Abstract: A booster circuit includes a first booster unit having a first output terminal from which a boosted voltage is output. The first output terminal is connected to an external output terminal. A second booster unit has a second output terminal from which a boosted voltage is output. The second output terminal is connected to the external output terminal. A control circuit outputs a first control signal used to control the operation of the first booster unit and a second control signal used to control the operation of the second booster unit. Further, the control circuit controls the first and second control signals so that a transition between the operative state and the non-operative state of the first booster unit and a transition between the operative state and the non-operative state of the second booster unit will be made at different timings according to output voltage of the external output terminal.

Abstract: A semiconductor memory device includes a first cell group having serial-connected memory cells. The memory cell includes a ferroelectric capacitor and a transistor which are connected in parallel. A first bit line is selectively electrically connected to one end of the first cell group. A second bit line is selectively electrically connected to the other end of the first cell group. A first power supply connection circuit selectively electrically connects a power supply line having a first potential to the second bit line. A sense amplifier has a first terminal electrically connected to the first bit line, generates one of first and second potentials onto the first terminal according to data stored in the memory cell and generates the other one of the first and second potentials onto a second terminal thereof. A first bit line connection circuit selectively electrically connects the second terminal to the second bit line.

Abstract: A semiconductor memory device includes a cell block composed of several series-connected units having a ferroelectric capacitor and a cell transistor parallel-connected to the ferroelectric capacitor and a select transistor connected to an end of the cell block. Mutually separated first impurity diffusion layers are formed on the surface of the semiconductor substrate along a first direction, and have a first area. A second impurity diffusion layer is formed on the surface of the semiconductor substrate separated from the end first impurity diffusion layer, and has a second area. A first gate electrode is provided on the semiconductor substrate between the first impurity diffusion layers along a second direction. A second gate electrode is provided on the semiconductor substrate between the end first impurity diffusion layer and the second impurity diffusion layer along a second direction. A contact electrically connects a bit line and the second impurity diffusion layer.

Abstract: A semiconductor integrated circuit device includes connected TC unit type ferroelectric memory which includes series connected memory cells each having a cell transistor having a source terminal and a drain terminal and a ferroelectric capacitor inbetween the two terminals, a first power supply circuit which generates a first power supply potential supplied to the gate of the cell transistor when the cell transistor is in a standby state, and a second power supply circuit. The second power supply circuit generates a second power supply potential supplied to the source or drain of the cell transistor and starts operating following the start-up of the first power supply circuit after a power-on.

Abstract: A column select gate in a ferroelectric memory is constituted by only P-channel MOS transistors. While a column select signal is set to low level, and a data line is set to 0 V, data is read out from a memory cell to a bit line. A potential amplified and held by a sense amplifier is transferred to the data line through the current path of the column select gate formed from the P-channel MOS transistors.

Abstract: A semiconductor integrated circuit device includes a memory, /CE transition detector, address transition detector, /WE transition detector and controller. The controller includes a timeout circuit. The timeout circuit generates an internal circuit control signal with preset width to control access to the memory based on detection results of the above transition detectors. The operation of the memory is controlled by the timeout circuit at the read time. The operation of the memory is controlled by the timeout circuit when transition of the end of a /WE signal is detected by the /WE transition detector before a timing specified by the timeout circuit at the write time. Further, the operation of the memory is controlled in response to the transition of the /WE signal when the transition of the end of the /WE signal is detected by the /WE transition detector after passage of the above timing.

Abstract: A semiconductor integrated circuit device includes connected TC unit type ferroelectric memory which includes series connected memory cells each having a cell transistor having a source terminal and a drain terminal and a ferroelectric capacitor inbetween the two terminals, a first power supply circuit which generates a first power supply potential supplied to the gate of the cell transistor when the cell transistor is in a standby state, and a second power supply circuit. The second power supply circuit generates a second power supply potential supplied to the source or drain of the cell transistor and starts operating following the start-up of the first power supply circuit after a power-on.

Abstract: A semiconductor integrated circuit device includes first and second bit lines (BLs), first and second plate lines (PLs), a first series connected TC unit type structure connected between the first BL and the first PL, a second series connected TC unit type structure connected between the second BL and the second PL, a PL potential control circuit, and a BL potential control circuit. The PL potential control circuit controls a potential of the first PL from a first potential to a second potential and a potential of the second PL from the first potential to a third potential, when the first series connected TC unit type structure is selected. The BL potential control circuit controls a potential of the second BL to the third potential, after charges are transferred from the first series connected TC unit type structure to the first BL.

Abstract: A semiconductor integrated circuit device includes connected TC unit type ferroelectric memory which includes series connected memory cells each having a cell transistor having a source terminal and a drain terminal and a ferroelectric capacitor inbetween the two terminals, a first power supply circuit which generates a first power supply potential supplied to the gate of the cell transistor when the cell transistor is in a standby state, and a second power supply circuit. The second power supply circuit generates a second power supply potential supplied to the source or drain of the cell transistor and starts operating following the start-up of the first power supply circuit after a power-on.

Abstract: A semiconductor integrated circuit device includes connected TC unit type ferroelectric memory which includes series connected memory cells each having a cell transistor having a source terminal and a drain terminal and a ferroelectric capacitor inbetween the two terminals, a first power supply circuit which generates a first power supply potential supplied to the gate of the cell transistor when the cell transistor is in a standby state, and a second power supply circuit. The second power supply circuit generates a second power supply potential supplied to the source or drain of the cell transistor and starts operating following the start-up of the first power supply circuit after a power-on.

