermal expansion/contraction and/or vacuum deflection and thus, may not generate undesirable particle contaminants. Additionally, slots drilled through the chamber for coupling the slit valve to the chamber may be sized to accommodate thermal expansion/contraction and vacuum deflection of the slit valve.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: November 4, 2014
    Assignee: Applied Materials, Inc.
    Inventors: John M. White, Shinichi Kurita, Takayuki Matsumoto
  • Publication number: 20140170785
    Abstract: A system and method for encapsulating an organic light-emitting diode (OLED) device by enabling a substrate and a plurality of masks to be efficiently received into a vacuum processing environment, transferred between one or more process chambers for the deposition of encapsulating layers, and removed from the processing system. A method of encapsulating an organic light-emitting diode (OLED) device includes positioning one or more masks over a substrate to deposit encapsulating layers on an OLED device disposed on the substrate. A processing system for encapsulating an organic light-emitting diode (OLED) device includes one or more transfer chambers, one or more load lock chambers coupled to each transfer chamber and operable to receive a mask into a vacuum environment, and one or more process chambers coupled to each transfer chamber and operable to deposit an encapsulating layer on a substrate.
    Type: Application
    Filed: June 18, 2012
    Publication date: June 19, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Shinichi Kurita, Beom Soo Kim
  • Patent number: 8733279
    Abstract: The present invention generally comprises a backing plate reinforcement apparatus for use in a plasma enhanced chemical vapor deposition apparatus. When processing large area substrates, the backing plate extending across the chamber may also be quite large. By supporting a central area of the backing plate with a frame structure, the backing plate may be maintained substantially planar. Alternatively, as necessary, the contour of the backing plate may be adjusted to suit the particular needs of the process.
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: May 27, 2014
    Assignee: Applied Materials, Inc.
    Inventors: John M. White, Shinichi Kurita, Robin L. Tiner
  • Publication number: 20140111074
    Abstract: An apparatus is provided that includes a chamber wall section prone to deflection, a stationary section providing a sealing surface, and a flexible bellows attached to the chamber wall section and the stationary section. A system is also provided that includes a chamber including a chamber wall having an opening, a door disposed to seal the opening, a sealing surface adjacent the opening and isolated from the chamber wall, and a seal between the sealing surface and the chamber wall. Numerous other aspects are provided.
    Type: Application
    Filed: January 2, 2014
    Publication date: April 24, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Billy C. Leung, David E. Berkstresser, Shinichi Kurita
  • Publication number: 20140072725
    Abstract: The present invention generally provides a load lock chamber having slit valve doors. The load lock chamber is used to connect a transfer chamber to a factory interface, or to connect two transfer chambers. When the load lock chamber is between adjacent transfer chambers, the load lock chamber has slit valve doors within the load lock chamber which seal against an inside surface of the load lock chamber. The load lock can thus be serviced at atmospheric pressure without breaking vacuum in the transfer chambers because the atmospheric pressure presses the doors against the inside surface. When the load lock chamber is between a transfer chamber and a factory interface, one slit valve door is disposed outside of the load lock chamber and seals against an outside surface of the load lock chamber. The atmospheric pressure from the factory interface side helps press the door against the outside surface.
    Type: Application
    Filed: August 30, 2013
    Publication date: March 13, 2014
    Inventor: Shinichi KURITA
  • Publication number: 20140043594
    Abstract: An illumination optical apparatus is arranged to illuminate a surface to be illuminated, with light in a desired polarization state, without substantive influence of manufacturing error of an optical member functioning as a wave plate. The illumination optical apparatus illuminates the surface to be illuminated on the basis of light from a light source. The illumination optical apparatus is provided with a polarization converting element disposed on or near an illumination pupil plane and adapted for converting a polarization state of incident light into a predetermined polarization state. The polarization converting element has a plurality of variable optical rotating members for variably yielding an angle of rotation to incident linearly polarized light. Each variable optical rotating member has two deviation prisms which are made of an optical material with an optical rotatory power and which are movable relative to each other along a direction intersecting with the optical axis.
    Type: Application
    Filed: September 5, 2013
    Publication date: February 13, 2014
    Applicant: NIKON CORPORATION
    Inventors: Osamu TANITSU, Hiroyuki HIROTA, Koji SHIGEMATSU, Shinichi KURITA
  • Patent number: 8648977
    Abstract: A method is provided that includes isolating a sealing surface from a chamber wall of a chamber and sealing the chamber between the sealing surface and the chamber wall. An apparatus is provided that includes a chamber wall section prone to deflection, a stationary section providing a sealing surface, and a flexible bellows attached to the chamber wall section and the stationary section. A system is also provided that includes a chamber including a chamber wall having an opening, a door disposed to seal the opening, a sealing surface adjacent the opening and isolated from the chamber wall, and a seal between the sealing surface and the chamber wall. Numerous other aspects are provided.
    Type: Grant
    Filed: August 1, 2005
    Date of Patent: February 11, 2014
    Assignee: Applied Materials, INC.
    Inventors: Billy C. Leung, David E. Berkstresser, Shinichi Kurita
  • Publication number: 20140023460
    Abstract: Embodiments disclosed herein generally relate to a slit valve door assembly for sealing an opening in a chamber. A slit valve door that is pressed against the chamber to seal the slit valve opening moves with the chamber as the slit valve opening shrinks so that an o-ring pressed between the slit valve door and the chamber may move with the slit valve door and the chamber. Thus, less rubbing of the o-ring against the chamber may occur. With less rubbing, fewer particles may be generated and the o-ring lifetime may be extended. With a longer lifetime for the o-ring, substrate throughput may be increased.
