Abstract: A semiconductor memory device includes a parity generation circuit which generates a parity bit corresponding to a first number of data bits, a memory cell array including memory cells, and having first and second areas, the first area storing data, the second area storing the parity bit, a syndrome generation circuit which generates a syndrome bit for correcting an error in read data which are read from the first area, has the first number of data bits and corresponds to the parity bit read from the second area, based on the parity bit and the read data, and a parity correction circuit which corrects the parity bit generated by the parity generation circuit. The parity generation circuit generates the parity bit for data which includes input data and a part of the read data.

Abstract: A semiconductor memory device includes a memory cell including a ferroelectric capacitor and a cell transistor and storing binary data at a first potential level and a second potential level which is higher than the first potential level, a bit line which reads the binary data from the memory cell, a correction circuit which corrects an error of the binary data read from the memory cell via the bit line, and a setting circuit which sets to the first potential a potential of the bit line connected to the memory cell from which at least the binary data is read, after the binary data is transferred to the correction circuit. The device further includes a control circuit which controls the potential of the bit line connected to the memory cell from which the binary data is read, in accordance with a result of error correction of the binary data.

Abstract: A ferroelectric memory device includes a cell block, a bit line, and a plate line. The cell block includes a ferroelectric capacitor and a transistor switch. The bit line applies a voltage to one electrode of the ferroelectric capacitor. The plate line applies a voltage to the other electrode of the ferroelectric capacitor. In a read operation of data, a first voltage is applied to the plate line. In a write operation of data, a second voltage different from the first voltage is applied to the plate line, and a voltage which is higher or lower than the second voltage is applied to the bit line.

Abstract: According to the present invention, there is provided a semiconductor device comprising: a power supply circuit which receives an external power supply voltage supplied, and outputs an internal power supply voltage not higher than the external power supply voltage; a system module which receives the internal power supply voltage, and performs a predetermined operation; and a performance monitor circuit which measures a processing speed of said system module when the internal power supply voltage is applied, and, on the basis of the processing speed, outputs a first control signal which requests to set the external power supply voltage at a first level, and a second control signal which requests said power supply circuit to set the internal power supply voltage at a second level, wherein said power supply circuit outputs the internal power supply voltage having the second level on the basis of the second control signal applied thereto.

Abstract: A semiconductor memory device includes a cell block composed of several series-connected units having a ferroelectric capacitor and a cell transistor parallel-connected to the ferroelectric capacitor and a select transistor connected to an end of the cell block. Mutually separated first impurity diffusion layers are formed on the surface of the semiconductor substrate along a first direction, and have a first area. A second impurity diffusion layer is formed on the surface of the semiconductor substrate separated from the end first impurity diffusion layer, and has a second area. A first gate electrode is provided on the semiconductor substrate between the first impurity diffusion layers along a second direction. A second gate electrode is provided on the semiconductor substrate between the end first impurity diffusion layer and the second impurity diffusion layer along a second direction. A contact electrically connects a bit line and the second impurity diffusion layer.

Abstract: A semiconductor device includes an internal power supply, at least one semiconductor circuit block, a delay circuit, and a detecting circuit. The internal power supply outputs an initialization completion signal when initialized. The semiconductor circuit block operates on the basis of a voltage generated by the internal power supply. The delay circuit delays the initialization completion signal. The detecting circuit commands the semiconductor circuit block to start operations in response to the initialization completion signal delayed by the delay circuit and an externally input first input signal.

Abstract: A semiconductor device includes signal lines over which signals are transferred, and a drive circuit driving the signal lines in operating modes. The operating modes include a dynamic operation mode in which the signal lines are precharged, and a static operation mode in which the signal lines are not precharged.

Abstract: According to the present invention, there is provided a semiconductor integrated circuit comprising: a power controller which outputs a voltage select signal for selecting one of at least two types of voltages; a power supply voltage controller which generates and outputs a power supply voltage at an arbitrary voltage change rate on the basis of the voltage select signal; and a circuit portion which receives the power supply voltage and performs processing, wherein said circuit portion keeps operating while said power supply voltage controller is outputting the power supply voltage generated at the arbitrary voltage change rate.

Abstract: A ferromagnetic random access memory includes a first and second blocks. Each of the first and second blocks includes a switch transistor and memory cells connected in series between a first and second end. The memory cell includes a ferromagnetic capacitor and a cell transistor connected in parallel. A first plate line is connected to each of the first end of the first and second blocks. A first block selection transistor includes a current path one end of which is connected to the second end of the first block. A second block selection transistor includes a current path one end of which is connected to the second end of the second block. A first bit line is connected to each of another end of the current path in the first and second block selection transistors.

Abstract: A semiconductor device includes first, second, third and fourth resistor elements. The first to fourth resistor elements have first ends commonly connected to a first node, and operate in one of first and second operation modes which are switchable. The first and second resistor elements have second ends connected to a second node and a third node, respectively. The third and fourth resistor elements have second ends connected to a fourth node and a fifth node via a first switch and a second switch, respectively. The first and second switches are opened in the first operation mode, and are closed in the second operation mode.

