Abstract: A semiconductor memory device according to the present invention comprises a plurality of word lines constituted by gate wirings, a memory cell array having memory cells selectively arranged at nodes between the plurality of word lines and a plurality of bit lines, the memory cell array having a plurality of subarrays which are divided in a word line arrangement direction, a main row decoder arranged at least one end of the memory cell array in the word line arrangement direction, a plurality of sub-row decoders arranged at least one end of each of the plurality of subarrays, and a first wiring layer formed on a layer above the gate wirings and extending from the sub-row decoder, and the first wiring layer is wired to a position where the subarray is divided by two in the word line arrangement direction to be brought into contact with the gate wiring.

Abstract: A sense amplifier is connected between memory cell arrays, a re-writing register is arranged adjacent to the sense amplifier, first transfer gates are disposed between the sense amplifier and the memory cell arrays, second transfer gates are provided between bit lines of the memory cell arrays and global bit lines, and a gate control circuit for controlling the transfer gates is provided. When readout data is written into the register, the node of the sense amplifier is electrically separated from the bit lines and global bit lines.

Abstract: A dynamic semiconductor memory device according to the present invention comprises at least first and second memory cell arrays having a plurality of memory cells selectively arranged at respective intersections of a plurality of word lines and a plurality of bit lines, a first sense amplifier section connected at an end of the first cell array to a plurality of bit line pairs formed by part of the plurality of bit lines of the first cell array, the plurality of bit line pairs having a folded bit line configuration, a second sense amplifier section connected to sets of bit line pairs, each formed by one of the remaining bit lines of the first cell array and one of part of the plurality of bit lines of the second cell array, the plurality of bit line pairs having an open bit line configuration, and a correction circuit for correcting the level of ease for reading data "0" and that of reading data "1".

Abstract: In a semiconductor memory device wherein a plurality of memory cell units formed by connecting a plurality of memory cells in series are provided and each of the memory cell units is connected to a bit line, the semiconductor memory device comprises control circuit for directly reading data of a register cell during a reading operation when the previous row address designates the same memory cell as the present row address, and a data changing controlling circuit for changing data of an arbitrary memory cell of the memory cell unit to data of the memory cell closest to the bit line contact in the memory cell unit, and a row decoder for corresponding row addresses which select the memory of memory cell units, to the upper addresses than the parts of the row addresses which select a memory unit among the memory cell units.

Abstract: A plurality of memory cells are arranged at crosspoints between a plurality of word lines and a plurality of bit lines. The memory cells include not only normal cells but also spare cells for saving defects. The saving of the defect is effected by replacing the word line or bit line connected to the normal cell with the word line or bit line connected to the spare cell. The replacement is effected by a corresponding pair of fuse circuit and deciding circuit, that is, the fuse circuit for storing the address of a word line or bit line to be replaced and the deciding circuit for, based on the address, deciding whether or not an accessed word line or bit line be replaced. As such a pair use is made of a plurality of pairs and a plurality of kinds are provided as the word lines or bit lines for replacement and can be used in accordance with the size of defects. It is, therefore, possible to effectively save the defective word line or bit line, while avoiding any uneffective replacement.

Abstract: A sense amplifier is connected between memory cell arrays, a re-writing register is arranged in position adjacent to the sense amplifier, transfer gates are disposed between the sense amplifier and the memory cell arrays, transfer gates are provided between bit lines of the memory cell arrays and global bit lines, and a gate control circuit for controlling the transfer gates is provided. When readout data is written into the register, the node of the sense amplifier is electrically separated from the bit lines and global bit lines.

Abstract: A NAND type DRAM includes a plurality of NAND cells disposed on intersections between a plurality of word lines and a plurality of bit lines, a plurality of sense amplifiers each for sensing and amplifying the potential difference between two bit lines of each bit line pair among the plurality of bit lines, first switching sections for sequentially selecting those bit lines of the plurality of bit lines which are connected to the sense amplifier in a paired form, and second switching sections for sequentially changing the combination of a bit line pair constructed by bit lines selected by the first switching sections, and two bit lines disposed adjacent to and on both sides of a bit line to which the NAND cell is electrically connected are connected to the sense amplifier in a paired form by the first and second switching sections.

Abstract: A NAND-type dynamic semiconductor memory device having a folded bit architecture which reduces chip size and decreases array noise and soft error. The device is comprised of a plurality of memory cell groups, each group comprised of a plurality of bit memory cells connected in series, each bit memory cell having a MOS transistor and a capacitor. Two adjacent memory cell groups are connected respectively to one of a pair of bit lines. Each bit line is coupled respectively to a first one of the transistors located at the end of each memory cell group. A pair of first word lines are coupled respectively to the gates of the first one of the transistors coupled to the paired bit lines. A plurality of second word lines are each commonly coupled to the gates of corresponding ones of the transistors of the memory cell groups coupled to the paired bit lines.

Abstract: A semiconductor memory device includes a series of memory cells, a series of bit lines respectively connected to the memory cells, a series of sense amplifiers, connected to corresponding bit line groups including predetermined number of bit lines of the series of bit lines, for reading out data of memory cells connected to bit lines of the bit line group, the bit line groups including at least adjacent first and second bit line groups, at least first and second transistors allocated between the bit lines and the sense amplifiers and having gates, for selectively connecting the bit lines and the sense amplifiers, and a series of control signal lines commonly connected to the first transistors connected to the first bit line groups and the second transistors connected to the second bit line groups, such that the first transistors connected to the first bit line groups are regularly arranged in one direction, and second transistors connected to the second bit line groups adjacent to the first bit line groups ar