Abstract: A column select gate in a ferroelectric memory is constituted by only P-channel MOS transistors. While a column select signal is set to low level, and a data line is set to 0 V, data is read out from a memory cell to a bit line. A potential amplified and held by a sense amplifier is transferred to the data line through the current path of the column select gate formed from the P-channel MOS transistors.

Abstract: A semiconductor integrated circuit device includes a memory array, address buffer, address decoder, and controller. The memory array includes a memory cell array in which destructive read-out memory cells are integrated. The address buffer outputs an internal address signal corresponding to an input external address signal. The address decoder decodes the internal address signal and outputs a memory cell selection signal on the basis of the decode result. The controller parallel-executes wait processing of keeping the address buffer in a wait state until the lapse of a skew time after transition of the external address signal is detected, and decode processing until the memory cell selection signal changes from an invalid state to a valid state in response to output of the internal address signal.

Abstract: A semiconductor device includes first, second, third and fourth resistor elements. The first to fourth resistor elements have first ends commonly connected to a first node, and operate in one of first and second operation modes which are switchable. The first and second resistor elements have second ends connected to a second node and a third node, respectively. The third and fourth resistor elements have second ends connected to a fourth node and a fifth node via a first switch and a second switch, respectively. The first and second switches are opened in the first operation mode, and are closed in the second operation mode.

Abstract: A ferroelectric memory device includes memory cells, a memory cell block, a sense amplifier, a precharge circuit, a bit line drive circuit, and a plate line drive circuit. Each of the memory cells has a cell transistor and a ferroelectric capacitor in between a source and drain of the cell transistor. The memory cell block includes the memory cells that are series connected between a bit line via a block select transistor and a plate line. The sense amplifier amplifies data read out from the memory cell, and generates one of a first potential and a second potential higher than the first potential in accordance with the read-out data. The precharge circuit precharges the bit line at a third potential that is higher than the first potential and lower than the second potential. The bit line drive circuit sets the bit line at a fourth potential.

Abstract: A semiconductor device includes an internal power supply, at least one semiconductor circuit block, a delay circuit, and a detecting circuit. The internal power supply outputs an initialization completion signal when initialized. The semiconductor circuit block operates on the basis of a voltage generated by the internal power supply. The delay circuit delays the initialization completion signal. The detecting circuit commands the semiconductor circuit block to start operations in response to the initialization completion signal delayed by the delay circuit and an externally input first input signal.

Abstract: A voltage generator circuit generates a voltage supplied to an internal circuit. The voltage generator circuit includes first, second, and third switching elements each having first and second terminals. The first terminal of each of the switching elements is connected to the power source terminal supplied with a power source voltage. First, second, and third transistors each have a current path which has first and second ends. The first ends of the first, second, and third transistors are respectively connected to the second terminals of the first, second, and third switching elements. The first, second, and third transistors have respectively first, second, and third driving capabilities. The first, second, and third driving capabilities are different from each other. The second ends of the current paths of the first, second, and third transistors are connected to an output terminal which outputs the voltage supplied to the internal circuit.

Abstract: A power supply circuit includes a transistor, a variable resistance circuit, a second resistance, and an operational amplifier. The variable resistance circuit includes a plurality of first resistances. The plurality of first resistances are selected in response to control signals. The selected first resistances are connected in series with the transistor, the unselected first resistances are connected to a ground voltage. The second resistance is connected between the variable resistance circuit and the ground voltage. The operational amplifier compares a voltage of the one end of the variable resistance circuit with a reference voltage and feeds a signal indicating a comparison result back to the gate of the transistor.

Abstract: A semiconductor integrated circuit device includes a memory array, address buffer, address decoder, and controller. The memory array includes a memory cell array in which destructive read-out memory cells are integrated. The address buffer outputs an internal address signal corresponding to an input external address signal. The address decoder decodes the internal address signal and outputs a memory cell selection signal on the basis of the decode result. The controller parallel-executes wait processing of keeping the address buffer in a wait state until the lapse of a skew time after transition of the external address signal is detected, and decode processing until the memory cell selection signal changes from an invalid state to a valid state in response to output of the internal address signal.

Abstract: A semiconductor integrated circuit device includes a memory, /CE transition detector, address transition detector, /WE transition detector and controller. The controller includes a timeout circuit. The timeout circuit generates an internal circuit control signal with preset width to control access to the memory based on detection results of the above transition detectors. The operation of the memory is controlled by the timeout circuit at the read time. The operation of the memory is controlled by the timeout circuit when transition of the end of a /WE signal is detected by the /WE transition detector before a timing specified by the timeout circuit at the write time. Further, the operation of the memory is controlled in response to the transition of the /WE signal when the transition of the end of the /WE signal is detected by the /WE transition detector after passage of the above timing.

Abstract: A voltage generator circuit generates a voltage supplied to an internal circuit. The voltage generator circuit includes first, second, and third switching elements each having first and second terminals. The first terminal of each of the switching elements is connected to the power source terminal supplied with a power source voltage. First, second, and third transistors each have a current path which has first and second ends. The first ends of the first, second, and third transistors are respectively connected to the second terminals of the first, second, and third switching elements. The first, second, and third transistors have respectively first, second, and third driving capabilities. The first, second, and third driving capabilities are different from each other. The second ends of the current paths of the first, second, and third transistors are connected to an output terminal which outputs the voltage supplied to the internal circuit.