Abstract: A semiconductor device includes signal lines over which signals are transferred, and a drive circuit driving the signal lines in operating modes. The operating modes include a dynamic operation mode in which the signal lines are precharged, and a static operation mode in which the signal lines are not precharged.

Abstract: A first inverter circuit comprises a first transistor in which one end of a current path is grounded, and a second transistor in which one end of a current path is connected to the other end of the current path of the first transistor. A first signal is supplied to gates of the first and second transistors. A third transistor is connected between the other end of the current path of the second transistor and a node to which a second voltage higher than the first voltage is supplied. A control signal constituted of one of the ground potential and the second voltage is supplied to a gate of the third transistor behind a change of a first signal. A second signal constituted of one of the ground potential and the second voltage is output from an output terminal of the first inverter circuit.

Abstract: A semiconductor device includes first, second, third and fourth resistor elements. The first to fourth resistor elements have first ends commonly connected to a first node, and operate in one of first and second operation modes which are switchable. The first and second resistor elements have second ends connected to a second node and a third node, respectively. The third and fourth resistor elements have second ends connected to a fourth node and a fifth node via a first switch and a second switch, respectively. The first and second switches are opened in the first operation mode, and are closed in the second operation mode.

Abstract: An integrated circuit device comprises a memory cell block, a word line selecting circuit and a driving circuit. The memory cell block comprises memory cells connected in series. The memory cell comprises a cell transistor including a gate which is connected to a word line, and a ferroelectric capacitor connected to terminals of the cell transistor. The word line selecting circuit successively selects the word lines connected to the cell transistors in the memory cells in the memory cell block in response to address signals successively input from an outside of the device, during an active cycle. The driving circuit applies a given voltage between ends of a current path provided of the cell transistors in the memory cells in the memory cell block, during a time period for which the word lines connected to the cell transistors are successively selected by the word line selecting circuit.

Abstract: A first logic circuit has its supply voltage controlled. A second logic circuit operates in response to an external clock signal. An adjustment circuit includes a first delay circuit supplied with the external clock signal, and a detection circuit which detects a skew between timing of a first clock signal output from the first logic circuit and a second clock signal output from the second logic circuit section. The adjustment circuit adjusts the delay time of the first delay circuit according to the result of the detection by the detection circuit and applies an output signal of the first delay circuit to the first logic circuit as a third clock signal.

Abstract: A ferroelectric memory device includes memory cells, a memory cell block, a sense amplifier, a precharge circuit, a bit line drive circuit, and a plate line drive circuit. Each of the memory cells has a cell transistor and a ferroelectric capacitor in between a source and drain of the cell transistor. The memory cell block includes the memory cells that are series connected between a bit line via a block select transistor and a plate line. The sense amplifier amplifies data read out from the memory cell, and generates one of a first potential and a second potential higher than the first potential in accordance with the read-out data. The precharge circuit precharges the bit line at a third potential that is higher than the first potential and lower than the second potential. The bit line drive circuit sets the bit line at a fourth potential.

Abstract: A ferromagnetic random access memory includes a first and second blocks. Each of the first and second blocks includes a switch transistor and memory cells connected in series between a first and second end. The memory cell includes a ferromagnetic capacitor and a cell transistor connected in parallel. A first plate line is connected to each of the first end of the first and second blocks. A first block selection transistor includes a current path one end of which is connected to the second end of the first block. A second block selection transistor includes a current path one end of which is connected to the second end of the second block. A first bit line is connected to each of another end of the current path in the first and second block selection transistors.

Abstract: A plurality of ferroelectric memory cells is arrayed. One terminal of each memory cells arrayed in the same column is connected in common to a first bit line. A gate of a transistor of memory cells arrayed in the same row is connected in common to a word line. The other terminal of each of memory cells arrayed in the same column or the same row is connected in common to a cell plate line. A second bit line is connected with a reference voltage supply circuit. The first and second bit lines are connected with a data read circuit. The data read circuit includes a sense amplifier and a current mirror circuit having a pair of current input node connected to the first and second bit lines, and carrying the same current flowing through one of the first and second bit line to the other bit line.

Abstract: A semiconductor memory device includes a first cell group having serial-connected memory cells. The memory cell includes a ferroelectric capacitor and a transistor which are connected in parallel. A first bit line is selectively electrically connected to one end of the first cell group. A second bit line is selectively electrically connected to the other end of the first cell group. A first power supply connection circuit selectively electrically connects a power supply line having a first potential to the second bit line. A sense amplifier has a first terminal electrically connected to the first bit line, generates one of first and second potentials onto the first terminal according to data stored in the memory cell and generates the other one of the first and second potentials onto a second terminal thereof. A first bit line connection circuit selectively electrically connects the second terminal to the second bit line.

Abstract: A semiconductor integrated circuit device includes first and second bit lines (BLs), first and second plate lines (PLs), a first series connected TC unit type structure connected between the first BL and the first PL, a second series connected TC unit type structure connected between the second BL and the second PL, a PL potential control circuit, and a BL potential control circuit. The PL potential control circuit controls a potential of the first PL from a first potential to a second potential and a potential of the second PL from the first potential to a third potential, when the first series connected TC unit type structure is selected. The BL potential control circuit controls a potential of the second BL to the third potential, after charges are transferred from the first series connected TC unit type structure to the first BL.