    Type: Application
    Filed: September 24, 2013
    Publication date: January 23, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Mehran BEHDJAT, Shinichi KURITA, John M. WHITE, Suhail ANWAR, Makoto INAGAWA
  • Patent number: 8616820
    Abstract: Provided herein is a double dual slot load lock chamber. The double dual slot load lock chamber includes two isolated load lock regions that are vertically stacked and share a common wall, wherein each isolated load lock region comprises two substrate slots.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: December 31, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Shinichi Kurita, Wendell T. Blonigan
  • Publication number: 20130327764
    Abstract: Embodiments disclosed herein relate to a large vacuum chamber body that has been welded together. The chamber body may have a high emissivity coating on at least one surface therein. Due to the large size of the chamber body, the chamber body may be formed by welding several pieces together rather than forging the body from a single piece of metal. The pieces may be welded together at a location spaced from the corner of the body, which may be under the greatest stress during evacuation, to ensure that the weld, which may be the weakest point in the body, does not fail. At least one surface of the chamber body may be coated with a high emissivity coating to aid in heat transfer from incoming, heated substrates. The high emissivity coating may increase substrate throughput by lowering the time that may be needed to reduce the substrate temperature.
    Type: Application
    Filed: August 14, 2013
    Publication date: December 12, 2013
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Shinichi KURITA, Mehran BEHDJAT, Makoto INAGAWA
  • Patent number: 8567756
    Abstract: Embodiments disclosed herein generally relate to a slit valve door assembly for sealing an opening in a chamber. A slit valve door that is pressed against the chamber to seal the slit valve opening moves with the chamber as the slit valve opening shrinks so that an o-ring pressed between the slit valve door and the chamber may move with the slit valve door and the chamber. Thus, less rubbing of the o-ring against the chamber may occur. With less rubbing, fewer particles may be generated and the o-ring lifetime may be extended. With a longer lifetime for the o-ring, substrate throughput may be increased.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: October 29, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Mehran Behdjat, Shinichi Kurita, John M. White, Suhail Anwar, Makoto Inagawa
  • Patent number: 8528762
    Abstract: Embodiments disclosed herein relate to a large vacuum chamber body that has been welded together. The chamber body may have a high emissivity coating on at least one surface therein. Due to the large size of the chamber body, the chamber body may be formed by welding several pieces together rather than forging the body from a single piece of metal. The pieces may be welded together at a location spaced from the corner of the body, which may be under the greatest stress during evacuation, to ensure that the weld, which may be the weakest point in the body, does not fail. At least one surface of the chamber body may be coated with a high emissivity coating to aid in heat transfer from incoming, heated substrates. The high emissivity coating may increase substrate throughput by lowering the time that may be needed to reduce the substrate temperature.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: September 10, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Shinichi Kurita, Mehran Behdjat, Makoto Inagawa
  • Publication number: 20130228124
    Abstract: Embodiments of the present invention generally relates to substrate supports for use in a plasma processing chamber. The substrate supports, which are metallic, have ceramic inserts to prevent arcing between the substrate support and the shadow frame used to protect the edges of the substrate support during processing. In large area substrate processing chambers, the shadow frame may comprise multiple pieces. The individual pieces may be coupled together, but spaced slightly apart by a gap to permit thermal expansion. Ceramic inserts are positioned on the substrate support so that when a shadow frame is positioned adjacent thereto, the ceramic inserts are located adjacent the gaps in the shadow frame. The ceramic inserts adjacent the gap prevent and/or reduce the arcing because the gaps are located over electrically insulating material rather than electrically conductive material.
    Type: Application
    Filed: February 21, 2013
    Publication date: September 5, 2013
    Inventors: Gaku FURUTA, John M. WHITE, Shinichi KURITA, Soo Young CHOI, Suhail ANWAR, Robin L. TINER
  • Patent number: 8327878
    Abstract: Methods and apparatus for grounding a chamber isolation valve for a processing system are provided. In one embodiment, a grounded chamber isolation valve for a plasma processing system is described. The chamber isolation valve includes a door and a bracing member movably attached to and opposing the door, and at least one electrically conductive member in electrical communication with the door, the at least one electrically conductive member comprising one or more reaction bumpers disposed on the bracing member that are adapted to contact at least one grounded component of the plasma processing system when the door is in the closed position.
    Type: Grant
    Filed: December 11, 2008
    Date of Patent: December 11, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Ke Ling Lee, Shinichi Kurita, Emanuel Beer
  • Patent number: D680946
    Type: Grant
    Filed: January 9, 2010
    Date of Patent: April 30, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Suhail Anwar, John M. White, Soo Young Choi, Gaku Furuta, Shinichi Kurita, Carl Sorenson, Robin L. Tiner
  • Patent number: D687535
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: August 6, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Makoto Inagawa, Shinichi Kurita
  • Patent number: D701329
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: March 18, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Robin L. Tiner, Shinichi Kurita
  • Patent number: D716098
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: October 28, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Gaku Furuta, John M. White, Robin L. Tiner, Suhail Anwar, Soo Young Choi, Shinichi Kurita